JP6745409B2 - 選択的に接着される抵抗力覚センサ - Google Patents
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- G06F3/04144—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using force sensing means to determine a position using an array of force sensing means
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Description
本出願は、2017年4月14日に出願された「TOUCH SENSOR HAVING SECTIONED FLEXIBLE HUMAN INTERACTIVE ELEMENTS FACING SENSOR ELEMENTS AND EACH SECTIONAL ELEMENT SELECTIVELY ATTACHED TO PLURALITY OF ADHESION REGIONS DISTRIBUTED ACROSS AREA OF A SENSOR PAD AND METHODOLOGY FOR MAKING SAME」と題する米国仮特許出願第62/485893号明細書、および2018年4月13日に出願された「SELECTIVELY ADHERED RESISTIVE FORCE SENSOR」と題する米国非仮特許出願第15/952388号明細書に基づく優先権を主張し、各々の開示は、それらの全体が、参照によって本明細書に組み込まれる。
Claims (18)
- 導電層を備える柔軟な膜であって、前記柔軟な膜および前記導電層は、選択的に接着される力覚センサを形成する、該柔軟な膜と、
センサ電極および接着ポストを備えるプリント回路板であって、前記センサ電極は、前記導電層に選択的に接着される、該プリント回路板と
を備え、
前記センサ電極と前記導電層との間の選択的に接着される領域は、実質的なゼロギャップとして構成され、および、前記柔軟な膜を歪曲または押圧するように力が適用されることにより、前記実質的なゼロギャップを介して、前記導電層と前記センサ電極との接触に基づいて電気経路を生成することを特徴とするセンサデバイス。 - 前記導電層は、第1の領域と、第2の領域とに分割されることを特徴とする請求項1に記載のセンサデバイス。
- 前記接着ポストは、前記第1の領域に選択的に固定されることを特徴とする請求項2に記載のセンサデバイス。
- 前記接着ポストは、前記第2の領域に選択的に固定されることを特徴とする請求項2に記載のセンサデバイス。
- 前記柔軟な膜、前記プリント回路板、および前記接着ポストは、空隙を囲い込むことを特徴とする請求項1に記載のセンサデバイス。
- 力集中要素は、前記柔軟な膜の第1の表面上に形成されることを特徴とする請求項1に記載のセンサデバイス。
- 前記力集中要素は、前記センサ電極に近接するように、前記柔軟な膜の前記第1の表面上に位置付けられることを特徴とする請求項6に記載のセンサデバイス。
- プロセッサと、
前記プロセッサによって実行されたときに、
選択的に接着される力覚センサを作製するための柔軟な膜および導電層を、センサ電極および接着ポストを備える第1の表面へ適用することと、
前記柔軟な膜および前記導電層を、前記第1の表面上の前記センサ電極および前記接着ポストへ選択的に接着することであって、前記センサ電極と前記導電層との間の選択的に接着される領域は、実質的なゼロギャップとして構成され、
前記実質的なゼロギャップを介して、前記導電層と前記センサ電極との間の接触に基づいて電気経路が生成されるように、前記導電層を前記第1の表面上の前記センサ電極から切り離すことと
を含む動作の実行をする実行可能命令を記憶するメモリと
を備えたことを特徴とする製作システム。 - 前記導電層は、未硬化の導電ポリマ複合物であることを特徴とする請求項8に記載の製作システム。
- 前記導電層は、部分的に硬化させられた導電ポリマであることを特徴とする請求項8に記載の製作システム。
- 前記センサ電極は、センサ電極のアレイ内の第1のセンサ電極であることを特徴とする請求項8に記載の製作システム。
- 前記センサ電極のアレイは、プリント回路板上にパターン化されることを特徴とする請求項11に記載の製作システム。
- 前記導電層は、前記センサ電極のアレイ上に適用されることを特徴とする請求項11に記載の製作システム。
- 前記接着ポストは、プリント回路板上に選択的にパターン化されることを特徴とする請求項8に記載の製作システム。
- 前記第1の表面は、センサ電極のアレイを備え、前記動作は、前記導電層が前記センサ電極のアレイに接着されたとの決定に応答して、前記導電層をセンサ電極の前記アレイから切り離すための前記導電層の機械的動揺を実行することを含むことを特徴とする請求項8に記載の製作システム。
- 前記第1の表面は、センサ電極のアレイを備え、前記動作は、前記導電層が前記センサ電極のアレイに接着されたとの決定に応答して、前記導電層をセンサ電極の前記アレイから切り離すための前記導電層への熱衝撃を実行することを含むことを特徴とする請求項8に記載の製作システム。
- プロセッサによって実行されたときに、
選択的に接着される力覚センサを作製するための柔軟な膜および導電層を備えた積層を、第1の表面へ適用することであって、前記第1の表面は、プリント回路板上にパターン化されたセンサ電極のグループと、前記プリント回路板上に形成された選択的に位置付けられたポストとを備える、該適用することと、
前記導電層および前記柔軟な膜を、前記センサ電極のグループおよび前記選択的に位置付けられたポストへ接着することであって、前記センサ電極のグループは、前記センサ電極のグループと前記導電層との間の選択的に接着される層が実質的なゼロギャップとして構成されるように、前記導電層に選択的に接着され、
前記実質的なゼロギャップを介して、前記センサ電極のグループと接触する前記導電層に基づいて電気経路が生成されるように、前記導電層および前記柔軟な膜を前記プリント回路上の前記センサ電極のグループから切り離すことと
を含む動作の実行をする実行可能命令を含むことを特徴とする機械可読記憶媒体。 - 前記動作は、前記導電層および前記柔軟な膜は、前記センサ電極のグループを備えるセンサ電極に接着されているとの決定に応答して、機械的動揺の実施を通して前記導電層および前記柔軟な膜を前記センサ電極から切り離すことを実行する含むことを特徴とする請求項17に記載の機械可読記憶媒体。
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020016550A (ja) * | 2018-07-25 | 2020-01-30 | 凸版印刷株式会社 | センサシート及びその製造方法 |
US11797119B2 (en) | 2017-04-14 | 2023-10-24 | Sensel, Inc. | Selectively adhered resistive force sensor |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102473527B1 (ko) * | 2015-12-21 | 2022-12-01 | 엘지디스플레이 주식회사 | 전자 기기 |
KR102498624B1 (ko) * | 2018-05-28 | 2023-02-10 | 삼성디스플레이 주식회사 | 압력센서 모듈 및 이를 포함하는 표시장치 |
KR102554586B1 (ko) * | 2018-07-27 | 2023-07-12 | 삼성디스플레이 주식회사 | 압력 센서와 그를 포함한 표시 장치 |
