JP6781998B1 - 基板収容容器 - Google Patents

基板収容容器 Download PDF

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Publication number
JP6781998B1
JP6781998B1 JP2020514642A JP2020514642A JP6781998B1 JP 6781998 B1 JP6781998 B1 JP 6781998B1 JP 2020514642 A JP2020514642 A JP 2020514642A JP 2020514642 A JP2020514642 A JP 2020514642A JP 6781998 B1 JP6781998 B1 JP 6781998B1
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JP
Japan
Prior art keywords
substrate
storage container
container
substrate storage
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2020514642A
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English (en)
Japanese (ja)
Other versions
JPWO2020184353A1 (ja
Inventor
秀洋 益子
秀洋 益子
Original Assignee
秀洋 益子
秀洋 益子
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 秀洋 益子, 秀洋 益子 filed Critical 秀洋 益子
Application granted granted Critical
Publication of JP6781998B1 publication Critical patent/JP6781998B1/ja
Publication of JPWO2020184353A1 publication Critical patent/JPWO2020184353A1/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0001—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor characterised by the choice of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/72—Heating or cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
    • B29C70/06—Fibrous reinforcements only
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67359—Closed carriers specially adapted for containing masks, reticles or pellicles

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
JP2020514642A 2019-03-08 2020-03-05 基板収容容器 Active JP6781998B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPPCT/JP2019/009223 2019-03-08
PCT/JP2019/009223 WO2020183511A1 (ja) 2019-03-08 2019-03-08 基板収容容器
PCT/JP2020/009290 WO2020184353A1 (ja) 2019-03-08 2020-03-05 基板収容容器

Publications (2)

Publication Number Publication Date
JP6781998B1 true JP6781998B1 (ja) 2020-11-11
JPWO2020184353A1 JPWO2020184353A1 (ja) 2021-03-18

Family

ID=72426236

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020514642A Active JP6781998B1 (ja) 2019-03-08 2020-03-05 基板収容容器

Country Status (4)

Country Link
JP (1) JP6781998B1 (ko)
KR (1) KR102438642B1 (ko)
CN (1) CN113544836B (ko)
WO (2) WO2020183511A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7537570B1 (ja) 2023-08-22 2024-08-21 ａｒｔｉｅｎｃｅ株式会社 電気電子包装材用熱可塑性樹脂組成物および電気電子包装材

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003341783A (ja) * 2002-05-28 2003-12-03 Fujitsu Ltd 基板収納装置
JP2007332271A (ja) * 2006-06-15 2007-12-27 Miraial Kk 高分子成形製品
JP2008532855A (ja) * 2005-02-27 2008-08-21 インテグリス・インコーポレーテッド 均圧化機能を有する基板容器
JP2010199354A (ja) * 2009-02-26 2010-09-09 Shin Etsu Polymer Co Ltd 基板収納容器
US20140264999A1 (en) * 2006-02-22 2014-09-18 Entegris, Inc. Substrate carriers and articles formed from compositions comprising carbon nanotubes

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4442816B2 (ja) * 2004-09-30 2010-03-31 信越ポリマー株式会社 基板収納容器
JP4889460B2 (ja) 2006-12-05 2012-03-07 信越ポリマー株式会社 半導体搬送容器用部品用導電性樹脂組成物及びこれを用いた半導体搬送容器用部品並びに半導体搬送容器
WO2008139880A1 (ja) * 2007-04-27 2008-11-20 Kuraray Co., Ltd. 透明導電膜および透明導電膜の製造方法
KR101170063B1 (ko) * 2007-07-10 2012-07-31 도꾸리쯔교세이호징 가가꾸 기쥬쯔 신꼬 기꼬 투명 도전성 박막과 그 제조 방법
JP2011100983A (ja) * 2009-10-07 2011-05-19 Shin Etsu Polymer Co Ltd 基板収納容器
JP5786556B2 (ja) * 2010-08-26 2015-09-30 三菱化学株式会社 樹脂成形品の製造方法
JP6433206B2 (ja) * 2014-09-03 2018-12-05 アキレス株式会社 テープフレーム付きウエハ用トレイ
KR20170100353A (ko) * 2016-02-25 2017-09-04 (주)코스탯아이앤씨 반도체 수납 트레이 및 반도체 수납 트레이용 커버
KR20190121985A (ko) * 2018-04-19 2019-10-29 주식회사 씨엔피솔루션즈 자외선 저항성이 강화된 대전방지 트레이 및 코팅액 조성물

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003341783A (ja) * 2002-05-28 2003-12-03 Fujitsu Ltd 基板収納装置
JP2008532855A (ja) * 2005-02-27 2008-08-21 インテグリス・インコーポレーテッド 均圧化機能を有する基板容器
US20140264999A1 (en) * 2006-02-22 2014-09-18 Entegris, Inc. Substrate carriers and articles formed from compositions comprising carbon nanotubes
JP2007332271A (ja) * 2006-06-15 2007-12-27 Miraial Kk 高分子成形製品
JP2010199354A (ja) * 2009-02-26 2010-09-09 Shin Etsu Polymer Co Ltd 基板収納容器

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7537570B1 (ja) 2023-08-22 2024-08-21 ａｒｔｉｅｎｃｅ株式会社 電気電子包装材用熱可塑性樹脂組成物および電気電子包装材

Also Published As

Publication number Publication date
JPWO2020184353A1 (ja) 2021-03-18
KR20200133794A (ko) 2020-11-30
CN113544836B (zh) 2023-02-28
WO2020183511A1 (ja) 2020-09-17
CN113544836A (zh) 2021-10-22
KR102438642B1 (ko) 2022-08-31
WO2020184353A1 (ja) 2020-09-17

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