TW202104335A - 硬化性樹脂組成物、硬化物、酸改性馬來醯亞胺樹脂及硬化劑 - Google Patents
硬化性樹脂組成物、硬化物、酸改性馬來醯亞胺樹脂及硬化劑 Download PDFInfo
- Publication number
- TW202104335A TW202104335A TW109103820A TW109103820A TW202104335A TW 202104335 A TW202104335 A TW 202104335A TW 109103820 A TW109103820 A TW 109103820A TW 109103820 A TW109103820 A TW 109103820A TW 202104335 A TW202104335 A TW 202104335A
- Authority
- TW
- Taiwan
- Prior art keywords
- curable resin
- acid
- resin composition
- aliphatic hydrocarbon
- modified maleimide
- Prior art date
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4042—Imines; Imides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Materials For Photolithography (AREA)
- Epoxy Resins (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019-024495 | 2019-02-14 | ||
JP2019024495 | 2019-02-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW202104335A true TW202104335A (zh) | 2021-02-01 |
Family
ID=72044657
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW109103820A TW202104335A (zh) | 2019-02-14 | 2020-02-07 | 硬化性樹脂組成物、硬化物、酸改性馬來醯亞胺樹脂及硬化劑 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6822610B2 (ko) |
KR (1) | KR102570940B1 (ko) |
CN (1) | CN113423754B (ko) |
TW (1) | TW202104335A (ko) |
WO (1) | WO2020166212A1 (ko) |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH407097A (de) * | 1960-12-16 | 1966-02-15 | Ciba Geigy | Verfahren zur Herstellung neuer Dicarbonsäureanhydride |
US4666997A (en) * | 1984-09-14 | 1987-05-19 | Ciba-Geigy Corporation | Heat-curable mixture containing substituted bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide and polymaleimide, and the use thereof |
DE3872596D1 (de) * | 1987-05-22 | 1992-08-13 | Ciba Geigy Ag | Ungesaettigte bisimide und deren polymeren. |
US5728501A (en) * | 1995-10-17 | 1998-03-17 | Sanyo Chemical Industries, Ltd. | Charge controller, toner binder composition and electrophotographic toner |
JP4087602B2 (ja) * | 2001-12-14 | 2008-05-21 | 横浜ゴム株式会社 | 硬化性化合物およびそれを含む硬化性樹脂組成物 |
JP4735410B2 (ja) | 2006-05-15 | 2011-07-27 | 日立化成工業株式会社 | 硬化剤の製造法,及びこれを用いた熱硬化性樹脂組成物 |
JP2009079189A (ja) * | 2007-09-27 | 2009-04-16 | Kansai Paint Co Ltd | 熱硬化性組成物 |
JP5521939B2 (ja) * | 2010-09-22 | 2014-06-18 | 住友ベークライト株式会社 | 感光性樹脂組成物、硬化膜、保護膜、絶縁膜、およびそれを用いた半導体装置、表示体装置 |
JP5728998B2 (ja) | 2011-02-16 | 2015-06-03 | 日立化成株式会社 | 配線板用絶縁樹脂材料、多層配線板及び多層配線板の製造方法 |
CN103517951A (zh) * | 2011-05-11 | 2014-01-15 | 三菱丽阳株式会社 | 活性能量射线固化性组合物、层积体和层积体的制造方法 |
WO2016097403A1 (en) * | 2014-12-19 | 2016-06-23 | Dsm Ip Assets B.V. | Polyfunctional hydrophthalimide monomer compounds |
JP6705446B2 (ja) * | 2015-04-30 | 2020-06-03 | 日立化成株式会社 | 熱硬化性樹脂組成物、プリプレグ、積層板及び多層プリント配線板 |
-
2019
- 2019-12-24 JP JP2020520093A patent/JP6822610B2/ja active Active
- 2019-12-24 CN CN201980091842.3A patent/CN113423754B/zh active Active
- 2019-12-24 KR KR1020217021616A patent/KR102570940B1/ko active IP Right Grant
- 2019-12-24 WO PCT/JP2019/050507 patent/WO2020166212A1/ja active Application Filing
-
2020
- 2020-02-07 TW TW109103820A patent/TW202104335A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
JP6822610B2 (ja) | 2021-01-27 |
CN113423754A (zh) | 2021-09-21 |
KR102570940B1 (ko) | 2023-08-28 |
CN113423754B (zh) | 2023-09-19 |
WO2020166212A1 (ja) | 2020-08-20 |
JPWO2020166212A1 (ja) | 2021-02-18 |
KR20210102368A (ko) | 2021-08-19 |
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