JP6811777B2 - 基板の静電荷を測定する方法および装置 - Google Patents

基板の静電荷を測定する方法および装置 Download PDF

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JP6811777B2
JP6811777B2 JP2018528345A JP2018528345A JP6811777B2 JP 6811777 B2 JP6811777 B2 JP 6811777B2 JP 2018528345 A JP2018528345 A JP 2018528345A JP 2018528345 A JP2018528345 A JP 2018528345A JP 6811777 B2 JP6811777 B2 JP 6811777B2
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substrate
component
contact
voltage
roller
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Japanese (ja)
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JP2019500748A (ja
JP2019500748A5 (enExample
Inventor
ピアース アグネロ,ガブリエル
ピアース アグネロ,ガブリエル
ノウルズ,ピーター
ロバート ウスタニク,コリー
ロバート ウスタニク,コリー
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Corning Inc
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Corning Inc
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R29/00Arrangements for measuring or indicating electric quantities not covered by groups G01R19/00 - G01R27/00
    • G01R29/24Arrangements for measuring quantities of charge
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R15/00Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
    • G01R15/14Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
    • G01R15/16Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using capacitive devices
    • G01R15/165Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using capacitive devices measuring electrostatic potential, e.g. with electrostatic voltmeters or electrometers, when the design of the sensor is essential
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Measurement Of Resistance Or Impedance (AREA)
  • Other Investigation Or Analysis Of Materials By Electrical Means (AREA)
JP2018528345A 2015-12-03 2016-11-30 基板の静電荷を測定する方法および装置 Expired - Fee Related JP6811777B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201562262638P 2015-12-03 2015-12-03
US62/262,638 2015-12-03
PCT/US2016/064100 WO2017095857A1 (en) 2015-12-03 2016-11-30 Method and apparatus for measuring electrostatic charge of a substrate

Publications (3)

Publication Number Publication Date
JP2019500748A JP2019500748A (ja) 2019-01-10
JP2019500748A5 JP2019500748A5 (enExample) 2019-11-28
JP6811777B2 true JP6811777B2 (ja) 2021-01-13

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JP2018528345A Expired - Fee Related JP6811777B2 (ja) 2015-12-03 2016-11-30 基板の静電荷を測定する方法および装置

Country Status (6)

Country Link
US (1) US10739394B2 (enExample)
JP (1) JP6811777B2 (enExample)
KR (1) KR20180081630A (enExample)
CN (1) CN108291931B (enExample)
TW (1) TWI712803B (enExample)
WO (1) WO2017095857A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021034820A1 (en) * 2019-08-20 2021-02-25 Ascend Performance Materials Operations Llc Method for measuring static attraction propensity
US11881424B2 (en) * 2022-03-10 2024-01-23 Intel Corporation Electrostatic charge measurement tool

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JP2001013185A (ja) * 1999-06-29 2001-01-19 Hugle Electronics Inc 帯電分布測定装置
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JP4439994B2 (ja) * 2003-05-14 2010-03-24 キヤノン株式会社 画像形成装置及びカートリッジ、カートリッジに搭載される記憶装置
JP2005173305A (ja) * 2003-12-12 2005-06-30 Konica Minolta Business Technologies Inc 画像形成装置及び画像形成方法
JP4434799B2 (ja) * 2004-03-23 2010-03-17 キヤノン株式会社 画像形成装置
JP2007003879A (ja) * 2005-06-24 2007-01-11 Dainippon Screen Mfg Co Ltd 画像形成装置および画像形成方法
JP2007180074A (ja) * 2005-12-27 2007-07-12 Olympus Corp 静電気検出装置および基板検査装置
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JP5535670B2 (ja) * 2010-01-28 2014-07-02 富士フイルム株式会社 放射線画像検出器の製造方法
US8676071B2 (en) * 2011-01-18 2014-03-18 Xerox Corporation Interdocument photoreceptor signal sensing and feedback control of paper edge ghosting
JP2014514454A (ja) * 2011-04-27 2014-06-19 ダウ コーニング フランス 基板のプラズマ処理
WO2013056735A1 (en) 2011-10-19 2013-04-25 Applied Materials, Inc. Roll to roll tester and method of testing flexible substrates roll to roll
JP6106974B2 (ja) * 2011-11-14 2017-04-05 株式会社リコー 転写装置及び画像形成装置
EP2801835B1 (en) 2011-12-26 2019-07-24 The University of Tokyo Measurement method and measurement device
CN102608440B (zh) 2012-03-12 2014-05-07 南京航空航天大学 一种静电传感实验系统及颗粒摩擦带电量的测量方法
KR101923261B1 (ko) * 2012-07-02 2018-11-28 코닝 인코포레이티드 유리 기판의 가공 방법 및 유리 장치
JP2014016178A (ja) 2012-07-06 2014-01-30 Canon Inc 帯電量測定方法及び測定装置
CN102879658B (zh) 2012-09-20 2015-04-22 兰州大学 一种球盘式摩擦电测量装置
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CN103513119B (zh) * 2013-10-18 2016-08-17 河北大学 静电分选机转辊表面电荷密度分布的测量方法及测量装置

Also Published As

Publication number Publication date
CN108291931B (zh) 2020-08-07
JP2019500748A (ja) 2019-01-10
US10739394B2 (en) 2020-08-11
TWI712803B (zh) 2020-12-11
KR20180081630A (ko) 2018-07-16
TW201730568A (zh) 2017-09-01
WO2017095857A1 (en) 2017-06-08
US20180356452A1 (en) 2018-12-13
CN108291931A (zh) 2018-07-17

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