JP6801264B2 - Ag合金膜とその製造方法、Ag合金スパッタリングターゲットおよび積層膜 - Google Patents
Ag合金膜とその製造方法、Ag合金スパッタリングターゲットおよび積層膜 Download PDFInfo
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- JP6801264B2 JP6801264B2 JP2016131593A JP2016131593A JP6801264B2 JP 6801264 B2 JP6801264 B2 JP 6801264B2 JP 2016131593 A JP2016131593 A JP 2016131593A JP 2016131593 A JP2016131593 A JP 2016131593A JP 6801264 B2 JP6801264 B2 JP 6801264B2
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- 229910001316 Ag alloy Inorganic materials 0.000 title claims description 244
- 238000005477 sputtering target Methods 0.000 title claims description 68
- 238000004519 manufacturing process Methods 0.000 title claims description 19
- 239000013078 crystal Substances 0.000 claims description 47
- 229910052802 copper Inorganic materials 0.000 claims description 43
- 229910052738 indium Inorganic materials 0.000 claims description 43
- 229910052782 aluminium Inorganic materials 0.000 claims description 41
- 229910052787 antimony Inorganic materials 0.000 claims description 41
- 229910052733 gallium Inorganic materials 0.000 claims description 41
- 229910052732 germanium Inorganic materials 0.000 claims description 41
- 229910052749 magnesium Inorganic materials 0.000 claims description 41
- 229910052718 tin Inorganic materials 0.000 claims description 41
- 229910052725 zinc Inorganic materials 0.000 claims description 41
- 238000004544 sputter deposition Methods 0.000 claims description 39
- 239000002245 particle Substances 0.000 claims description 28
- 229910052804 chromium Inorganic materials 0.000 claims description 27
- 229910052710 silicon Inorganic materials 0.000 claims description 27
- 229910052720 vanadium Inorganic materials 0.000 claims description 27
- 229910052742 iron Inorganic materials 0.000 claims description 26
- 229910052708 sodium Inorganic materials 0.000 claims description 25
- 239000007789 gas Substances 0.000 claims description 22
- 229910052719 titanium Inorganic materials 0.000 claims description 18
- 229910052737 gold Inorganic materials 0.000 claims description 17
- 229910052763 palladium Inorganic materials 0.000 claims description 17
- 229910052697 platinum Inorganic materials 0.000 claims description 17
- 239000012535 impurity Substances 0.000 claims description 14
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 12
- 239000001301 oxygen Substances 0.000 claims description 12
- 229910052760 oxygen Inorganic materials 0.000 claims description 12
- 239000011261 inert gas Substances 0.000 claims description 7
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- 239000010408 film Substances 0.000 description 277
- 238000012360 testing method Methods 0.000 description 74
- 238000002834 transmittance Methods 0.000 description 40
- 230000015572 biosynthetic process Effects 0.000 description 39
- 239000010949 copper Substances 0.000 description 36
- 230000000052 comparative effect Effects 0.000 description 34
- 239000011135 tin Substances 0.000 description 34
- 239000011701 zinc Substances 0.000 description 34
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 31
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 25
- 229910052717 sulfur Inorganic materials 0.000 description 25
- 239000011593 sulfur Substances 0.000 description 25
- 150000003839 salts Chemical class 0.000 description 24
- 238000005987 sulfurization reaction Methods 0.000 description 24
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 23
- 239000000460 chlorine Substances 0.000 description 23
