CN113169072A - 电子器件及其制作方法 - Google Patents
电子器件及其制作方法 Download PDFInfo
- Publication number
- CN113169072A CN113169072A CN201880097637.3A CN201880097637A CN113169072A CN 113169072 A CN113169072 A CN 113169072A CN 201880097637 A CN201880097637 A CN 201880097637A CN 113169072 A CN113169072 A CN 113169072A
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Laminated Bodies (AREA)
Abstract
本发明提供了一种电子器件及其制作方法。所述电子器件的制作方法包括如下步骤：提供刚性基板(101)；在所述刚性基板上设置预延展的形变层；在所述形变层上形成功能层，以获得电子器件(103)；以及将所述电子器件与所述刚性基板分离(105)。本发明的电子器件的制作方法，制备工艺简单。
Description
PCT国内申请，说明书已公开。
Claims (20)
- PCT国内申请，权利要求书已公开。
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2018/123098 WO2020132802A1 (zh) | 2018-12-24 | 2018-12-24 | 电子器件及其制作方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113169072A true CN113169072A (zh) | 2021-07-23 |
Family
ID=71125893
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880097637.3A Pending CN113169072A (zh) | 2018-12-24 | 2018-12-24 | 电子器件及其制作方法 |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN113169072A (zh) |
| WO (1) | WO2020132802A1 (zh) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140305683A1 (en) * | 2013-04-11 | 2014-10-16 | Zhen Ding Technology Co., Ltd. | Compact rigid-flexible printed circuit board and method for manufacturing same |
| CN106847707A (zh) * | 2017-01-18 | 2017-06-13 | 华中科技大学 | 一种基于电流体喷印技术制备可延展岛桥结构的方法 |
| CN107565064A (zh) * | 2017-07-28 | 2018-01-09 | 武汉华星光电半导体显示技术有限公司 | 柔性显示器的制作方法以及制作柔性显示器的基板 |
| CN107993576A (zh) * | 2017-11-27 | 2018-05-04 | 深圳市华星光电技术有限公司 | 柔性显示面板的制作方法及柔性显示装置的制作方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101547057B1 (ko) * | 2014-02-12 | 2015-08-24 | 한국과학기술원 | 버퍼층을 이용한 나노제너레이터 분리 방법 및 이를 이용한 플렉서블 나노제너레이터 제조방법 |
| CN108242424B (zh) * | 2016-12-26 | 2019-09-03 | 京东方科技集团股份有限公司 | 柔性面板的制作方法、柔性面板及显示装置 |
| CN108232012B (zh) * | 2018-02-02 | 2021-07-06 | Tcl华星光电技术有限公司 | 柔性显示面板的制作方法及柔性显示装置的制作方法 |
-
2018
- 2018-12-24 CN CN201880097637.3A patent/CN113169072A/zh active Pending
- 2018-12-24 WO PCT/CN2018/123098 patent/WO2020132802A1/zh active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140305683A1 (en) * | 2013-04-11 | 2014-10-16 | Zhen Ding Technology Co., Ltd. | Compact rigid-flexible printed circuit board and method for manufacturing same |
| CN106847707A (zh) * | 2017-01-18 | 2017-06-13 | 华中科技大学 | 一种基于电流体喷印技术制备可延展岛桥结构的方法 |
| CN107565064A (zh) * | 2017-07-28 | 2018-01-09 | 武汉华星光电半导体显示技术有限公司 | 柔性显示器的制作方法以及制作柔性显示器的基板 |
| CN107993576A (zh) * | 2017-11-27 | 2018-05-04 | 深圳市华星光电技术有限公司 | 柔性显示面板的制作方法及柔性显示装置的制作方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020132802A1 (zh) | 2020-07-02 |
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| PB01 | Publication | ||
| PB01 | Publication | ||
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20210723 |