JP6807310B2 - 基板収納容器の弁アセンブリ - Google Patents
基板収納容器の弁アセンブリ Download PDFInfo
- Publication number
- JP6807310B2 JP6807310B2 JP2017529293A JP2017529293A JP6807310B2 JP 6807310 B2 JP6807310 B2 JP 6807310B2 JP 2017529293 A JP2017529293 A JP 2017529293A JP 2017529293 A JP2017529293 A JP 2017529293A JP 6807310 B2 JP6807310 B2 JP 6807310B2
- Authority
- JP
- Japan
- Prior art keywords
- storage container
- check valve
- grommet
- purge
- elastomer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000003860 storage Methods 0.000 title claims description 81
- 239000000758 substrate Substances 0.000 claims description 44
- 239000012530 fluid Substances 0.000 claims description 38
- 238000010926 purge Methods 0.000 claims description 38
- 229920001971 elastomer Polymers 0.000 claims description 34
- 239000000806 elastomer Substances 0.000 claims description 34
- 238000000034 method Methods 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 238000004891 communication Methods 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 35
- 239000007789 gas Substances 0.000 description 17
- 230000000712 assembly Effects 0.000 description 12
- 238000000429 assembly Methods 0.000 description 12
- 238000012545 processing Methods 0.000 description 9
- 238000007789 sealing Methods 0.000 description 9
- 230000004323 axial length Effects 0.000 description 6
- 230000008901 benefit Effects 0.000 description 6
- 239000000969 carrier Substances 0.000 description 6
- 239000000356 contaminant Substances 0.000 description 6
- 238000009434 installation Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 238000011109 contamination Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 239000013536 elastomeric material Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 239000003570 air Substances 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 230000032258 transport Effects 0.000 description 3
- 229920002449 FKM Polymers 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 229920001973 fluoroelastomer Polymers 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000008439 repair process Effects 0.000 description 2
- 230000002441 reversible effect Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 101000931462 Homo sapiens Protein FosB Proteins 0.000 description 1
- 101000873785 Homo sapiens mRNA-decapping enzyme 1A Proteins 0.000 description 1
- 241000405070 Percophidae Species 0.000 description 1
- 102100020847 Protein FosB Human genes 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 239000004811 fluoropolymer Substances 0.000 description 1
- 239000004446 fluoropolymer coating Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 102100035856 mRNA-decapping enzyme 1A Human genes 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 210000002445 nipple Anatomy 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K15/00—Check valves
- F16K15/14—Check valves with flexible valve members
- F16K15/148—Check valves with flexible valve members the closure elements being fixed in their centre
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K27/00—Construction of housing; Use of materials therefor
- F16K27/02—Construction of housing; Use of materials therefor of lift valves
- F16K27/0209—Check valves or pivoted valves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
- H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Check Valves (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Details Of Valves (AREA)
Description
本出願は、2014年12月1日に出願された米国仮出願第62/086,022号に対する優先権を主張する。
Claims (3)
- 基板収納容器へ、または基板収納容器からの流体の流れを制御するように適合された逆止弁アセンブリであって、
前記基板収納容器と操作可能に連結するように適合されたエラストマパージグロメットと、
弁座を内部に有し、前記パージグロメット内部に配置された硬質のハウジングと、
軸部およびエラストマディスク部を有するエラストマアンブレラ逆止弁部材であって、前記エラストマディスク部が前記基板収納容器に対して前記パージグロメットを通る流体の流れを制御するために前記弁座と係合できるようになっており、前記硬質のハウジングが前記エラストマパージグロメットの内部に配置されることによりエラストマアンブレラ逆止弁部材が損傷から保護される、エラストマアンブレラ逆止弁部材とを含み、
前記弁座、ハウジング及びパージグロメットは、断面の実質的な「H」字形を一緒に画定し、
前記硬質のハウジングの外周面に環状溝が形成され、前記パージグロメットの内周面に環状突起が形成され、前記環状溝に嵌合されている、逆止弁アセンブリ。 - 基板収納容器であって、
前記基板収納容器の内部と流体連通するアクセス構造と、
前記収納容器の前記内部の、複数の実質的に水平の離間された基板棚と、
前記アクセス構造内に受けられる、請求項1に記載の逆止弁アセンブリとを含む、基板収納容器。 - 基板収納容器によって受けられるパージモジュールを取り換える方法であって、
フレームと、ばね装填プランジャとを含む元のパージモジュールを、前記基板収納容器と連係したアクセス構造から取り外すことと、