JP2020052470A (ja) * | 2018-09-21 | 2020-04-02 | 富士通コンポーネント株式会社 | タッチパネル |
US10880990B2 (en) * | 2018-11-13 | 2020-12-29 | Synaptics Incorporated | Three layer force pad |
KR20200115793A (ko) * | 2019-03-26 | 2020-10-08 | 삼성디스플레이 주식회사 | 표시 패널 |
LU102398B1 (en) * | 2021-01-11 | 2022-07-11 | Innovationlab Gmbh | Sensor device |
WO2023012660A1 (en) * | 2021-08-05 | 2023-02-09 | 3M Innovative Properties Company | Triboelectric film laminate based on conductive primer |
JP7322933B2 (ja) * | 2021-09-14 | 2023-08-08 | カシオ計算機株式会社 | 電子機器、利き手判定方法およびプログラム |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4314227A (en) | 1979-09-24 | 1982-02-02 | Eventoff Franklin Neal | Electronic pressure sensitive transducer apparatus |
JPS6164618A (ja) * | 1984-09-06 | 1986-04-03 | Taiyo Yuden Co Ltd | 部品配列装置 |
US5296837A (en) | 1992-07-10 | 1994-03-22 | Interlink Electronics, Inc. | Stannous oxide force transducer and composition |
US5802911A (en) | 1994-09-13 | 1998-09-08 | Tokyo Gas Co., Ltd. | Semiconductor layer pressure switch |
LU90286B1 (fr) | 1998-09-11 | 2000-03-13 | Iee Sarl | Capteur de force |
US6909354B2 (en) | 2001-02-08 | 2005-06-21 | Interlink Electronics, Inc. | Electronic pressure sensitive transducer apparatus and method for manufacturing same |
JP4260406B2 (ja) | 2002-02-14 | 2009-04-30 | 富士通コンポーネント株式会社 | 押圧方向検出センサ及びこれを用いた入力装置 |
JP3986985B2 (ja) | 2003-03-25 | 2007-10-03 | 株式会社デンソー | 感圧抵抗体及び感圧センサ |
EP1492136A1 (de) | 2003-06-23 | 2004-12-29 | IEE International Electronics & Engineering S.A.R.L. | Drucksensor in Folienbauweise |
WO2005025857A1 (ja) * | 2003-09-10 | 2005-03-24 | Zeon Corporation | 樹脂複合フィルム |
US7176889B2 (en) | 2004-05-21 | 2007-02-13 | Interlink Electronics, Inc. | Force sensing pointing device with click function |
US7323355B2 (en) * | 2005-03-23 | 2008-01-29 | Freescale Semiconductor, Inc. | Method of forming a microelectronic device |
JP5135824B2 (ja) | 2007-02-21 | 2013-02-06 | パナソニック株式会社 | 慣性力センサ素子の製造方法 |
JP2010015793A (ja) | 2008-07-03 | 2010-01-21 | Citizen Electronics Co Ltd | タクトスイッチ |
JP5056702B2 (ja) | 2008-09-29 | 2012-10-24 | カシオ計算機株式会社 | 液晶表示素子及び液晶表示装置 |
US10570005B2 (en) | 2008-12-16 | 2020-02-25 | Massachusetts Institute Of Technology | Method and apparatus for release-assisted microcontact printing of MEMS |
TWI395121B (zh) | 2009-03-13 | 2013-05-01 | Tpk Touch Solutions Inc | 感壓式觸控裝置 |
US8638316B2 (en) | 2011-03-11 | 2014-01-28 | Cypress Semiconductor Corporation | Two prong capacitive sensor pattern |
US9460029B2 (en) | 2012-03-02 | 2016-10-04 | Microsoft Technology Licensing, Llc | Pressure sensitive keys |
EP2849861A4 (en) | 2012-05-15 | 2016-04-13 | Microsoft Technology Licensing Llc | MANUFACTURE OF AN INPUT DEVICE |
US9459160B2 (en) | 2012-06-13 | 2016-10-04 | Microsoft Technology Licensing, Llc | Input device sensor configuration |
US9001082B1 (en) | 2013-09-27 | 2015-04-07 | Sensel, Inc. | Touch sensor detector system and method |
CA2950504A1 (en) * | 2016-11-01 | 2018-05-01 | ROLI Limited | User interface device |
US11797119B2 (en) | 2017-04-14 | 2023-10-24 | Sensel, Inc. | Selectively adhered resistive force sensor |
-
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11797119B2 (en) | 2017-04-14 | 2023-10-24 | Sensel, Inc. | Selectively adhered resistive force sensor |
JP2020016550A (ja) * | 2018-07-25 | 2020-01-30 | 凸版印刷株式会社 | センサシート及びその製造方法 |
JP7083111B2 (ja) | 2018-07-25 | 2022-06-10 | 凸版印刷株式会社 | センサシート及びその製造方法 |
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