JP6788657B2 - 太陽電池モジュール - Google Patents
太陽電池モジュール Download PDFInfo
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- JP6788657B2 JP6788657B2 JP2018504042A JP2018504042A JP6788657B2 JP 6788657 B2 JP6788657 B2 JP 6788657B2 JP 2018504042 A JP2018504042 A JP 2018504042A JP 2018504042 A JP2018504042 A JP 2018504042A JP 6788657 B2 JP6788657 B2 JP 6788657B2
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- 229910052751 metal Inorganic materials 0.000 claims description 125
- 239000002184 metal Substances 0.000 claims description 125
- 239000000463 material Substances 0.000 claims description 95
- 230000001681 protective effect Effects 0.000 claims description 59
- 238000006243 chemical reaction Methods 0.000 claims description 31
- 239000008393 encapsulating agent Substances 0.000 claims description 15
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 238000001579 optical reflectometry Methods 0.000 claims description 2
- 239000010408 film Substances 0.000 description 97
- 239000000758 substrate Substances 0.000 description 21
- 230000000052 comparative effect Effects 0.000 description 20
- 239000003566 sealing material Substances 0.000 description 15
- 239000010409 thin film Substances 0.000 description 15
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 13
- 229910052710 silicon Inorganic materials 0.000 description 13
- 239000010703 silicon Substances 0.000 description 13
- 238000000034 method Methods 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 239000004065 semiconductor Substances 0.000 description 9
- 239000011889 copper foil Substances 0.000 description 8
- 229910021417 amorphous silicon Inorganic materials 0.000 description 7
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 229910021419 crystalline silicon Inorganic materials 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 4
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 3
- 239000005977 Ethylene Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 229910003437 indium oxide Inorganic materials 0.000 description 3
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 230000031700 light absorption Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- -1 and among them Chemical compound 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- FERIUCNNQQJTOY-UHFFFAOYSA-M Butyrate Chemical compound CCCC([O-])=O FERIUCNNQQJTOY-UHFFFAOYSA-M 0.000 description 1
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Natural products CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000005779 cell damage Effects 0.000 description 1
- 208000037887 cell injury Diseases 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910021424 microcrystalline silicon Inorganic materials 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
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- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
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- H01L31/02—Details
