JP6767501B2 - モジュール - Google Patents
モジュール Download PDFInfo
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- JP6767501B2 JP6767501B2 JP2018552874A JP2018552874A JP6767501B2 JP 6767501 B2 JP6767501 B2 JP 6767501B2 JP 2018552874 A JP2018552874 A JP 2018552874A JP 2018552874 A JP2018552874 A JP 2018552874A JP 6767501 B2 JP6767501 B2 JP 6767501B2
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- semiconductor device
- power semiconductor
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- ceramic capacitor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
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- H—ELECTRICITY
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- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
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- H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
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- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/48—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zirconium or hafnium oxides, zirconates, zircon or hafnates
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- H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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Description
Pb(1−1.5a+e)AaBb(Zr1−xTix)1−cCeSicO3 + y・PbO
ここでAは、La,Nd,Y,Eu,Gd,Tb,Dy,Ho,Er,およびYbから成るグループから選択されていてよく、Cは、NiおよびCuからなるグループから選択されていてよい。そして、
0<a<0.12,
0.05≦x≦0.3,
0≦c<0.12,
0.001<e<0.12,
0≦y<1、
が満足されていてよい。
Pb(1−1.5a+e)AaBb(Zr1−xTix)1−cCeSicO3 + y・PbO
ここでAは、La,Nd,Y,Eu,Gd,Tb,Dy,Ho,Er,およびYbから成るグループから選択されており、Cは、NiおよびCuからなるグループから選択されている。そして、0<a<0.12,0.05≦x≦0.3,0≦c<0.12,0.001<e<0.12,0≦y<1である。
モジュールであって、
1つのパワー半導体デバイスと、
当該パワー半導体デバイスを冷却するように構成されている1つのセラミックコンデンサと、
を備えるモジュール。
第1の態様に記載のモジュールにおいて、
上記のセラミックコンデンサは、1つの担体を形成し、当該担体上に上記のパワー半導体デバイスが固定されている。
上記第1または第2の態様に記載のモジュールにおいて、
上記のセラミックコンデンサおよび上記のパワー半導体デバイスは、焼結処理で製造された、銀を含む1つの層を介して互いに結合されている。
上記第1〜第3の態様に記載のモジュールにおいて、
上記のセラミックコンデンサは、5kV/mm〜10kV/mmの電界強度の電界において、2000より大きい比誘電率を備え、そして少なくとも150°Cの温度に適合する、1つのセラミック材料を含む。
上記第1〜第4の態様に記載のモジュールにおいて、
上記のセラミックコンデンサは、以下の一般式
Pb(1−1.5a+e)AaBb(Zr1−xTix)1−cCeSicO3 + y・PbO
に示す材料を含み、
Aは、La,Nd,Y,Eu,Gd,Tb,Dy,Ho,ErおよびYbから成るグループから選択され、
Cは、Ni,およびCuから成るグループから選択されており、
0<a<0.12,
0.05≦x≦0.3,
0≦c<0.12,
0.001<e<0.12,
0≦y<1である。
上記第1〜第5の態様に記載のモジュールにおいて、
上記のセラミックコンデンサは、100W/mKより大きな熱伝導率を備える内部電極(複数)を備える。
上記第1〜第5の態様に記載のモジュールにおいて、
上記セラミックコンデンサは、銅を含む内部電極(複数)を備える。
上記第1〜第5の態様に記載のモジュールにおいて、
さらに上記のモジュールは、1つの制御ユニットを備え、この制御ユニットは、上記のパワー半導体デバイスの動作を制御するように構成されている。
第1の態様に記載のモジュールにおいて、
上記のパワー半導体デバイスは、上面を備え、当該上面上に上記のセラミックコンデンサが配設されており、そして
上記の上面の反対側に下面を備え、当該下面上に上記の制御ユニットが配設されている。
上記第1〜第9の態様に記載のモジュールにおいて、
上記のパワー半導体デバイスは1つのスイッチを備える。
上記第1〜第10の態様に記載のモジュールにおいて、
上記のセラミックコンデンサは、当該セラミックコンデンサが中間回路コンデンサまたはダンピングコンデンサとして作用するように、このパワー半導体デバイスと回路接続されている。
2 : パワー半導体デバイス
3 : コンデンサ
4 : セラミック材料
5 : 内部電極
6 : 上面
7 : 銀を含む層
8 : 下面
9 : 制御ユニット
Claims (25)
- モジュール(1)であって、
1つのパワー半導体デバイス(2)と、
前記パワー半導体デバイス(2)を冷却するように構成されている1つのセラミックコンデンサ(3)と、
を備え、
