JP6822610B2 - 硬化性樹脂組成物、硬化物、酸変性マレイミド樹脂および硬化剤 - Google Patents

硬化性樹脂組成物、硬化物、酸変性マレイミド樹脂および硬化剤 Download PDF

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JP6822610B2
JP6822610B2 JP2020520093A JP2020520093A JP6822610B2 JP 6822610 B2 JP6822610 B2 JP 6822610B2 JP 2020520093 A JP2020520093 A JP 2020520093A JP 2020520093 A JP2020520093 A JP 2020520093A JP 6822610 B2 JP6822610 B2 JP 6822610B2
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group
curable resin
acid
resin composition
composition according
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Japanese (ja)
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JPWO2020166212A1 (ja
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雅樹 迫
雅樹 迫
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DIC Corp
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DIC Corp
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4042—Imines; Imides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Epoxy Resins (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP2020520093A 2019-02-14 2019-12-24 硬化性樹脂組成物、硬化物、酸変性マレイミド樹脂および硬化剤 Active JP6822610B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019024495 2019-02-14
JP2019024495 2019-02-14
PCT/JP2019/050507 WO2020166212A1 (ja) 2019-02-14 2019-12-24 硬化性樹脂組成物、硬化物、酸変性マレイミド樹脂および硬化剤

Publications (2)

Publication Number Publication Date
JP6822610B2 true JP6822610B2 (ja) 2021-01-27
JPWO2020166212A1 JPWO2020166212A1 (ja) 2021-02-18

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JP2020520093A Active JP6822610B2 (ja) 2019-02-14 2019-12-24 硬化性樹脂組成物、硬化物、酸変性マレイミド樹脂および硬化剤

Country Status (5)

Country Link
JP (1) JP6822610B2 (ko)
KR (1) KR102570940B1 (ko)
CN (1) CN113423754B (ko)
TW (1) TW202104335A (ko)
WO (1) WO2020166212A1 (ko)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH407097A (de) * 1960-12-16 1966-02-15 Ciba Geigy Verfahren zur Herstellung neuer Dicarbonsäureanhydride
US4666997A (en) * 1984-09-14 1987-05-19 Ciba-Geigy Corporation Heat-curable mixture containing substituted bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide and polymaleimide, and the use thereof
DE3872596D1 (de) * 1987-05-22 1992-08-13 Ciba Geigy Ag Ungesaettigte bisimide und deren polymeren.
US5728501A (en) * 1995-10-17 1998-03-17 Sanyo Chemical Industries, Ltd. Charge controller, toner binder composition and electrophotographic toner
JP4087602B2 (ja) * 2001-12-14 2008-05-21 横浜ゴム株式会社 硬化性化合物およびそれを含む硬化性樹脂組成物
JP4735410B2 (ja) 2006-05-15 2011-07-27 日立化成工業株式会社 硬化剤の製造法，及びこれを用いた熱硬化性樹脂組成物
JP2009079189A (ja) * 2007-09-27 2009-04-16 Kansai Paint Co Ltd 熱硬化性組成物
JP5521939B2 (ja) * 2010-09-22 2014-06-18 住友ベークライト株式会社 感光性樹脂組成物、硬化膜、保護膜、絶縁膜、およびそれを用いた半導体装置、表示体装置
JP5728998B2 (ja) 2011-02-16 2015-06-03 日立化成株式会社 配線板用絶縁樹脂材料、多層配線板及び多層配線板の製造方法
EP2711397A4 (en) * 2011-05-11 2015-02-18 Mitsubishi Rayon Co By active energy irradiation hardenable composition, lamina and method for producing the lamina
US10066053B2 (en) * 2014-12-19 2018-09-04 Dsm Ip Assets B.V. Alkyd resin compositions
EP3290479A4 (en) * 2015-04-30 2018-09-19 Hitachi Chemical Co., Ltd. Thermosetting resin composition, prepreg, laminate and multilayer printed wiring board

Also Published As

Publication number Publication date
CN113423754B (zh) 2023-09-19
WO2020166212A1 (ja) 2020-08-20
JPWO2020166212A1 (ja) 2021-02-18
KR102570940B1 (ko) 2023-08-28
KR20210102368A (ko) 2021-08-19
CN113423754A (zh) 2021-09-21
TW202104335A (zh) 2021-02-01

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