JP2018055961A - 接続端子組立体、及びこの接続端子組立体を使用した回路基板 - Google Patents
接続端子組立体、及びこの接続端子組立体を使用した回路基板 Download PDFInfo
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- H—ELECTRICITY
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- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
- H01R43/205—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve with a panel or printed circuit board
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49517—Additional leads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
- H01R12/718—Contact members provided on the PCB without an insulating housing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0263—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for positioning or holding parts during soldering or welding process
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10757—Bent leads
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- Coupling Device And Connection With Printed Circuit (AREA)
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Abstract
【解決手段】単位接続端子26が、回路基板21にハンダ付けされ長手方向に延びる接着部29と、長手方向に延びた接着部に対して略直交する方向に延び、相手側回路基板に接続される端子部30と、接着部と端子部を接続するように屈曲する屈曲部31と、屈曲部31より端子側に固定され自動機による吸着面を形成した合成樹脂製の吸着部28から構成されている。更に好ましくは、単位接続端子の全体の重心位置を接着部側へ投影した投影位置が、接着部の接着範囲に内包されている。
【選択図】図2
Description
また、結合吸着部材27を含む接続端子組立体25の重心位置が、金属回路基板21への接着部の接着範囲に内包されているので、接続端子組立体25を自立させてハンダ付け作業ができ、雇等の特別な治具を用いなくてもハンダ付けができるので生産性を高めることができるようになる。また、結合吸着部材27によって重心位置を低いほうに設定できるので、接続端子組立体25の座りが改善されて更に自立機能を高めることができるようになる。
Claims (8)
- 少なくとも1個の単位接続端子よりなる接続端子組立体の前記単位接続端子が、
回路基板にハンダ付けされ長手方向に延びる接着部と、
長手方向に延びた前記接着部に対して略直交する方向に延び、相手側回路基板に接続される端子部と、
前記接着部と前記端子部を接続するように屈曲する屈曲部と、
前記屈曲部より前記端子部側に固定され、自動機による吸着面を形成した合成樹脂製の吸着部材と
から構成されていることを特徴とする接続端子組立体。 - 請求項1に記載の接続端子組立体において、
前記吸着部材は、前記端子部の先端から前記接着部までの間の中間位置と前記屈曲部の間の領域に配置されていることを特徴とする接続端子組立体。 - 請求項2に記載の接続端子組立体において、
前記吸着部材を含む前記単位接続端子の全体の重心位置を前記接着部側へ投影した投影位置が、前記接着部の接着範囲に内包されていることを特徴とする接続端子組立体。 - 請求項3に記載の接続端子組立体において、
前記吸着部材から前記接着部までの間の任意の位置の幅が、前記吸着部から前記端子部までの幅より長いことを特徴とする接続端子組立体。 - 複数個の単位接続端子を組み合わせた接続端子組立体の個々の単位接続端子が、
回路基板にハンダ付けされ長手方向に延びた接着部と、
長手方向に延びた前記接着部に対して略直交する方向に延び、相手側回路基板に接続される端子部と、
前記接着部と前記端子部を接続するように屈曲する屈曲部とから構成されていると共に、
個々の前記単位接続端子の前記屈曲部より前記端子部側が、合成樹脂から作られた結合吸着部材によって一体的に結合され、しかも前記結合吸着部材の中央付近に自動機による吸着面を有する吸着部が形成されている
ことを特徴とする接続端子組立体。 - 請求項5に記載の接続端子組立体において、
前記結合吸着部材は、個々の前記単位接続端子の前記端子部の先端から前記接着部までの間の中間位置と前記屈曲部の間の領域に配置されていることを特徴とする接続端子組立体。 - 請求項6に記載の接続端子組立体において、
前記結合吸着部材を含む前記接続端子組立体の全体の重心位置を前記接着部側へ投影した投影位置が、前記前記接続端子組立体の全体の接着範囲に内包されていることを特徴とする接続端子組立体。 - 電気部品が配置された回路基板と相手側回路基板を接続する接続端子組立体が「リフロープロセス」によってハンダ付けされた回路基板において、
前記接続端子組立体が請求項1乃至請求項7のいずれか1項に記載された接続端子組立体であることを特徴とする回路基板。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016190826A JP6783606B2 (ja) | 2016-09-29 | 2016-09-29 | 接続端子組立体、及びこの接続端子組立体を使用した回路基板 |
KR1020197007043A KR102229077B1 (ko) | 2016-09-29 | 2017-08-09 | 접속 단자 조립체 및 이 접속 단자 조립체를 사용한 회로 기판 |
CN201780054043.XA CN109661753B (zh) | 2016-09-29 | 2017-08-09 | 连接端子组装体及使用了该连接端子组装体的电路基板 |
DE112017004895.8T DE112017004895T5 (de) | 2016-09-29 | 2017-08-09 | Zusammengebauter Verbindungsanschlusskörper und Nutzung von diesem gleichen montierten Verbindungsanschlusskörper durch Leiterplatte |
PCT/JP2017/028877 WO2018061490A1 (ja) | 2016-09-29 | 2017-08-09 | 接続端子組立体、及びこの接続端子組立体を使用した回路基板 |
US16/329,749 US10770812B2 (en) | 2016-09-29 | 2017-08-09 | Connection terminal assembled body and circuit board using same connection terminal assembled body |
