JP6759176B2 - ノズル、樹脂成形装置、樹脂成形品の製造方法 - Google Patents
ノズル、樹脂成形装置、樹脂成形品の製造方法 Download PDFInfo
- Publication number
- JP6759176B2 JP6759176B2 JP2017210386A JP2017210386A JP6759176B2 JP 6759176 B2 JP6759176 B2 JP 6759176B2 JP 2017210386 A JP2017210386 A JP 2017210386A JP 2017210386 A JP2017210386 A JP 2017210386A JP 6759176 B2 JP6759176 B2 JP 6759176B2
- Authority
- JP
- Japan
- Prior art keywords
- nozzle
- resin
- molding
- liquid resin
- supply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
- B29C31/04—Feeding of the material to be moulded, e.g. into a mould cavity
- B29C31/042—Feeding of the material to be moulded, e.g. into a mould cavity using dispensing heads, e.g. extruders, placed over or apart from the moulds
- B29C31/044—Feeding of the material to be moulded, e.g. into a mould cavity using dispensing heads, e.g. extruders, placed over or apart from the moulds with moving heads for distributing liquid or viscous material into the moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/22—Component parts, details or accessories; Auxiliary operations
- B29C39/24—Feeding the material into the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/22—Component parts, details or accessories; Auxiliary operations
- B29C39/38—Heating or cooling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/22—Component parts, details or accessories; Auxiliary operations
- B29C39/44—Measuring, controlling or regulating
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Robotics (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017210386A JP6759176B2 (ja) | 2017-10-31 | 2017-10-31 | ノズル、樹脂成形装置、樹脂成形品の製造方法 |
KR1020180118101A KR102179109B1 (ko) | 2017-10-31 | 2018-10-04 | 노즐, 수지 성형 장치, 수지 성형품의 제조 방법 |
CN201811234295.3A CN109719879B (zh) | 2017-10-31 | 2018-10-23 | 喷嘴、树脂成形装置、树脂成形品的制造方法 |
TW107137899A TWI712479B (zh) | 2017-10-31 | 2018-10-26 | 噴嘴、樹脂成形裝置、樹脂成形品的製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017210386A JP6759176B2 (ja) | 2017-10-31 | 2017-10-31 | ノズル、樹脂成形装置、樹脂成形品の製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2019081320A JP2019081320A (ja) | 2019-05-30 |
JP2019081320A5 JP2019081320A5 (zh) | 2019-12-12 |
JP6759176B2 true JP6759176B2 (ja) | 2020-09-23 |
Family
ID=66295420
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017210386A Active JP6759176B2 (ja) | 2017-10-31 | 2017-10-31 | ノズル、樹脂成形装置、樹脂成形品の製造方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6759176B2 (zh) |
KR (1) | KR102179109B1 (zh) |
CN (1) | CN109719879B (zh) |
TW (1) | TWI712479B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102583555B1 (ko) * | 2020-12-09 | 2023-09-26 | 세메스 주식회사 | 처리액 공급 유닛을 포함하는 기판 처리 장치 및 기판 처리 방법 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63257620A (ja) * | 1987-04-16 | 1988-10-25 | Sumitomo Heavy Ind Ltd | 金型温度制御装置 |
JPH03176113A (ja) * | 1989-12-05 | 1991-07-31 | Nissei Plastics Ind Co | 射出成形機のノズル用熱電対及びその取付方法並びに熱電対を具備する射出成形機ノズル |
JPH0437443A (ja) * | 1990-05-31 | 1992-02-07 | Nippon Steel Corp | 分岐型薄板鋳造用ノズルの成形方法 |
JP2002003275A (ja) * | 2000-06-20 | 2002-01-09 | Tokai Carbon Co Ltd | 光不透過性SiC成形体及びその製造方法 |
US7160101B2 (en) * | 2003-03-20 | 2007-01-09 | Mold-Masters Limited | Apparatus for heating a nozzle with radiant energy |
JP2005131951A (ja) * | 2003-10-30 | 2005-05-26 | Takeshi Oishi | 成形機 |
US7914271B2 (en) * | 2007-11-29 | 2011-03-29 | Husky Injection Molding Systems Ltd. | Gate insert heating and cooling |
JP2012232437A (ja) | 2011-04-28 | 2012-11-29 | Sodick Co Ltd | 液状樹脂供給機構、及び当該液状樹脂供給機構が備わった圧縮成形装置 |
JP6104787B2 (ja) * | 2013-12-18 | 2017-03-29 | Towa株式会社 | 樹脂成形装置及び樹脂成形方法 |
US9735043B2 (en) * | 2013-12-20 | 2017-08-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor packaging structure and process |
JP6549478B2 (ja) * | 2015-11-30 | 2019-07-24 | Towa株式会社 | 吐出装置、樹脂成形装置、吐出方法及び樹脂成型品の製造方法 |
-
2017
- 2017-10-31 JP JP2017210386A patent/JP6759176B2/ja active Active
-
2018
- 2018-10-04 KR KR1020180118101A patent/KR102179109B1/ko active IP Right Grant
- 2018-10-23 CN CN201811234295.3A patent/CN109719879B/zh active Active
- 2018-10-26 TW TW107137899A patent/TWI712479B/zh active
Also Published As
Publication number | Publication date |
---|---|
JP2019081320A (ja) | 2019-05-30 |
TWI712479B (zh) | 2020-12-11 |
CN109719879A (zh) | 2019-05-07 |
KR20190049450A (ko) | 2019-05-09 |
KR102179109B1 (ko) | 2020-11-16 |
TW201918355A (zh) | 2019-05-16 |
CN109719879B (zh) | 2021-06-01 |
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