TWI712803B - 用於測量基板的靜電荷的方法及設備 - Google Patents

用於測量基板的靜電荷的方法及設備 Download PDF

Info

Publication number
TWI712803B
TWI712803B TW105139391A TW105139391A TWI712803B TW I712803 B TWI712803 B TW I712803B TW 105139391 A TW105139391 A TW 105139391A TW 105139391 A TW105139391 A TW 105139391A TW I712803 B TWI712803 B TW I712803B
Authority
TW
Taiwan
Prior art keywords
substrate
contact
component
assembly
voltage
Prior art date
Application number
TW105139391A
Other languages
English (en)
Chinese (zh)
Other versions
TW201730568A (zh
Inventor
賈伯瑞皮爾思 艾格奈羅
彼得 樓氏
柯瑞羅伯特 烏斯坦尼克
Original Assignee
美商康寧公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商康寧公司 filed Critical 美商康寧公司
Publication of TW201730568A publication Critical patent/TW201730568A/zh
Application granted granted Critical
Publication of TWI712803B publication Critical patent/TWI712803B/zh

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R29/00—Arrangements for measuring or indicating electric quantities not covered by groups G01R19/00 - G01R27/00
    • G01R29/24—Arrangements for measuring quantities of charge
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R15/00—Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
    • G01R15/14—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
    • G01R15/16—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using capacitive devices
    • G01R15/165—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using capacitive devices measuring electrostatic potential, e.g. with electrostatic voltmeters or electrometers, when the design of the sensor is essential
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Measurement Of Resistance Or Impedance (AREA)
  • Other Investigation Or Analysis Of Materials By Electrical Means (AREA)
TW105139391A 2015-12-03 2016-11-30 用於測量基板的靜電荷的方法及設備 TWI712803B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201562262638P 2015-12-03 2015-12-03
US62/262,638 2015-12-03

Publications (2)

Publication Number Publication Date
TW201730568A TW201730568A (zh) 2017-09-01
TWI712803B true TWI712803B (zh) 2020-12-11

Family

ID=58798105

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105139391A TWI712803B (zh) 2015-12-03 2016-11-30 用於測量基板的靜電荷的方法及設備

Country Status (6)

Country Link
US (1) US10739394B2 (enExample)
JP (1) JP6811777B2 (enExample)
KR (1) KR20180081630A (enExample)
CN (1) CN108291931B (enExample)
TW (1) TWI712803B (enExample)
WO (1) WO2017095857A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021034820A1 (en) * 2019-08-20 2021-02-25 Ascend Performance Materials Operations Llc Method for measuring static attraction propensity
US11881424B2 (en) * 2022-03-10 2024-01-23 Intel Corporation Electrostatic charge measurement tool

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW348860U (en) * 1992-10-22 1998-12-21 Mita Industrial Co Ltd Image-forming machine with toner image transfer means
US5983043A (en) * 1997-12-24 1999-11-09 Canon Kabushiki Kaisha Potential measuring apparatus and potential measuring method
TW200307193A (en) * 2002-05-20 2003-12-01 Aetas Technology Inc Monocomponent developing arrangement for electrophotography
US20120183316A1 (en) * 2011-01-18 2012-07-19 Xerox Corporation Interdocument photoreceptor signal sensing and feedback control of paper edge ghosting
US20130121714A1 (en) * 2011-11-14 2013-05-16 Shinya Tanaka Transfer device and image forming apparatus including same
US20140253160A1 (en) * 2011-10-19 2014-09-11 Applied Materials, Inc. Roll to roll tester and method of testing flexible substrates roll to roll