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JP2016190826A JP6783606B2 (ja) | 2016-09-29 | 2016-09-29 | 接続端子組立体、及びこの接続端子組立体を使用した回路基板 |
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JP2018055961A true JP2018055961A (ja) | 2018-04-05 |
JP6783606B2 JP6783606B2 (ja) | 2020-11-11 |
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US (1) | US10770812B2 (ja) |
JP (1) | JP6783606B2 (ja) |
KR (1) | KR102229077B1 (ja) |
CN (1) | CN109661753B (ja) |
DE (1) | DE112017004895T5 (ja) |
WO (1) | WO2018061490A1 (ja) |
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US11765815B2 (en) * | 2020-12-23 | 2023-09-19 | GM Global Technology Operations LLC | Printed circuit board based solid state relay |
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FR2721161A1 (fr) * | 1994-06-13 | 1995-12-15 | Valeo Electronique | Module électronique en technologie SMI et procédé de fabrication d'un tel module. |
US5632629A (en) * | 1993-09-14 | 1997-05-27 | Zierick Manufacturing Corporation | Mount electrical connectors |
US5957739A (en) * | 1996-01-11 | 1999-09-28 | Autosplice Systems Inc. | Continuous electronic stamping with offset carrier |
JP2012156009A (ja) * | 2011-01-26 | 2012-08-16 | Shindengen Electric Mfg Co Ltd | ピンヘッダー、電子機器および電子機器の製造方法 |
JP2015060958A (ja) * | 2013-09-19 | 2015-03-30 | 日立オートモティブシステムズ株式会社 | リードフレーム、リードフレームを使用した電子制御装置及びリードフレーム搭載方法 |
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JP4100694B2 (ja) * | 2004-05-31 | 2008-06-11 | 日本航空電子工業株式会社 | コネクタ |
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KR101644123B1 (ko) * | 2014-10-07 | 2016-07-29 | 조인셋 주식회사 | 탄성 전기접촉단자 |
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-
2016
- 2016-09-29 JP JP2016190826A patent/JP6783606B2/ja active Active
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- 2017-08-09 CN CN201780054043.XA patent/CN109661753B/zh active Active
- 2017-08-09 WO PCT/JP2017/028877 patent/WO2018061490A1/ja active Application Filing
- 2017-08-09 KR KR1020197007043A patent/KR102229077B1/ko active IP Right Grant
- 2017-08-09 US US16/329,749 patent/US10770812B2/en active Active
- 2017-08-09 DE DE112017004895.8T patent/DE112017004895T5/de active Granted
Patent Citations (5)
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US5632629A (en) * | 1993-09-14 | 1997-05-27 | Zierick Manufacturing Corporation | Mount electrical connectors |
FR2721161A1 (fr) * | 1994-06-13 | 1995-12-15 | Valeo Electronique | Module électronique en technologie SMI et procédé de fabrication d'un tel module. |
US5957739A (en) * | 1996-01-11 | 1999-09-28 | Autosplice Systems Inc. | Continuous electronic stamping with offset carrier |
JP2012156009A (ja) * | 2011-01-26 | 2012-08-16 | Shindengen Electric Mfg Co Ltd | ピンヘッダー、電子機器および電子機器の製造方法 |
JP2015060958A (ja) * | 2013-09-19 | 2015-03-30 | 日立オートモティブシステムズ株式会社 | リードフレーム、リードフレームを使用した電子制御装置及びリードフレーム搭載方法 |
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WO2018061490A1 (ja) | 2018-04-05 |
US20190221952A1 (en) | 2019-07-18 |
DE112017004895T5 (de) | 2019-06-06 |
US10770812B2 (en) | 2020-09-08 |
KR20190038631A (ko) | 2019-04-08 |
KR102229077B1 (ko) | 2021-03-18 |
JP6783606B2 (ja) | 2020-11-11 |
CN109661753B (zh) | 2020-11-06 |
CN109661753A (zh) | 2019-04-19 |
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