請求項1に記載の逆止弁アセンブリを、前記アクセス構造に挿入することを含む、方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201462086022P | 2014-12-01 | 2014-12-01 | |
US62/086,022 | 2014-12-01 | ||
PCT/US2015/063260 WO2016089912A1 (en) | 2014-12-01 | 2015-12-01 | Substrate container valve assemblies |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020173086A Division JP7108004B2 (ja) | 2014-12-01 | 2020-10-14 | 基板収納容器の弁アセンブリ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018505546A JP2018505546A (ja) | 2018-02-22 |
JP6807310B2 true JP6807310B2 (ja) | 2021-01-06 |
Family
ID=56092348
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017529293A Active JP6807310B2 (ja) | 2014-12-01 | 2015-12-01 | 基板収納容器の弁アセンブリ |
JP2020173086A Active JP7108004B2 (ja) | 2014-12-01 | 2020-10-14 | 基板収納容器の弁アセンブリ |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020173086A Active JP7108004B2 (ja) | 2014-12-01 | 2020-10-14 | 基板収納容器の弁アセンブリ |
Country Status (6)
Country | Link |
---|---|
US (2) | US20170271188A1 (ja) |
JP (2) | JP6807310B2 (ja) |
KR (1) | KR20170088411A (ja) |
CN (1) | CN107110389A (ja) |
TW (1) | TWI712098B (ja) |
WO (1) | WO2016089912A1 (ja) |
Families Citing this family (27)
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WO2016089912A1 (en) | 2014-12-01 | 2016-06-09 | Entegris, Inc. | Substrate container valve assemblies |
US10388554B2 (en) * | 2016-04-06 | 2019-08-20 | Entegris, Inc. | Wafer shipper with purge capability |
DE112018001612T5 (de) * | 2017-03-27 | 2020-01-16 | Shin-Etsu Polymer Co., Ltd. | Substratlagerungsbehälter |
CN107420593B (zh) * | 2017-04-27 | 2023-07-18 | 广东万家乐燃气具有限公司 | 一种可清洗净水单向安全阀 |
KR101956797B1 (ko) * | 2017-06-09 | 2019-03-12 | 주식회사 저스템 | 웨이퍼 용기의 가스공급장치 |
DE112018003608T5 (de) * | 2017-07-14 | 2020-04-16 | Shin-Etsu Polymer Co., Ltd. | Substratlagerungsbehälter |
KR102586291B1 (ko) | 2017-09-13 | 2023-10-10 | 와트 퓨얼 셀 코퍼레이션 | 원심 송풍기 시스템용 공기 흡입 어셈블리 및 이를 포함하는 연료 전지 |
TWI763002B (zh) * | 2018-01-11 | 2022-05-01 | 家登精密工業股份有限公司 | 快拆式氣閥與使用該快拆式氣閥之基板容器及其安裝方法與拆卸方法 |
JP6982164B2 (ja) * | 2018-02-19 | 2021-12-17 | ミライアル株式会社 | ガスパージ用ポート |
JP7125000B2 (ja) * | 2018-03-13 | 2022-08-24 | 信越ポリマー株式会社 | 基板収納容器 |
JP7147116B2 (ja) | 2018-03-28 | 2022-10-05 | 信越ポリマー株式会社 | 基板収納容器 |
CN112074944A (zh) * | 2018-04-25 | 2020-12-11 | 未来儿股份有限公司 | 基板收纳容器 |
JP7247439B2 (ja) * | 2018-11-29 | 2023-03-29 | 信越ポリマー株式会社 | 基板収納容器 |
JP7247440B2 (ja) * | 2018-11-29 | 2023-03-29 | 信越ポリマー株式会社 | 基板収納容器 |
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US11104496B2 (en) * | 2019-08-16 | 2021-08-31 | Gudeng Precision Industrial Co., Ltd. | Non-sealed reticle storage device |
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KR102242026B1 (ko) * | 2020-06-29 | 2021-04-19 | 피엠씨글로벌 주식회사 | 내부공간에 질소가스가 주입되는 포토마스크 케이스 |
US11440710B2 (en) * | 2020-06-30 | 2022-09-13 | Silgan Dispensing Systems Slatersville, Llc | Self-venting closure |
CN114076001A (zh) * | 2020-08-21 | 2022-02-22 | 恩特格里斯公司 | 主密封组合件 |
JP2022088280A (ja) * | 2020-12-02 | 2022-06-14 | 信越ポリマー株式会社 | 基板収納容器 |
TWI782689B (zh) * | 2021-09-02 | 2022-11-01 | 家登精密工業股份有限公司 | 快拆式氣閥、具有快拆式氣閥的基板容器及快拆式氣閥的安裝和拆卸方法 |
WO2023183517A1 (en) * | 2022-03-25 | 2023-09-28 | Entegris, Inc. | Wafer container purge port assembly |
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-
2015
- 2015-12-01 WO PCT/US2015/063260 patent/WO2016089912A1/en active Application Filing
- 2015-12-01 TW TW104140100A patent/TWI712098B/zh active
- 2015-12-01 US US15/532,320 patent/US20170271188A1/en not_active Abandoned
- 2015-12-01 CN CN201580073613.0A patent/CN107110389A/zh active Pending
- 2015-12-01 JP JP2017529293A patent/JP6807310B2/ja active Active
- 2015-12-01 KR KR1020177017479A patent/KR20170088411A/ko not_active Application Discontinuation
-
2020
- 2020-05-28 US US16/886,371 patent/US11869787B2/en active Active
- 2020-10-14 JP JP2020173086A patent/JP7108004B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2021010024A (ja) | 2021-01-28 |
KR20170088411A (ko) | 2017-08-01 |
US20170271188A1 (en) | 2017-09-21 |
TW201633429A (zh) | 2016-09-16 |
JP7108004B2 (ja) | 2022-07-27 |
US20200365435A1 (en) | 2020-11-19 |
WO2016089912A1 (en) | 2016-06-09 |
TWI712098B (zh) | 2020-12-01 |
US11869787B2 (en) | 2024-01-09 |
CN107110389A (zh) | 2017-08-29 |
JP2018505546A (ja) | 2018-02-22 |
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