- 229910052801 chlorine Inorganic materials 0.000 description 23
- 230000003287 optical effect Effects 0.000 description 22
- 239000011734 sodium Substances 0.000 description 21
- 229910052751 metal Inorganic materials 0.000 description 20
- 230000002159 abnormal effect Effects 0.000 description 19
- 238000005260 corrosion Methods 0.000 description 16
- 230000007797 corrosion Effects 0.000 description 16
- 230000008859 change Effects 0.000 description 15
- 238000002845 discoloration Methods 0.000 description 15
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 12
- 239000002994 raw material Substances 0.000 description 12
- 230000000694 effects Effects 0.000 description 10
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 9
- 230000003247 decreasing effect Effects 0.000 description 9
- 239000000203 mixture Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 238000004220 aggregation Methods 0.000 description 7
- 230000002776 aggregation Effects 0.000 description 7
- 238000004458 analytical method Methods 0.000 description 7
- 239000000523 sample Substances 0.000 description 7
- 239000011787 zinc oxide Substances 0.000 description 6
- 230000009471 action Effects 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 229910003437 indium oxide Inorganic materials 0.000 description 4
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 239000012528 membrane Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 230000035699 permeability Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- BYHQTRFJOGIQAO-GOSISDBHSA-N 3-(4-bromophenyl)-8-[(2R)-2-hydroxypropyl]-1-[(3-methoxyphenyl)methyl]-1,3,8-triazaspiro[4.5]decan-2-one Chemical compound C[C@H](CN1CCC2(CC1)CN(C(=O)N2CC3=CC(=CC=C3)OC)C4=CC=C(C=C4)Br)O BYHQTRFJOGIQAO-GOSISDBHSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- AJNVQOSZGJRYEI-UHFFFAOYSA-N digallium;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Ga+3].[Ga+3] AJNVQOSZGJRYEI-UHFFFAOYSA-N 0.000 description 2
- 239000008151 electrolyte solution Substances 0.000 description 2
- 238000004993 emission spectroscopy Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 229910001195 gallium oxide Inorganic materials 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000001755 magnetron sputter deposition Methods 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 238000010791 quenching Methods 0.000 description 2
- 230000000171 quenching effect Effects 0.000 description 2
- 239000011780 sodium chloride Substances 0.000 description 2
- 229910052979 sodium sulfide Inorganic materials 0.000 description 2
- GRVFOGOEDUUMBP-UHFFFAOYSA-N sodium sulfide (anhydrous) Chemical compound [Na+].[Na+].[S-2] GRVFOGOEDUUMBP-UHFFFAOYSA-N 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- 229910001887 tin oxide Inorganic materials 0.000 description 2
- KVCQTKNUUQOELD-UHFFFAOYSA-N 4-amino-n-[1-(3-chloro-2-fluoroanilino)-6-methylisoquinolin-5-yl]thieno[3,2-d]pyrimidine-7-carboxamide Chemical compound N=1C=CC2=C(NC(=O)C=3C4=NC=NC(N)=C4SC=3)C(C)=CC=C2C=1NC1=CC=CC(Cl)=C1F KVCQTKNUUQOELD-UHFFFAOYSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 229910052946 acanthite Inorganic materials 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- XUARKZBEFFVFRG-UHFFFAOYSA-N silver sulfide Chemical compound [S-2].[Ag+].[Ag+] XUARKZBEFFVFRG-UHFFFAOYSA-N 0.000 description 1
- 229940056910 silver sulfide Drugs 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/06—Alloys based on silver