前記セラミックコンデンサ(3)と前記パワー半導体デバイス(2)とは、成分として少なくとも銀を含む1つの層(7)によって互いに結合され、
成分として銀を含む前記層(7)は、良好な熱伝導率を有し、その良好な熱伝導率によって前記セラミックコンデンサ(3)の冷却機能を支援する、
ことを特徴とするモジュール。 - 前記セラミックコンデンサ(3)は、鉛−ランタン−ジルコン−チタン酸塩のセラミックを含むことを特徴とする、請求項1に記載のモジュール。
- 前記層(7)を介して前記セラミックコンデンサ(3)と前記パワー半導体デバイス(2)とが互いに結合されており、当該層は少なくとも99重量%まで銀から成っていることを特徴とする、請求項1または2に記載のモジュール。
- 前記層(7)を介して前記セラミックコンデンサ(3)と前記パワー半導体デバイス(2)とが互いに結合されており、当該層は焼結処理で製造されていることを特徴とする、請求項1乃至3のいずれか1項に記載のモジュール。
- モジュール(1)であって、
1つのパワー半導体デバイス(2)と、
前記パワー半導体デバイス(2)を冷却するように構成されている1つのセラミックコンデンサ(3)と、
を備え、
前記セラミックコンデンサ(3)は、鉛−ランタン−ジルコン−チタン酸塩のセラミックを含み、
前記鉛−ランタン−ジルコン−チタン酸塩のセラミックは、高い熱伝導率を備え、前記セラミックコンデンサ(3)の冷却機能に貢献する、
ことを特徴とするモジュール。 - 前記セラミックコンデンサ(3)と前記パワー半導体デバイス(2)とは、成分として少なくとも銀を含む1つの層(7)によって互いに結合されていることを特徴とする、請求項5に記載のモジュール。
- 前記層(7)を介して前記セラミックコンデンサ(3)と前記パワー半導体デバイス(2)とが互いに結合されており、当該層は少なくとも99重量%まで銀から成っていることを特徴とする、請求項6に記載のモジュール。
- 前記層(7)を介して前記セラミックコンデンサ(3)と前記パワー半導体デバイス(2)とが互いに結合されており、当該層は焼結処理で製造されていることを特徴とする、請求項6または7に記載のモジュール。
- 前記セラミックコンデンサ(3)は、1つの担体を形成し、当該担体上に前記パワー半導体デバイス(2)が固定されていることを特徴とする、請求項1乃至8のいずれか1項に記載のモジュール。
- 前記セラミックコンデンサ(3)は、5kV/mm〜10kV/mmの電界強度の電界において、2000より大きい比誘電率を備え、そして少なくとも150°Cの温度に適合する、1つのセラミック材料を含むことを特徴とする、請求項1乃至9のいずれか1項に記載のモジュール。
- 請求項1乃至10のいずれか1項に記載のモジュールにおいて、
前記セラミックコンデンサ(3)は、以下の一般式
Pb(1-1.5a+e)AaBb(Zr1-xTix)1-cCeSicO3 + y・PbO
に示す材料を含み、
Aは、La,Nd,Y,Eu,Gd,Tb,Dy,Ho,ErおよびYbから成るグループから選択され、
Cは、Ni,およびCuから成るグループから選択されており、
0<a<0.12,
0.05≦x≦0.3,
0≦c<0.12,
0.001<e<0.12,
0≦y<1である、
ことを特徴とするモジュール。 - 前記セラミックコンデンサ(3)は、1つのセラミック多層デバイスであり、そして複数の内部電極(5)を備えることを特徴とする、請求項1乃至11のいずれか1項に記載のモジュール。
- 複数の前記内部電極は、100W/mKより大きな熱伝導率を備えることを特徴とする、請求項12に記載のモジュール。
- 複数の前記内部電極は銅を含むことを特徴とする、請求項12または13に記載のモジュール。
- 請求項1乃至14のいずれか1項に記載のモジュールにおいて、
前記モジュール(1)は、少なくとももう1つのパワー半導体デバイスを備え、
前記セラミックコンデンサ(3)は、前記少なくとももう1つのパワー半導体デバイス(2)を冷却するように構成されている、
ことを特徴とするモジュール。 - 請求項1乃至15のいずれか1項に記載のモジュールにおいて、
前記モジュール(1)は、少なくとももう1つのコンデンサを備え、
前記もう1つのコンデンサは、前記パワー半導体デバイス(2)を冷却するように構成されている、
ことを特徴とするモジュール。 - 請求項1乃至16のいずれか1項に記載のモジュールにおいて、
さらに前記モジュール(1)は、1つの制御ユニット(9)を備え、
前記制御ユニットは、前記パワー半導体デバイス(2)の動作を制御するように構成されている、
ことを特徴とするモジュール。 - 請求項17に記載のモジュールにおいて、
前記パワー半導体デバイス(2)は、上面(6)を備え、当該上面上に前記セラミックコンデンサ(3)が配設されており、
前記パワー半導体デバイス(2)は、前記上面(6)の反対側に下面(8)を備え、当該下面上に前記制御ユニット(9)が配設されている、
ことを特徴とするモジュール。 - 前記パワー半導体デバイス(2)は、1つのスイッチを備えることを特徴とする、請求項1乃至18のいずれか1項に記載のモジュール。
- 前記セラミックコンデンサ(3)は、当該セラミックコンデンサ(3)が中間回路コンデンサまたはダンピングコンデンサとして作用するように、前記パワー半導体デバイス(2)と回路接続されている、ことを特徴とする、請求項1乃至19のいずれか1項に記載のモジュール。
- 前記モジュールは、1つの回路基板上に固定されるように構成されていることを特徴とする、請求項1乃至20のいずれか1項に記載のモジュール。
- 前記セラミックコンデンサ(3)および前記パワー半導体デバイス(2)は、1つの共通なハウジング内に配設されていることを特徴とする、請求項1乃至21のいずれか1項に記載のモジュール。
- 前記パワー半導体デバイス(2)は、その中に複数の半導体素子が埋設されている1つの基板を備えることを特徴とする、請求項1乃至22のいずれか1項に記載のモジュール。
- 前記セラミックコンデンサ(3)は、2つの外部電極を備えることを特徴とする、請求項1乃至23のいずれか1項に記載のモジュール。
- 前記外部電極は、銅を含むか、または銅から成っていることを特徴とする、請求項24に記載のモジュール。
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CN108885940B (zh) | 2021-07-20 |
EP3440682B1 (de) | 2023-03-01 |
US11212947B2 (en) | 2021-12-28 |
EP4163942B1 (de) | 2024-02-21 |
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