JP6783606B2 - 接続端子組立体、及びこの接続端子組立体を使用した回路基板 - Google Patents
接続端子組立体、及びこの接続端子組立体を使用した回路基板 Download PDFInfo
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- JP6783606B2 JP6783606B2 JP2016190826A JP2016190826A JP6783606B2 JP 6783606 B2 JP6783606 B2 JP 6783606B2 JP 2016190826 A JP2016190826 A JP 2016190826A JP 2016190826 A JP2016190826 A JP 2016190826A JP 6783606 B2 JP6783606 B2 JP 6783606B2
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- 238000005476 soldering Methods 0.000 description 15
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- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
- H01R43/205—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve with a panel or printed circuit board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49517—Additional leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
- H01R12/718—Contact members provided on the PCB without an insulating housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0263—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for positioning or holding parts during soldering or welding process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10757—Bent leads
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Description
また、結合吸着部材27を含む接続端子組立体25の重心位置が、金属回路基板21への接着部の接着範囲に内包されているので、接続端子組立体25を自立させてハンダ付け作業ができ、雇等の特別な治具を用いなくてもハンダ付けができるので生産性を高めることができるようになる。また、結合吸着部材27によって重心位置を低いほうに設定できるので、接続端子組立体25の座りが改善されて更に自立機能を高めることができるようになる。
Claims (8)
- 少なくとも1個の単位接続端子よりなり、回路基板にハンダ付けされる接続端子組立体であって、
前記単位接続端子は、長手方向に延び前記ハンダ付けされる接着部と、
長手方向に延びた前記接着部に対して略直交する方向に延びる端子部と、
前記接着部と前記端子部を接続するように、前記端子部から前記長手方向に屈曲する第1屈曲部、及び前記第1屈曲部から前記接着部方向に屈曲する第2屈曲部を有する屈曲部と、
前記屈曲部より前記端子部側で前記単位接続端子と固定され、自動機による吸着面を形成した合成樹脂製の吸着部材とを備え、
前記吸着面が、前記単位接続端子よりも前記屈曲部が屈曲する前記長手方向の側に位置していること
を特徴とする接続端子組立体。 - 請求項1に記載の接続端子組立体において、
前記吸着部材は、前記端子部の先端から前記接着部までの間の中間位置と前記屈曲部の間の領域に配置されていることを特徴とする接続端子組立体。 - 請求項2に記載の接続端子組立体において、
前記吸着部材を含む前記単位接続端子の全体の重心位置を前記接着部側へ投影した投影位置が、前記接着部の接着範囲に内包されていることを特徴とする接続端子組立体。 - 請求項3に記載の接続端子組立体において、
前記吸着部材から前記接着部までの間の任意の位置の幅が、前記吸着部材から前記端子部までの幅より長いことを特徴とする接続端子組立体。 - 複数個の単位接続端子を組み合わせた接続端子組立体であって、
前記単位接続端子は、長手方向に延びていて、回路基板にハンダ付けされる接着部と、
長手方向に延びた前記接着部に対して略直交する方向に延びる端子部と、
前記接着部と前記端子部を接続するように前記端子部から前記長手方向に屈曲する第1屈曲部、及び前記第1屈曲部から前記接着部の方向に屈曲する第2屈曲部を有する屈曲部と、
個々の前記単位接続端子の前記屈曲部よりも前記端子部側を一体的に結合する結合部、及び自動機による吸着面を有する吸着部を有する合成樹脂製の結合吸着部材と、を備え、
前記吸着部は前記結合吸着部材の中央付近に形成されており、前記吸着面が、前記単位接続端子の端子列よりも前記屈曲部が屈曲する前記長手方向の側に位置していること
を特徴とする接続端子組立体。 - 請求項5に記載の接続端子組立体において、
前記結合吸着部材は、個々の前記単位接続端子の前記端子部の先端から前記接着部までの間の中間位置と前記屈曲部の間の領域に配置されていることを特徴とする接続端子組立体。 - 請求項6に記載の接続端子組立体において、
前記結合吸着部材を含む前記接続端子組立体の全体の重心位置を前記接着部側へ投影した投影位置が、前記前記接続端子組立体の全体の接着範囲に内包されていることを特徴とする接続端子組立体。 - 電気部品が配置された回路基板と相手側回路基板を接続する接続端子組立体が「リフロープロセス」によってハンダ付けされた回路基板において、
前記接続端子組立体が請求項1乃至請求項7のいずれか1項に記載された接続端子組立体である
ことを特徴とする回路基板。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016190826A JP6783606B2 (ja) | 2016-09-29 | 2016-09-29 | 接続端子組立体、及びこの接続端子組立体を使用した回路基板 |
KR1020197007043A KR102229077B1 (ko) | 2016-09-29 | 2017-08-09 | 접속 단자 조립체 및 이 접속 단자 조립체를 사용한 회로 기판 |
PCT/JP2017/028877 WO2018061490A1 (ja) | 2016-09-29 | 2017-08-09 | 接続端子組立体、及びこの接続端子組立体を使用した回路基板 |
CN201780054043.XA CN109661753B (zh) | 2016-09-29 | 2017-08-09 | 连接端子组装体及使用了该连接端子组装体的电路基板 |
US16/329,749 US10770812B2 (en) | 2016-09-29 | 2017-08-09 | Connection terminal assembled body and circuit board using same connection terminal assembled body |
DE112017004895.8T DE112017004895T5 (de) | 2016-09-29 | 2017-08-09 | Zusammengebauter Verbindungsanschlusskörper und Nutzung von diesem gleichen montierten Verbindungsanschlusskörper durch Leiterplatte |
Applications Claiming Priority (1)
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JP2016190826A JP6783606B2 (ja) | 2016-09-29 | 2016-09-29 | 接続端子組立体、及びこの接続端子組立体を使用した回路基板 |
