JP6781998B1 - 基板収容容器 - Google Patents

基板収容容器 Download PDF

Info

Publication number
JP6781998B1
JP6781998B1 JP2020514642A JP2020514642A JP6781998B1 JP 6781998 B1 JP6781998 B1 JP 6781998B1 JP 2020514642 A JP2020514642 A JP 2020514642A JP 2020514642 A JP2020514642 A JP 2020514642A JP 6781998 B1 JP6781998 B1 JP 6781998B1
Authority
JP
Japan
Prior art keywords
substrate
storage container
container
substrate storage
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2020514642A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2020184353A1 (ja
Inventor
秀洋 益子
秀洋 益子
Original Assignee
秀洋 益子
秀洋 益子
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 秀洋 益子, 秀洋 益子 filed Critical 秀洋 益子
Application granted granted Critical
Publication of JP6781998B1 publication Critical patent/JP6781998B1/ja
Publication of JPWO2020184353A1 publication Critical patent/JPWO2020184353A1/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735Closed carriers
    • H01L21/67366Closed carriers characterised by materials, roughness, coatings or the like
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0001Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor characterised by the choice of material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/72Heating or cooling
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/04Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
    • B29C70/06Fibrous reinforcements only
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/66Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735Closed carriers
    • H01L21/67359Closed carriers specially adapted for containing masks, reticles or pellicles

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
JP2020514642A 2019-03-08 2020-03-05 基板収容容器 Active JP6781998B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPPCT/JP2019/009223 2019-03-08
PCT/JP2019/009223 WO2020183511A1 (ja) 2019-03-08 2019-03-08 基板収容容器
PCT/JP2020/009290 WO2020184353A1 (ja) 2019-03-08 2020-03-05 基板収容容器

Publications (2)

Publication Number Publication Date
JP6781998B1 true JP6781998B1 (ja) 2020-11-11
JPWO2020184353A1 JPWO2020184353A1 (ja) 2021-03-18

Family

ID=72426236

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020514642A Active JP6781998B1 (ja) 2019-03-08 2020-03-05 基板収容容器

Country Status (4)

Country Link
JP (1) JP6781998B1 (ko)
KR (1) KR102438642B1 (ko)
CN (1) CN113544836B (ko)
WO (2) WO2020183511A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7537570B1 (ja) 2023-08-22 2024-08-21 artience株式会社 電気電子包装材用熱可塑性樹脂組成物および電気電子包装材

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003341783A (ja) * 2002-05-28 2003-12-03 Fujitsu Ltd 基板収納装置
JP2007332271A (ja) * 2006-06-15 2007-12-27 Miraial Kk 高分子成形製品
JP2008532855A (ja) * 2005-02-27 2008-08-21 インテグリス・インコーポレーテッド 均圧化機能を有する基板容器
JP2010199354A (ja) * 2009-02-26 2010-09-09 Shin Etsu Polymer Co Ltd 基板収納容器
US20140264999A1 (en) * 2006-02-22 2014-09-18 Entegris, Inc. Substrate carriers and articles formed from compositions comprising carbon nanotubes

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4442816B2 (ja) * 2004-09-30 2010-03-31 信越ポリマー株式会社 基板収納容器
JP4889460B2 (ja) 2006-12-05 2012-03-07 信越ポリマー株式会社 半導体搬送容器用部品用導電性樹脂組成物及びこれを用いた半導体搬送容器用部品並びに半導体搬送容器
WO2008139880A1 (ja) * 2007-04-27 2008-11-20 Kuraray Co., Ltd. 透明導電膜および透明導電膜の製造方法
KR101170063B1 (ko) * 2007-07-10 2012-07-31 도꾸리쯔교세이호징 가가꾸 기쥬쯔 신꼬 기꼬 투명 도전성 박막과 그 제조 방법
JP2011100983A (ja) * 2009-10-07 2011-05-19 Shin Etsu Polymer Co Ltd 基板収納容器
JP5786556B2 (ja) * 2010-08-26 2015-09-30 三菱化学株式会社 樹脂成形品の製造方法
JP6433206B2 (ja) * 2014-09-03 2018-12-05 アキレス株式会社 テープフレーム付きウエハ用トレイ
KR20170100353A (ko) * 2016-02-25 2017-09-04 (주)코스탯아이앤씨 반도체 수납 트레이 및 반도체 수납 트레이용 커버
KR20190121985A (ko) * 2018-04-19 2019-10-29 주식회사 씨엔피솔루션즈 자외선 저항성이 강화된 대전방지 트레이 및 코팅액 조성물

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003341783A (ja) * 2002-05-28 2003-12-03 Fujitsu Ltd 基板収納装置
JP2008532855A (ja) * 2005-02-27 2008-08-21 インテグリス・インコーポレーテッド 均圧化機能を有する基板容器
US20140264999A1 (en) * 2006-02-22 2014-09-18 Entegris, Inc. Substrate carriers and articles formed from compositions comprising carbon nanotubes
JP2007332271A (ja) * 2006-06-15 2007-12-27 Miraial Kk 高分子成形製品
JP2010199354A (ja) * 2009-02-26 2010-09-09 Shin Etsu Polymer Co Ltd 基板収納容器

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7537570B1 (ja) 2023-08-22 2024-08-21 artience株式会社 電気電子包装材用熱可塑性樹脂組成物および電気電子包装材

Also Published As

Publication number Publication date
JPWO2020184353A1 (ja) 2021-03-18
KR20200133794A (ko) 2020-11-30
CN113544836B (zh) 2023-02-28
WO2020183511A1 (ja) 2020-09-17
CN113544836A (zh) 2021-10-22
KR102438642B1 (ko) 2022-08-31
WO2020184353A1 (ja) 2020-09-17

Similar Documents

Publication Publication Date Title
KR101223967B1 (ko) 펠리클 수납용기
JP4324944B2 (ja) 精密部材収納容器
US20050167312A1 (en) Composite substrate carrier
ITTO990450A1 (it) Sopporto di substrato composito, in particolare di fette o dischi
JPH0888266A (ja) ウェハーキャリヤ
US20140086712A1 (en) Transportng apparatus and processing apparatus
JP6781998B1 (ja) 基板収容容器
EP2537780B1 (en) Substrate storing container
US11056409B2 (en) Composite material and a semiconductor container made of the same
JP4927554B2 (ja) 基板コンテナおよび基板コンテナを製造する方法
EP3045973A1 (en) Container for storing photomask blanks
KR20170100353A (ko) 반도체 수납 트레이 및 반도체 수납 트레이용 커버
JP5901110B2 (ja) 面実装電子部品の搬送用トレー
JP2005321532A (ja) 基板収納ケース
JP7274083B2 (ja) 電気電子包装材用熱可塑性樹脂組成物及び成形体
TW201524866A (zh) 應用於晶圓/光罩載具之塑膠組合物及應用彼之光罩傳送盒
TWI333924B (en) Substrate container,method of dissipating static electricity therefrom, and method of making the same
KR20180074621A (ko) 반도체 수납 트레이 및 반도체 수납 트레이용 커버
JP2014154592A (ja) 収納容器及び収納容器の製造方法
Peirce et al. ESD Hazards in IC Handlers.
JP2017112132A (ja) 基板収納容器

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20200305

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20200305

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20200527

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20200617

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20200707

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20201006

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20201010

R150 Certificate of patent or registration of utility model

Ref document number: 6781998

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250