JP6818649B2 - 半導体装置及び半導体素子 - Google Patents
半導体装置及び半導体素子 Download PDFInfo
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- JP6818649B2 JP6818649B2 JP2017143553A JP2017143553A JP6818649B2 JP 6818649 B2 JP6818649 B2 JP 6818649B2 JP 2017143553 A JP2017143553 A JP 2017143553A JP 2017143553 A JP2017143553 A JP 2017143553A JP 6818649 B2 JP6818649 B2 JP 6818649B2
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Description
図面は模式的または概念的なものであり、各部分の厚みと幅との関係、部分間の大きさの比率などは、必ずしも現実のものと同一とは限らない。同じ部分を表す場合であっても、図面により互いの寸法や比率が異なって表される場合もある。
本願明細書と各図において、既出の図に関して前述したものと同様の要素には同一の符号を付して詳細な説明は適宜省略する。
図1は、第1実施形態に係る半導体装置を例示する模式平面図である。図2は、図1中のII−II線に沿う模式断面図である。図3は、図2中の枠III内を拡大して示す模式断面図である。図4は、第1半導体素子を拡大して示す模式断面図である。
(2) 絶縁封止部材41に使用される絶縁性ゲルの使用量を削減できる
(3) 半導体装置100aの製造におけるスループットを向上できる
したがって、半導体装置100aによれば、製造コストの削減にも有利である。
図6(a)は、第2実施形態に係る半導体装置が備えた半導体素子112を例示する模式平面図である。図6(b)は、図6(a)中のB−B線に沿う模式断面図である。図7(a)及び図7(b)は、第2実施形態に係る半導体装置が備えた半導体素子112の製造方法を例示する模式断面図である。図8は、第2実施形態に係る半導体装置が備えた半導体素子112を例示する模式断面図である。図9は、第2実施形態に係る半導体装置100bを例示する模式断面図である。
・Z軸方向において、第1素子絶縁部21を、第3引き出し電極9cと第2引き出し電極9bとの間に位置させること
これにより、半導体素子112の機械的強度は、例えば、第1、第2半導体素子11及び12よりも高めることができる。
図10(a)は、第3実施形態に係る半導体装置が備えた半導体素子113を例示する模式的平面図である。図10(b)は、図10(a)中のB−B線に沿う模式的断面図である。図11(a)は、第3実施形態に係る半導体装置が備えた半導体素子113を例示する模式的平面図である。図11(b)は、図11(a)中のB−B線に沿う模式的断面図である。なお、図10(a)及び図10(b)はテスト時における半導体素子113を示し、図11(a)及び図11(b)はテスト後における半導体素子113を示す。
図12(a)は、第4実施形態に係る半導体装置が備えた半導体素子114を例示する模式的平面図である。図12(b)は、図12(a)中のB−B線に沿う模式的断面図である。
図13は、第5実施形態に係る半導体装置を例示する模式平面図である。
図13に示すように、第5実施形態に係る半導体装置100eの配線基板7は、第1〜第3基板電極71a〜71cを有する。第5実施形態において、第1基板電極71aは、第1、第6配線部材61a及び61fを介して、それぞれ、第1、第4チップ電極11a及び12dと電気的に接続されている。第2基板電極71bは、第1、第3接合部材75a及び75cを介して(図13には図示せず)、それぞれ、第2、第5チップ電極11b及び12e(図13には図示せず)と電気的に接続されている。第3基板電極71cは、第2、第7配線部材61b及び61gを介して、それぞれ、第3、第6チップ電極11c及び12fと電気的に接続されている。
図14は、第6実施形態に係る半導体装置を例示する模式平面図である。
図14に示すように、第6実施形態に係る半導体装置100fは、第5実施形態の半導体装置100eの第1、第2半導体素子11及び12を、第4実施形態で説明した半導体素子114とした例である。
図15は、第7実施形態に係る半導体装置を例示する模式平面図である。
図15に示すように、第7実施形態に係る半導体装置100gは、例えば、第5実施形態に比較して、第3、第4半導体素子13及び14を、さらに備えている。
図16には、第1〜第8半導体素子11〜18が示されている。第1〜第3基板電極71a(51a)〜71c(51c)のそれぞれを、第1〜第8半導体素子11〜18で共通とした場合、例えば、第1〜第8半導体素子11〜18は、1行(Row)8列(Column)で配置され、1つの方向に長い、例えば、X軸方向に長い半導体装置となる。
図17は、第8実施形態に係る半導体装置を例示する模式平面図である。
図17に示すように、第8実施形態に係る半導体装置100hは、第7実施形態の半導体装置100gは、第9、第10半導体素子114a及び114bを含む。第9半導体素子114aは、例えば、第4実施形態のように、第1、第2半導体チップC1及びC2を含む。第10半導体素子114bも、例えば、第4実施形態のように、第3、第4半導体チップC3及びC4を含む。
その他、本発明の実施形態として上述した半導体装置を基にして、当業者が適宜設計変更して実施し得る全ての半導体装置も、本発明の要旨を包含する限り、本発明の範囲に属する。