Publications (2)
Publication Number | Publication Date |
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JP2018055961A JP2018055961A (ja) | 2018-04-05 |
JP6783606B2 true JP6783606B2 (ja) | 2020-11-11 |
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JP2016190826A Active JP6783606B2 (ja) | 2016-09-29 | 2016-09-29 | 接続端子組立体、及びこの接続端子組立体を使用した回路基板 |
Country Status (6)
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US (1) | US10770812B2 (ja) |
JP (1) | JP6783606B2 (ja) |
KR (1) | KR102229077B1 (ja) |
CN (1) | CN109661753B (ja) |
DE (1) | DE112017004895T5 (ja) |
WO (1) | WO2018061490A1 (ja) |
Families Citing this family (1)
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US11765815B2 (en) * | 2020-12-23 | 2023-09-19 | GM Global Technology Operations LLC | Printed circuit board based solid state relay |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
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US3864014A (en) * | 1972-05-01 | 1975-02-04 | Amp Inc | Coined post for solder stripe |
NL8900920A (nl) * | 1989-04-13 | 1990-11-01 | Philips Nv | Inrichting bevattende een drager met openingen voor het plaatsen van pennen. |
DE69426344T2 (de) * | 1993-09-14 | 2001-08-09 | Zierick Mfg. Corp., Mount Kisco | Oberflächenmontierter elektrischer Verbinder |
GB9407137D0 (en) * | 1994-04-11 | 1994-06-01 | Amp Gmbh | Electrical connector suction platform for facilitating picking |
FR2721161B1 (fr) * | 1994-06-13 | 1996-09-06 | Valeo Electronique | Module électronique en technologie SMI et procédé de fabrication d'un tel module. |
JP3843514B2 (ja) * | 1995-12-15 | 2006-11-08 | イビデン株式会社 | 電子部品搭載用基板及びその製造方法 |
US5957739A (en) * | 1996-01-11 | 1999-09-28 | Autosplice Systems Inc. | Continuous electronic stamping with offset carrier |
US6471538B2 (en) * | 1998-11-30 | 2002-10-29 | Advantest Corp. | Contact structure and production method thereof and probe contact assembly using same |
US6997727B1 (en) * | 2003-03-14 | 2006-02-14 | Zierick Manufacturing Corp | Compliant surface mount electrical contacts for circuit boards and method of making and using same |
JP4100694B2 (ja) * | 2004-05-31 | 2008-06-11 | 日本航空電子工業株式会社 | コネクタ |
JP5628057B2 (ja) * | 2011-01-26 | 2014-11-19 | 新電元工業株式会社 | ピンヘッダー、電子機器および電子機器の製造方法 |
JP2015060958A (ja) | 2013-09-19 | 2015-03-30 | 日立オートモティブシステムズ株式会社 | リードフレーム、リードフレームを使用した電子制御装置及びリードフレーム搭載方法 |
CN203883183U (zh) * | 2014-06-14 | 2014-10-15 | 安费诺凯杰科技(深圳)有限公司 | 一种新型表贴连接器 |
KR101644123B1 (ko) * | 2014-10-07 | 2016-07-29 | 조인셋 주식회사 | 탄성 전기접촉단자 |
CN204538287U (zh) * | 2015-02-26 | 2015-08-05 | 泰科电子(上海)有限公司 | 导电端子 |
JP6258370B2 (ja) * | 2016-02-02 | 2018-01-10 | イリソ電子工業株式会社 | 可動コネクタ |
-
2016
- 2016-09-29 JP JP2016190826A patent/JP6783606B2/ja active Active
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2017
- 2017-08-09 CN CN201780054043.XA patent/CN109661753B/zh active Active
- 2017-08-09 US US16/329,749 patent/US10770812B2/en active Active
- 2017-08-09 WO PCT/JP2017/028877 patent/WO2018061490A1/ja active Application Filing
- 2017-08-09 KR KR1020197007043A patent/KR102229077B1/ko active IP Right Grant
- 2017-08-09 DE DE112017004895.8T patent/DE112017004895T5/de active Granted
Also Published As
Publication number | Publication date |
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DE112017004895T5 (de) | 2019-06-06 |
US20190221952A1 (en) | 2019-07-18 |
WO2018061490A1 (ja) | 2018-04-05 |
KR102229077B1 (ko) | 2021-03-18 |
JP2018055961A (ja) | 2018-04-05 |
CN109661753A (zh) | 2019-04-19 |
US10770812B2 (en) | 2020-09-08 |
CN109661753B (zh) | 2020-11-06 |
KR20190038631A (ko) | 2019-04-08 |
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