JP6789495B2 - アンダーフィル用樹脂組成物、電子部品装置及び電子部品装置の製造方法 - Google Patents

アンダーフィル用樹脂組成物、電子部品装置及び電子部品装置の製造方法 Download PDF

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Publication number
JP6789495B2
JP6789495B2 JP2015199761A JP2015199761A JP6789495B2 JP 6789495 B2 JP6789495 B2 JP 6789495B2 JP 2015199761 A JP2015199761 A JP 2015199761A JP 2015199761 A JP2015199761 A JP 2015199761A JP 6789495 B2 JP6789495 B2 JP 6789495B2
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Japan
Prior art keywords
resin composition
underfill
epoxy resin
type epoxy
electronic component
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Active
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JP2015199761A
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English (en)
Japanese (ja)
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JP2017071704A (ja
Inventor
央視 出口
央視 出口
浩士 堀
浩士 堀
直幸 野尻
直幸 野尻
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=58487784&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JP6789495(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP2015199761A priority Critical patent/JP6789495B2/ja
Priority to PCT/JP2016/079884 priority patent/WO2017061580A1/ja
Priority to TW105132488A priority patent/TWI726921B/zh
Priority to TW110114230A priority patent/TWI778589B/zh
Priority to KR1020187009502A priority patent/KR102582323B1/ko
Priority to CN202110616770.9A priority patent/CN113185807B/zh
Priority to KR1020237031963A priority patent/KR102668254B1/ko
Priority to CN201680057967.0A priority patent/CN108137904B/zh
Publication of JP2017071704A publication Critical patent/JP2017071704A/ja
Publication of JP6789495B2 publication Critical patent/JP6789495B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5033—Amines aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C08K5/18—Amines; Quaternary ammonium compounds with aromatically bound amino groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Polymerisation Methods In General (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2015199761A 2015-10-07 2015-10-07 アンダーフィル用樹脂組成物、電子部品装置及び電子部品装置の製造方法 Active JP6789495B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2015199761A JP6789495B2 (ja) 2015-10-07 2015-10-07 アンダーフィル用樹脂組成物、電子部品装置及び電子部品装置の製造方法
KR1020187009502A KR102582323B1 (ko) 2015-10-07 2016-10-07 언더필용 수지 조성물, 전자 부품 장치 및 전자 부품 장치의 제조 방법
TW105132488A TWI726921B (zh) 2015-10-07 2016-10-07 底部填充用樹脂組成物、電子零件裝置及電子零件裝置的製造方法
TW110114230A TWI778589B (zh) 2015-10-07 2016-10-07 底部填充用樹脂組成物、電子零件裝置及電子零件裝置的製造方法
PCT/JP2016/079884 WO2017061580A1 (ja) 2015-10-07 2016-10-07 アンダーフィル用樹脂組成物、電子部品装置及び電子部品装置の製造方法
CN202110616770.9A CN113185807B (zh) 2015-10-07 2016-10-07 底部填充用树脂组合物、电子部件装置和电子部件装置的制造方法
KR1020237031963A KR102668254B1 (ko) 2015-10-07 2016-10-07 언더필용 수지 조성물, 전자 부품 장치 및 전자 부품 장치의 제조 방법
CN201680057967.0A CN108137904B (zh) 2015-10-07 2016-10-07 底部填充用树脂组合物、电子部件装置和电子部件装置的制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015199761A JP6789495B2 (ja) 2015-10-07 2015-10-07 アンダーフィル用樹脂組成物、電子部品装置及び電子部品装置の製造方法

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JP2020180882A Division JP7095724B2 (ja) 2020-10-28 2020-10-28 アンダーフィル用樹脂組成物、電子部品装置及び電子部品装置の製造方法

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JP2017071704A JP2017071704A (ja) 2017-04-13
JP6789495B2 true JP6789495B2 (ja) 2020-11-25

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JP2015199761A Active JP6789495B2 (ja) 2015-10-07 2015-10-07 アンダーフィル用樹脂組成物、電子部品装置及び電子部品装置の製造方法

Country Status (5)

Country Link
JP (1) JP6789495B2 (ko)
KR (2) KR102582323B1 (ko)
CN (2) CN108137904B (ko)
TW (2) TWI778589B (ko)
WO (1) WO2017061580A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021014588A (ja) * 2020-10-28 2021-02-12 昭和電工マテリアルズ株式会社 アンダーフィル用樹脂組成物、電子部品装置及び電子部品装置の製造方法