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4827144B1 (enExample) * 1965-12-27 1973-08-20
JPS4910076A (enExample) * 1972-05-24 1974-01-29
US3876917A (en) 1973-03-26 1975-04-08 Bell & Howell Co Electrostatic charging apparatus
US3935517A (en) * 1975-01-02 1976-01-27 Xerox Corporation Constant current charging device
JPH05273835A (ja) 1992-03-26 1993-10-22 Ricoh Co Ltd 接触帯電装置
JPH05333076A (ja) * 1992-06-02 1993-12-17 Kanegafuchi Chem Ind Co Ltd 摩擦帯電量測定装置
US5461324A (en) * 1994-08-08 1995-10-24 International Business Machines Corporation Split-fixture configuration and method for testing circuit traces on a flexible substrate
US6391506B1 (en) * 1996-07-04 2002-05-21 Fuji Xerox Co., Ltd. Carrier, developer, and image-forming method
KR100265285B1 (ko) * 1997-12-30 2000-09-15 윤종용 정전기 센서를 이용한 표면 정전기 분포상태 측정방법과 장치 및 표면 정전기 분포상태 측정 시스템
JP2001013185A (ja) * 1999-06-29 2001-01-19 Hugle Electronics Inc 帯電分布測定装置
US20020192360A1 (en) * 2001-04-24 2002-12-19 3M Innovative Properties Company Electrostatic spray coating apparatus and method
US7103301B2 (en) * 2003-02-18 2006-09-05 Ricoh Company, Ltd. Image forming apparatus using a contact or a proximity type of charging system including a protection substance on a moveable body to be charged
JP4439994B2 (ja) * 2003-05-14 2010-03-24 キヤノン株式会社 画像形成装置及びカートリッジ、カートリッジに搭載される記憶装置
JP2005173305A (ja) * 2003-12-12 2005-06-30 Konica Minolta Business Technologies Inc 画像形成装置及び画像形成方法
JP4434799B2 (ja) * 2004-03-23 2010-03-17 キヤノン株式会社 画像形成装置
JP2007003879A (ja) * 2005-06-24 2007-01-11 Dainippon Screen Mfg Co Ltd 画像形成装置および画像形成方法
JP2007180074A (ja) * 2005-12-27 2007-07-12 Olympus Corp 静電気検出装置および基板検査装置
US8339637B2 (en) * 2007-08-03 2012-12-25 Ricoh Company, Ltd. Management apparatus, management system, operation status determination method, and image forming apparatus
WO2009099175A1 (ja) * 2008-02-08 2009-08-13 Brother Kogyo Kabushiki Kaisha 現像剤供給装置及び画像形成装置
US20090226224A1 (en) * 2008-03-10 2009-09-10 Kabushiki Kaisha Toshiba Image forming apparatus and transfer belt turning method for image forming apparatus
JP5535670B2 (ja) * 2010-01-28 2014-07-02 富士フイルム株式会社 放射線画像検出器の製造方法
JP2014514454A (ja) * 2011-04-27 2014-06-19 ダウ コーニング フランス 基板のプラズマ処理
EP2801835B1 (en) 2011-12-26 2019-07-24 The University of Tokyo Measurement method and measurement device
CN102608440B (zh) 2012-03-12 2014-05-07 南京航空航天大学 一种静电传感实验系统及颗粒摩擦带电量的测量方法
KR101923261B1 (ko) * 2012-07-02 2018-11-28 코닝 인코포레이티드 유리 기판의 가공 방법 및 유리 장치
JP2014016178A (ja) 2012-07-06 2014-01-30 Canon Inc 帯電量測定方法及び測定装置
CN102879658B (zh) 2012-09-20 2015-04-22 兰州大学 一种球盘式摩擦电测量装置
US8897675B2 (en) 2013-03-26 2014-11-25 Xerox Corporation Semi-contact bias charge roller
CN103513119B (zh) * 2013-10-18 2016-08-17 河北大学 静电分选机转辊表面电荷密度分布的测量方法及测量装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW348860U (en) * 1992-10-22 1998-12-21 Mita Industrial Co Ltd Image-forming machine with toner image transfer means
US5983043A (en) * 1997-12-24 1999-11-09 Canon Kabushiki Kaisha Potential measuring apparatus and potential measuring method
TW200307193A (en) * 2002-05-20 2003-12-01 Aetas Technology Inc Monocomponent developing arrangement for electrophotography
US20120183316A1 (en) * 2011-01-18 2012-07-19 Xerox Corporation Interdocument photoreceptor signal sensing and feedback control of paper edge ghosting
US20140253160A1 (en) * 2011-10-19 2014-09-11 Applied Materials, Inc. Roll to roll tester and method of testing flexible substrates roll to roll
US20130121714A1 (en) * 2011-11-14 2013-05-16 Shinya Tanaka Transfer device and image forming apparatus including same

Also Published As

Publication number Publication date
CN108291931B (zh) 2020-08-07
JP2019500748A (ja) 2019-01-10
US10739394B2 (en) 2020-08-11
KR20180081630A (ko) 2018-07-16
TW201730568A (zh) 2017-09-01
JP6811777B2 (ja) 2021-01-13
WO2017095857A1 (en) 2017-06-08
US20180356452A1 (en) 2018-12-13
CN108291931A (zh) 2018-07-17

Similar Documents

Publication Publication Date Title
JP5769451B2 (ja) インプリント装置および物品の製造方法
CN105336562B (zh) 热处理腔室和热处理方法、涂布设备
CN104760039B (zh) 基于激光位移传感器的并联平台振动检测控制装置与方法
JP2011044713A5 (enExample)
TWI712803B (zh) 用於測量基板的靜電荷的方法及設備
JP2012134466A (ja) インプリント装置、及びそれを用いた物品の製造方法
CN106840080A (zh) 空间三点平面校准机械手以及重置自查方法以及校准方法
CN106053278A (zh) 一种微纳米切削试验装置
TWI648135B (zh) 機械手臂之工具校正裝置
US8706289B2 (en) Pre-aligner search
CN105180833B (zh) 用于测量轮胎的胎面轮廓的系统和方法
CN106042001B (zh) 机器人末端空间位置测量装置
CN103946416A (zh) 一种直写式真空蒸发系统及其方法
CN106610264B (zh) 预对准机坐标系的标定方法
KR20180073753A (ko) 하향식 기판 에칭장치
JP2019500748A5 (enExample)
JP2011124548A5 (enExample)
JP2005203661A (ja) 薄板材の測定方法および測定装置
CN110274677B (zh) 一种节流器法向随机微振动的测量装置及方法
US20250201759A1 (en) Method of bonding chips and a system for performing the method
CN206989988U (zh) 一种回转类工件的高精度接触式测量装置
CN115535960B (zh) 一种加工二维材料纳米结构阵列的装置及方法
CN209249427U (zh) 载板变形量监控和补偿装置
CN203310859U (zh) 基于扫描隧道效应的在位测量装置
CN104129634A (zh) 一种升降机构

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees