JP6806774B2 - 基板間led移送のための、孤立iii族窒化物光アイランド上のレーザリフトオフ - Google Patents
基板間led移送のための、孤立iii族窒化物光アイランド上のレーザリフトオフ Download PDFInfo
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- JP6806774B2 JP6806774B2 JP2018529267A JP2018529267A JP6806774B2 JP 6806774 B2 JP6806774 B2 JP 6806774B2 JP 2018529267 A JP2018529267 A JP 2018529267A JP 2018529267 A JP2018529267 A JP 2018529267A JP 6806774 B2 JP6806774 B2 JP 6806774B2
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- light emitting
- emitting device
- conductive adhesive
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Classifications
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- H10W90/00—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/013—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
- H10H20/0137—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials the light-emitting regions comprising nitride materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/018—Bonding of wafers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
- H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/8506—Containers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H10P90/1916—
-
- H10W10/181—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
- H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
- H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
-
- H10W72/072—
-
- H10W72/07204—
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Led Device Packages (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electroluminescent Light Sources (AREA)
- Manufacturing & Machinery (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562263955P | 2015-12-07 | 2015-12-07 | |
| US62/263,955 | 2015-12-07 | ||
| PCT/US2016/059736 WO2017099905A1 (en) | 2015-12-07 | 2016-10-31 | Laser lift-off on isolated iii-nitride light islands for inter-substrate led transfer |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018538696A JP2018538696A (ja) | 2018-12-27 |
| JP2018538696A5 JP2018538696A5 (show.php) | 2019-12-05 |
| JP6806774B2 true JP6806774B2 (ja) | 2021-01-06 |
Family
ID=58800382
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018529267A Active JP6806774B2 (ja) | 2015-12-07 | 2016-10-31 | 基板間led移送のための、孤立iii族窒化物光アイランド上のレーザリフトオフ |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US9941262B2 (show.php) |
| EP (1) | EP3387882B1 (show.php) |
| JP (1) | JP6806774B2 (show.php) |
| WO (1) | WO2017099905A1 (show.php) |
Families Citing this family (76)
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| WO2017099905A1 (en) | 2015-12-07 | 2017-06-15 | Glo Ab | Laser lift-off on isolated iii-nitride light islands for inter-substrate led transfer |
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| KR101754528B1 (ko) * | 2016-03-23 | 2017-07-06 | 한국광기술원 | 건식 접착구조를 갖는 led 구조체 어레이의 전사체와 이를 이용한 led 구조체 어레이의 이송방법 및 led 구조체 |
| US10193038B2 (en) | 2016-04-04 | 2019-01-29 | Glo Ab | Through backplane laser irradiation for die transfer |
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| US10002856B1 (en) * | 2017-01-26 | 2018-06-19 | International Business Machines Corporation | Micro-LED array transfer |
| WO2018227453A1 (en) * | 2017-06-15 | 2018-12-20 | Goertek Inc. | Method for transferring micro-light emitting diodes, micro-light emitting diode device and electronic device |
| US11581291B2 (en) * | 2017-07-24 | 2023-02-14 | Goertek Inc. | Micro-LED display device and a manufacturing method thereof |
| CN109378365B (zh) * | 2017-08-08 | 2021-09-14 | 英属开曼群岛商錼创科技股份有限公司 | 微型发光二极管装置及其制作方法 |
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| US10964851B2 (en) * | 2017-08-30 | 2021-03-30 | SemiLEDs Optoelectronics Co., Ltd. | Single light emitting diode (LED) structure |
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| EP3487269A1 (en) * | 2017-11-21 | 2019-05-22 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO | Light induced selective transfer of components |
| DE112018006965T5 (de) | 2018-01-29 | 2020-10-08 | Lg Electronics Inc. | Verfahren zur Herstellung einer Anzeigevorrichtung unter Verwendung lichtemittierender Halbleiterelemente und Anzeigevorrichtung |
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| US10707190B2 (en) | 2018-04-10 | 2020-07-07 | Glo Ab | LED backplane having planar bonding surfaces and method of making thereof |
| WO2019199946A1 (en) | 2018-04-11 | 2019-10-17 | Glo Ab | Light emitting diodes formed on nanodisk substrates and methods of making the same |
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| TWI765332B (zh) | 2020-08-31 | 2022-05-21 | 錼創顯示科技股份有限公司 | 微型半導體結構及其製造方法 |
| CN112967983B (zh) * | 2020-09-21 | 2022-05-20 | 重庆康佳光电技术研究院有限公司 | 转移系统和转移方法 |
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| KR102732599B1 (ko) * | 2022-07-19 | 2024-11-21 | 한국광기술원 | 마이크로 led 선택적 전사 방법 |
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| JPS5617385A (en) * | 1979-07-20 | 1981-02-19 | Tokyo Shibaura Electric Co | Production of display device |
| JP3351447B2 (ja) * | 1994-04-08 | 2002-11-25 | 日亜化学工業株式会社 | Ledディスプレイ |
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| CN102903804B (zh) * | 2011-07-25 | 2015-12-16 | 财团法人工业技术研究院 | 发光元件的转移方法以及发光元件阵列 |
| JP2013211443A (ja) * | 2012-03-30 | 2013-10-10 | Toyohashi Univ Of Technology | 発光装置の製造方法 |
| FR3001334B1 (fr) * | 2013-01-24 | 2016-05-06 | Centre Nat De La Rech Scient (Cnrs) | Procede de fabrication de diodes blanches monolithiques |
| KR102032158B1 (ko) | 2014-12-19 | 2019-10-15 | 글로 에이비 | 백플레인 상의 발광 다이오드 어레이 및 그의 제조 방법 |
| WO2017099905A1 (en) | 2015-12-07 | 2017-06-15 | Glo Ab | Laser lift-off on isolated iii-nitride light islands for inter-substrate led transfer |
-
2016
- 2016-10-31 WO PCT/US2016/059736 patent/WO2017099905A1/en not_active Ceased
- 2016-10-31 US US15/339,194 patent/US9941262B2/en active Active
- 2016-10-31 JP JP2018529267A patent/JP6806774B2/ja active Active
- 2016-10-31 EP EP16873530.6A patent/EP3387882B1/en active Active
-
2018
- 2018-03-01 US US15/909,858 patent/US10229899B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US10229899B2 (en) | 2019-03-12 |
| WO2017099905A1 (en) | 2017-06-15 |
| EP3387882B1 (en) | 2021-05-12 |
| JP2018538696A (ja) | 2018-12-27 |
| US9941262B2 (en) | 2018-04-10 |
| US20170162552A1 (en) | 2017-06-08 |
| US20180190633A1 (en) | 2018-07-05 |
| EP3387882A4 (en) | 2019-10-16 |
| EP3387882A1 (en) | 2018-10-17 |
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