JP6781998B1 - 基板収容容器 - Google Patents
基板収容容器 Download PDFInfo
- Publication number
- JP6781998B1 JP6781998B1 JP2020514642A JP2020514642A JP6781998B1 JP 6781998 B1 JP6781998 B1 JP 6781998B1 JP 2020514642 A JP2020514642 A JP 2020514642A JP 2020514642 A JP2020514642 A JP 2020514642A JP 6781998 B1 JP6781998 B1 JP 6781998B1
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- storage container
- container
- substrate storage
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000003860 storage Methods 0.000 title claims description 32
- 239000000758 substrate Substances 0.000 claims abstract description 106
- 239000000463 material Substances 0.000 claims abstract description 56
- 239000004065 semiconductor Substances 0.000 claims abstract description 33
- 239000002109 single walled nanotube Substances 0.000 claims abstract description 32
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 31
- 229920005989 resin Polymers 0.000 claims abstract description 30
- 239000011347 resin Substances 0.000 claims abstract description 30
- 238000004519 manufacturing process Methods 0.000 claims abstract description 24
- 229920000515 polycarbonate Polymers 0.000 claims abstract description 18
- 239000004417 polycarbonate Substances 0.000 claims abstract description 18
- 235000012431 wafers Nutrition 0.000 claims description 41
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 18
- 229910052710 silicon Inorganic materials 0.000 claims description 18
- 239000010703 silicon Substances 0.000 claims description 18
- 238000000465 moulding Methods 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 12
- 238000002834 transmittance Methods 0.000 claims description 11
- 239000011521 glass Substances 0.000 claims description 9
- 238000001816 cooling Methods 0.000 claims description 8
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 4
- 239000004697 Polyetherimide Substances 0.000 claims description 4
- 150000001925 cycloalkenes Chemical class 0.000 claims description 4
- 238000002347 injection Methods 0.000 claims description 4
- 239000007924 injection Substances 0.000 claims description 4
- 229920002530 polyetherether ketone Polymers 0.000 claims description 4
- 229920001601 polyetherimide Polymers 0.000 claims description 4
- 239000004695 Polyether sulfone Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 229920006393 polyether sulfone Polymers 0.000 claims description 3
- 230000008569 process Effects 0.000 claims description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract description 16
- 229910052799 carbon Inorganic materials 0.000 abstract description 9
- 238000002156 mixing Methods 0.000 abstract description 6
- 229920006352 transparent thermoplastic Polymers 0.000 abstract description 6
- 239000010410 layer Substances 0.000 description 26
- 239000002048 multi walled nanotube Substances 0.000 description 16
- 230000000052 comparative effect Effects 0.000 description 11
- 230000005611 electricity Effects 0.000 description 10
- 230000003068 static effect Effects 0.000 description 10
- 229920005668 polycarbonate resin Polymers 0.000 description 9
- 239000004431 polycarbonate resin Substances 0.000 description 9
- 239000000203 mixture Substances 0.000 description 7
- 239000002041 carbon nanotube Substances 0.000 description 6
- 230000035699 permeability Effects 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- 229910021393 carbon nanotube Inorganic materials 0.000 description 5
- 239000002079 double walled nanotube Substances 0.000 description 5
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 238000001746 injection moulding Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 3
- 239000006229 carbon black Substances 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 230000015654 memory Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 101100148125 Chlamydomonas reinhardtii RSP2 gene Proteins 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910021389 graphene Inorganic materials 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 101000650777 Boana raniceps Raniseptin-3 Proteins 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 101000873785 Homo sapiens mRNA-decapping enzyme 1A Proteins 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229920006127 amorphous resin Polymers 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003738 black carbon Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010828 elution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 102100035856 mRNA-decapping enzyme 1A Human genes 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910021392 nanocarbon Inorganic materials 0.000 description 1