- H01L31/02002—Arrangements for conducting electric current to or from the device in operations
- H01L31/02005—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier
- H01L31/02008—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier for solar cells or solar cell modules
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- H01L31/046—PV modules composed of a plurality of thin film solar cells deposited on the same substrate
- H01L31/0465—PV modules composed of a plurality of thin film solar cells deposited on the same substrate comprising particular structures for the electrical interconnection of adjacent PV cells in the module
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Description
表裏にテクスチャが形成された厚み160μmの6インチn型単結晶シリコン基板(1辺の長さが156nmのセミスクエア型)の受光面側に、プラズマCVD法により膜厚4nmの真性非晶質シリコン層および膜厚6nmのp型非晶質シリコン層を形成した。その後、シリコン基板の裏面側に、プラズマCVD法により膜厚5nmの真性非晶質シリコン層および膜厚10nmのn型非晶質シリコン層を形成した。p層上およびn層上のそれぞれに、スパッタ法により膜厚100nmのITO層を製膜後、WO2013/077038の実施例に記載の方法により、表裏のITO層上のそれぞれに、フィンガー電極とバスバー電極からなるグリッド状のパターン集電極を形成して、ヘテロ接合太陽電池を得た。受光面および裏面ともにバスバー電極は3本であり、裏面側のフィンガー電極の本数を、受光面電極のフィンガー電極の本数の2倍とした。
セルの受光面電極および裏面電極上に、導電性接着剤を介して配線材を接続し、9個の太陽電池が直列接続された太陽電池ストリングを作製した。隣接するセル間の間隔は2mmとした。配線材としては、凹凸構造を有する銅箔の表面に銀を被覆した拡散タブを用いた。
銅箔のサイズを1辺の長さが136mmとなるように変更し、セルの端部から10mmの領域がセル露出領域となるようにしたこと以外は、実施例1と同様にして太陽電池モジュールを作製した。
銅箔のサイズを1辺の長さが126mmとなるように変更し、セルの端部から15mmの領域がセル露出領域となるようにしたこと以外は、実施例1と同様にして太陽電池モジュールを作製した。
バックシートの受光面側に、太陽電池ストリング作製時に配線材として使用したものと同一の拡散タブ(幅5mm、凸部の傾斜角θ=30°)を貼り合わせた裏面保護材を用いた。拡散タブは、太陽電池ストリング内の隣接するセル間、および隣接する太陽電池ストリングの間のセル間に位置し、凸部の延在方向が隣接するセルの辺と平行となるように配置した。光反射部材としての拡散タブが貼り合わせられたバックシートを用いたこと以外は、実施例2と同様にして太陽電池モジュールを作製した。
太陽電池と裏面側のEVAシートとの間に銅箔を配置しなかったこと以外は、実施例1と同様にして太陽電池モジュールを作製した。
銅箔のサイズを1辺の長さが156mm、すなわちセルと同一サイズとなるように変更し、セル露出領域を設けなかったこと以外は、実施例1と同様にして太陽電池モジュールを作製した。
上記の実施例および比較例の太陽電池モジュールの変換特性(短絡電流(Isc)、開放電圧(Voc)、曲線因子(FF)および最大出力(Pmax))を測定した。各モジュールのセル露出領域の幅W2、金属膜配置領域の面積に対するセル露出領域の面積の比S2/S1、セル間の間隔における光反射部材の配置の有無、およびモジュール特性を表1に示す。なお、表1におけるモジュール特性は、比較例1の太陽電池モジュールの特性1を1とした相対値で示している。
101〜103 太陽電池
50 光電変換部
1 結晶半導体基板
60 受光面電極
70 裏面電極
61,71 フィンガー電極
62,72 バスバー電極
76〜79 金属膜
81〜84 配線材
91 受光面保護材
92 裏面保護材
95 封止材
98 光反射部材
Claims (7)
- 互いに離間して配置された複数の太陽電池が配線材を介して接続された太陽電池ストリング、前記太陽電池ストリングの受光面側に配置された光透過性の受光面保護材、および前記太陽電池ストリングの裏面側に配置された裏面保護材、を備える太陽電池モジュールであって、
前記太陽電池は、光電変換部と、前記光電変換部の受光面に設けられたパターン状の受光面金属電極と、前記光電変換部の裏面に設けられたパターン状の裏面金属電極とを有し、
太陽電池の裏面には、前記光電変換部と前記裏面保護材との間に金属膜が設けられており、かつ太陽電池の裏面の周縁には前記金属膜が設けられていないセル露出領域が存在し、
前記金属膜が前記光電変換部に接しており、
前記裏面金属電極の少なくとも一部は、前記セル露出領域に設けられている、太陽電池モジュール。 - 太陽電池の裏面における前記セル露出領域の面積が、前記金属膜が設けられている領域の面積の0.05〜0.5倍である、請求項1に記載の太陽電池モジュール。
- 前記裏面保護材が光反射性を有する、請求項1または2に記載の太陽電池モジュール。
- 太陽電池が配置されていない領域に光反射部材が設けられている、請求項1〜3のいずれか1項に記載の太陽電池モジュール。
- 前記光反射部材は、受光面側の表面に凹凸構造を有する、請求項4に記載の太陽電池モジュール。
- 前記光反射部材は、隣接して配置された太陽電池の辺と平行に延在する凸部を有する、請求項5に記載の太陽電池モジュール。
- 前記太陽電池ストリングと前記受光面保護材との間には受光面封止材が配置され、前記太陽電池ストリングと前記裏面保護材との間には裏面封止材が配置され、
前記裏面封止材の厚みが前記受光面封止材の厚みよりも大きい、請求項1〜6のいずれか1項に記載の太陽電池モジュール。
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