Families Citing this family (8)

* Cited by examiner, † Cited by third party
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JP7003575B2 (ja) * 2017-10-30 2022-01-20 昭和電工マテリアルズ株式会社 アンダーフィル材、半導体パッケージ及び半導体パッケージの製造方法
KR102146995B1 (ko) * 2017-12-29 2020-08-21 삼성에스디아이 주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 사용하여 밀봉된 반도체 소자
JP2019172738A (ja) * 2018-03-27 2019-10-10 信越化学工業株式会社 エポキシ樹脂組成物及び半導体装置
KR102687075B1 (ko) * 2019-03-27 2024-07-19 닛폰 하츠죠 가부시키가이샤 열경화성 에폭시 수지 조성물, 회로 기판용 적층판, 금속 베이스 회로 기판, 및 파워 모듈
JP7060068B2 (ja) * 2020-12-09 2022-04-26 味の素株式会社 樹脂組成物
CN114507415A (zh) * 2022-03-01 2022-05-17 郭亚莹 一种快速流动耐高温底部填充胶及其制备方法
CN117736550A (zh) * 2022-09-15 2024-03-22 华为技术有限公司 树脂组合物及其制备方法和应用
CN117701211B (zh) * 2024-02-04 2024-05-10 武汉市三选科技有限公司 一种高导热性的底部填充胶，其制备方法及应用

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US20070073008A1 (en) * 2005-09-28 2007-03-29 Cookson Singapore Pte, Ltd. Compositions effective to suppress void formation
US7981977B2 (en) * 2005-12-08 2011-07-19 Hitachi Chemical Co., Ltd. Sealant for electronics of epoxy resin, aromatic amine, accelerator and inorganic filler
JPWO2011013326A1 (ja) * 2009-07-31 2013-01-07 住友ベークライト株式会社 液状樹脂組成物、およびそれを用いた半導体装置
JP5354753B2 (ja) 2011-01-13 2013-11-27 信越化学工業株式会社 アンダーフィル材及び半導体装置
JP5598343B2 (ja) 2011-01-17 2014-10-01 信越化学工業株式会社 半導体封止用液状エポキシ樹脂組成物及び半導体装置
EP2690121B1 (en) * 2011-03-22 2020-06-10 Mitsubishi Chemical Corporation Epoxy resin composition, prepreg, fiber-reinforced composite material, and housing for electrical or electronic equipment
JP6051557B2 (ja) * 2012-03-26 2016-12-27 日立化成株式会社 アンダーフィル用エポキシ樹脂液状封止材及び電子部品装置
US20150079401A1 (en) * 2012-03-30 2015-03-19 Tokuyama Corporation Curable resin composition, method for manufacturing the same, high thermal conductive resin composition, and high thermal conductive laminated substrate
WO2015104917A1 (ja) * 2014-01-08 2015-07-16 信越化学工業株式会社 半導体封止用液状エポキシ樹脂組成物及び樹脂封止半導体装置
JP6415104B2 (ja) * 2014-05-16 2018-10-31 ナミックス株式会社 液状封止材、それを用いた電子部品
CN104910845B (zh) * 2015-06-12 2017-11-07 深圳先进技术研究院 底部填充胶及其制备方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021014588A (ja) * 2020-10-28 2021-02-12 昭和電工マテリアルズ株式会社 アンダーフィル用樹脂組成物、電子部品装置及び電子部品装置の製造方法
JP7095724B2 (ja) 2020-10-28 2022-07-05 昭和電工マテリアルズ株式会社 アンダーフィル用樹脂組成物、電子部品装置及び電子部品装置の製造方法

Also Published As

Publication number Publication date
KR102668254B1 (ko) 2024-05-21
WO2017061580A1 (ja) 2017-04-13
TWI778589B (zh) 2022-09-21
CN113185807B (zh) 2024-03-29
CN113185807A (zh) 2021-07-30
CN108137904A (zh) 2018-06-08
TW201713722A (zh) 2017-04-16
TW202128876A (zh) 2021-08-01
KR102582323B1 (ko) 2023-09-25
KR20180066069A (ko) 2018-06-18
TWI726921B (zh) 2021-05-11
KR20230141890A (ko) 2023-10-10
JP2017071704A (ja) 2017-04-13
CN108137904B (zh) 2021-06-22

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