- 239000002071 nanotube Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 244000144985 peep Species 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- -1 polybutylene terephthalate Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000007669 thermal treatment Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0001—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor characterised by the choice of material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/72—Heating or cooling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
- B29C70/06—Fibrous reinforcements only
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67359—Closed carriers specially adapted for containing masks, reticles or pellicles
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPPCT/JP2019/009223 | 2019-03-08 | ||
PCT/JP2019/009223 WO2020183511A1 (ja) | 2019-03-08 | 2019-03-08 | 基板収容容器 |
PCT/JP2020/009290 WO2020184353A1 (ja) | 2019-03-08 | 2020-03-05 | 基板収容容器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP6781998B1 true JP6781998B1 (ja) | 2020-11-11 |
JPWO2020184353A1 JPWO2020184353A1 (ja) | 2021-03-18 |
Family
ID=72426236
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020514642A Active JP6781998B1 (ja) | 2019-03-08 | 2020-03-05 | 基板収容容器 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6781998B1 (ko) |
KR (1) | KR102438642B1 (ko) |
CN (1) | CN113544836B (ko) |
WO (2) | WO2020183511A1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7537570B1 (ja) | 2023-08-22 | 2024-08-21 | artience株式会社 | 電気電子包装材用熱可塑性樹脂組成物および電気電子包装材 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003341783A (ja) * | 2002-05-28 | 2003-12-03 | Fujitsu Ltd | 基板収納装置 |
JP2007332271A (ja) * | 2006-06-15 | 2007-12-27 | Miraial Kk | 高分子成形製品 |
JP2008532855A (ja) * | 2005-02-27 | 2008-08-21 | インテグリス・インコーポレーテッド | 均圧化機能を有する基板容器 |
JP2010199354A (ja) * | 2009-02-26 | 2010-09-09 | Shin Etsu Polymer Co Ltd | 基板収納容器 |
US20140264999A1 (en) * | 2006-02-22 | 2014-09-18 | Entegris, Inc. | Substrate carriers and articles formed from compositions comprising carbon nanotubes |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4442816B2 (ja) * | 2004-09-30 | 2010-03-31 | 信越ポリマー株式会社 | 基板収納容器 |
JP4889460B2 (ja) | 2006-12-05 | 2012-03-07 | 信越ポリマー株式会社 | 半導体搬送容器用部品用導電性樹脂組成物及びこれを用いた半導体搬送容器用部品並びに半導体搬送容器 |
WO2008139880A1 (ja) * | 2007-04-27 | 2008-11-20 | Kuraray Co., Ltd. | 透明導電膜および透明導電膜の製造方法 |
KR101170063B1 (ko) * | 2007-07-10 | 2012-07-31 | 도꾸리쯔교세이호징 가가꾸 기쥬쯔 신꼬 기꼬 | 투명 도전성 박막과 그 제조 방법 |
JP2011100983A (ja) * | 2009-10-07 | 2011-05-19 | Shin Etsu Polymer Co Ltd | 基板収納容器 |
JP5786556B2 (ja) * | 2010-08-26 | 2015-09-30 | 三菱化学株式会社 | 樹脂成形品の製造方法 |
JP6433206B2 (ja) * | 2014-09-03 | 2018-12-05 | アキレス株式会社 | テープフレーム付きウエハ用トレイ |
KR20170100353A (ko) * | 2016-02-25 | 2017-09-04 | (주)코스탯아이앤씨 | 반도체 수납 트레이 및 반도체 수납 트레이용 커버 |
KR20190121985A (ko) * | 2018-04-19 | 2019-10-29 | 주식회사 씨엔피솔루션즈 | 자외선 저항성이 강화된 대전방지 트레이 및 코팅액 조성물 |
-
2019
- 2019-03-08 WO PCT/JP2019/009223 patent/WO2020183511A1/ja active Application Filing
-
2020
- 2020-03-05 KR KR1020207030561A patent/KR102438642B1/ko active IP Right Grant
- 2020-03-05 JP JP2020514642A patent/JP6781998B1/ja active Active
- 2020-03-05 WO PCT/JP2020/009290 patent/WO2020184353A1/ja active Application Filing
- 2020-03-05 CN CN202080019173.1A patent/CN113544836B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003341783A (ja) * | 2002-05-28 | 2003-12-03 | Fujitsu Ltd | 基板収納装置 |
JP2008532855A (ja) * | 2005-02-27 | 2008-08-21 | インテグリス・インコーポレーテッド | 均圧化機能を有する基板容器 |
US20140264999A1 (en) * | 2006-02-22 | 2014-09-18 | Entegris, Inc. | Substrate carriers and articles formed from compositions comprising carbon nanotubes |
JP2007332271A (ja) * | 2006-06-15 | 2007-12-27 | Miraial Kk | 高分子成形製品 |
JP2010199354A (ja) * | 2009-02-26 | 2010-09-09 | Shin Etsu Polymer Co Ltd | 基板収納容器 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7537570B1 (ja) | 2023-08-22 | 2024-08-21 | artience株式会社 | 電気電子包装材用熱可塑性樹脂組成物および電気電子包装材 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2020184353A1 (ja) | 2021-03-18 |
KR20200133794A (ko) | 2020-11-30 |
CN113544836B (zh) | 2023-02-28 |
WO2020183511A1 (ja) | 2020-09-17 |
CN113544836A (zh) | 2021-10-22 |
KR102438642B1 (ko) | 2022-08-31 |
WO2020184353A1 (ja) | 2020-09-17 |
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