その他、本発明の思想の範疇において、当業者であれば、各種の変更例、及び、修正例に想到し得るものであり、それら変更例、及び、修正例についても本発明の範囲に属するものと了解される。
Claims (7)
- 第1半導体チップと、前記第1半導体チップと電気的に接続された第1チップ電極と、を含む第1半導体素子であって、
前記第1半導体チップは第1方向と交差する第1面と、前記第1方向と交差し前記第1面と離れた第2面と、前記第1面と前記第2面との間に位置した第3面と、を有し、前記第1面に前記第1チップ電極が配置された第1半導体素子と、
第1部分と、前記第1部分と連続した第2部分と、前記第1部分と連続した第5部分と、を有する第1素子絶縁部と、
第3部分と、前記第3部分と連続した第4部分と、を有する絶縁封止部材であって、
前記第1部分は、前記第1面と前記第3部分との間に位置し、前記第2部分は、前記第3面と前記第4部分との間に位置した、絶縁封止部材と、
前記第1チップ電極と電気的に接続された第1引き出し電極と、
を備え、
前記第1チップ電極は、前記第1半導体チップと前記第1引き出し電極との間に位置し、
前記第5部分は、前記第1引き出し電極の前記第1面と交差する方向に沿った面と接した、半導体装置。 - 絶縁基板部と、第1基板電極と、第2基板電極と、を含む配線基板と、
基体部と、第1外部端子を有する絶縁部と、を含むケース部材と、
をさらに備え、
前記第1半導体チップは、前記第1半導体チップと電気的に接続された第2チップ電極を、さらに含み、
前記第2チップ電極は、前記第2面に配置され、
前記第1基板電極は、前記第1チップ電極及び前記第1外部端子のそれぞれと電気的に接続され、前記絶縁封止部材と前記絶縁基板部との間に位置し、
前記第2基板電極は、前記第2チップ電極と電気的に接続され、前記第2チップ電極と前記絶縁基板部との間に位置した、請求項1記載の半導体装置。 - 前記第2チップ電極と電気的に接続された第2引き出し電極と、
をさらに備え、
前記第2チップ電極は、前記第1半導体チップと前記第2引き出し電極との間に位置した、請求項2記載の半導体装置。 - 前記第1引き出し電極の前記第1方向の厚さは、前記第1チップ電極の前記第1方向の厚さよりも厚く、
前記第2引き出し電極の前記第1方向の厚さは、前記第2チップ電極の前記第1方向の厚さよりも厚い、請求項3記載の半導体装置。 - 前記第1引き出し電極の前記第1方向に交差する第2方向の長さは、前記第1チップ電極の前記第2方向の長さよりも長く、
前記第2引き出し電極の前記第2方向の長さは、前記第2チップ電極の前記第2方向の長さよりも長い、請求項3又は4に記載の半導体装置。 - 第2半導体チップと、前記第2半導体チップと電気的に接続された第4チップ電極及び第5チップ電極と、を含む第2半導体素子であって、
前記第2半導体チップは前記第1方向と交差する第7面と、前記第1方向と交差し前記第7面と離れた第8面と、前記第7面及び前記第8面との間に位置した第9面と、を有し、前記第7面に前記第4チップ電極が配置され、前記第8面に前記第5チップ電極が配置された第2半導体素子、
を、さらに備え、
前記第1引き出し電極は、前記第4チップ電極と電気的に接続され、
前記第2引き出し電極は、前記第5チップ電極と電気的に接続され、
前記第4チップ電極は、前記第2半導体チップと前記第1引き出し電極との間に位置し、
前記第5チップ電極は、前記第2半導体チップと前記第2引き出し電極との間に位置し、
前記第1素子絶縁部は、
前記第7面と前記第1引き出し電極との間に位置した第6部分と、
前記第9面に沿って前記第6部分と連続した第7部分と、
前記第6部分と連続し、前記第1引き出し電極の前記第7面と交差する方向に沿った面と接した第8部分と、
を、さらに有する、請求項3〜5のいずれか1つに記載の半導体装置。 - 第1方向と交差する第1面と、前記第1方向と交差し前記第1面と離れた第2面と、前記第1面と前記第2面との間に位置した第3面と、を有する第1半導体チップと、
前記第1方向と交差する第7面と、前記第1方向と交差し前記第7面と離れた第8面と、前記第7面と前記第8面との間に位置した第9面と、を有する第2半導体チップと、
前記第1面と交差する方向に沿った面と、前記第7面と交差する方向に沿った面と、を含む第1引き出し電極と、
第2引き出し電極と、
前記第1面に配置され、前記第1面と前記第1引き出し電極との間に位置し、前記第1半導体チップ及び前記第1引き出し電極と電気的に接続された第1チップ電極と、
前記第7面に配置され、前記第7面と前記第1引き出し電極との間に位置し、前記第2半導体チップ及び前記第1引き出し電極と電気的に接続された第4チップ電極と、
前記第2面に配置され、前記第2面と前記第2引き出し電極との間に位置し、前記第1半導体チップ及び前記第2引き出し電極と電気的に接続された第2チップ電極と、
前記第8面に配置され、前記第8面と前記第2引き出し電極との間に位置し、前記第2半導体チップ及び前記第2引き出し電極と電気的に接続された第5チップ電極と、
第1部分、第2部分、第5部分、第6部分、第7部分及び第8部分を有する第1素子絶縁部であって、
前記第1部分は、前記第1面と前記第1引き出し電極との間に位置し、
前記第2部分は、前記第3面に沿って前記第1部分と連続し、
前記第5部分は、前記第1部分と連続し、前記第1引き出し電極の前記第1面と交差する方向に沿った面と接し、
前記第6部分は、前記第7面と前記第1引き出し電極との間に位置し、
前記第7部分は、前記第9面に沿って前記第6部分と連続し、
前記第8部分は、前記第6部分と連続し、前記第1引き出し電極の前記第7面と交差する方向に沿った面と接した、第1素子絶縁部と、
を備えた、半導体素子。
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