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/06—Alloys based on silver
- C22C5/08—Alloys based on silver with copper as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/14—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of noble metals or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Photovoltaic Devices (AREA)
- Electroluminescent Light Sources (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2016/071375 WO2017018310A1 (ja) | 2015-07-28 | 2016-07-21 | Ag合金膜とその製造方法、Ag合金スパッタリングターゲットおよび積層膜 |
KR1020177036899A KR20180034334A (ko) | 2015-07-28 | 2016-07-21 | Ag 합금막과 그 제조 방법, Ag 합금 스퍼터링 타겟 및 적층막 |
CN201680038273.2A CN107709584B (zh) | 2015-07-28 | 2016-07-21 | Ag合金膜及其制造方法、Ag合金溅射靶以及层叠膜 |
TW105123459A TWI697572B (zh) | 2015-07-28 | 2016-07-25 | Ag合金膜及其製造方法,Ag合金濺鍍靶以及層合膜 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015148474 | 2015-07-28 | ||
JP2015148474 | 2015-07-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017031503A JP2017031503A (ja) | 2017-02-09 |
JP6801264B2 true JP6801264B2 (ja) | 2020-12-16 |
Family
ID=57987789
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016131593A Expired - Fee Related JP6801264B2 (ja) | 2015-07-28 | 2016-07-01 | Ag合金膜とその製造方法、Ag合金スパッタリングターゲットおよび積層膜 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6801264B2 (zh) |
KR (1) | KR20180034334A (zh) |
CN (1) | CN107709584B (zh) |
TW (1) | TWI697572B (zh) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019221257A1 (ja) * | 2018-05-17 | 2019-11-21 | 三菱マテリアル株式会社 | 積層膜、及び、Ag合金スパッタリングターゲット |
JP2019203194A (ja) * | 2018-05-17 | 2019-11-28 | 三菱マテリアル株式会社 | 積層膜、及び、Ag合金スパッタリングターゲット |
CN112752863A (zh) * | 2018-10-03 | 2021-05-04 | 三菱综合材料株式会社 | 叠层膜及Ag合金溅射靶 |
SE543408C2 (en) * | 2018-10-22 | 2021-01-05 | Mimsi Mat Ab | Glazing and method of its production |
CN109440073A (zh) * | 2018-11-29 | 2019-03-08 | 信利光电股份有限公司 | 一种银合金靶材、银合金镀层和电致变色后视镜 |
JP2020090706A (ja) * | 2018-12-05 | 2020-06-11 | 三菱マテリアル株式会社 | 金属膜、及び、スパッタリングターゲット |
JP2020090708A (ja) * | 2018-12-05 | 2020-06-11 | 三菱マテリアル株式会社 | 金属膜、及び、スパッタリングターゲット |
JP2020090707A (ja) * | 2018-12-05 | 2020-06-11 | 三菱マテリアル株式会社 | 金属膜、及び、スパッタリングターゲット |
JP7281912B2 (ja) * | 2019-02-06 | 2023-05-26 | 株式会社フルヤ金属 | 透明導電積層体及びその製造方法 |
WO2022158231A1 (ja) * | 2021-01-22 | 2022-07-28 | 三菱マテリアル株式会社 | Ag合金膜、および、Ag合金スパッタリングターゲット |
CN113088749A (zh) * | 2021-03-11 | 2021-07-09 | 先导薄膜材料(广东)有限公司 | 一种银合金及其制备方法 |
CN113444914A (zh) * | 2021-07-19 | 2021-09-28 | 福建阿石创新材料股份有限公司 | 一种银基合金及其制备方法、银合金复合薄膜及其应用 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4812980B2 (ja) * | 2001-08-09 | 2011-11-09 | 株式会社アルバック | Ag合金薄膜電極、有機EL素子及びスパッタリング用ターゲット |
JP4305809B2 (ja) * | 2002-07-10 | 2009-07-29 | 日立金属株式会社 | Ag合金系スパッタリングターゲット材 |
WO2006132415A1 (ja) * | 2005-06-10 | 2006-12-14 | Tanaka Kikinzoku Kogyo K.K. | 反射率・透過率維持特性に優れた銀合金 |
JP5522599B1 (ja) * | 2012-12-21 | 2014-06-18 | 三菱マテリアル株式会社 | Ag合金スパッタリングターゲット |
-
2016
- 2016-07-01 JP JP2016131593A patent/JP6801264B2/ja not_active Expired - Fee Related
- 2016-07-21 CN CN201680038273.2A patent/CN107709584B/zh not_active Expired - Fee Related
- 2016-07-21 KR KR1020177036899A patent/KR20180034334A/ko not_active Application Discontinuation
- 2016-07-25 TW TW105123459A patent/TWI697572B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN107709584A (zh) | 2018-02-16 |
JP2017031503A (ja) | 2017-02-09 |
TW201718886A (zh) | 2017-06-01 |
CN107709584B (zh) | 2019-11-19 |
TWI697572B (zh) | 2020-07-01 |
KR20180034334A (ko) | 2018-04-04 |
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