JP6741787B2 - 照明ビームの位置ずれの補償のためのシステムおよび方法 - Google Patents

照明ビームの位置ずれの補償のためのシステムおよび方法 Download PDF

Info

Publication number
JP6741787B2
JP6741787B2 JP2018557327A JP2018557327A JP6741787B2 JP 6741787 B2 JP6741787 B2 JP 6741787B2 JP 2018557327 A JP2018557327 A JP 2018557327A JP 2018557327 A JP2018557327 A JP 2018557327A JP 6741787 B2 JP6741787 B2 JP 6741787B2
Authority
JP
Japan
Prior art keywords
corrected
zero
offset
component
motors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018557327A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019523981A5 (enExample
JP2019523981A (ja
Inventor
ジーウェイ スティーヴ シュー
ジーウェイ スティーヴ シュー
ユーリ ユディツキー
ユーリ ユディツキー
フランク リー
フランク リー
ティモシー スウィッシャー
ティモシー スウィッシャー
クワン オーイェン
クワン オーイェン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KLA Corp
Original Assignee
KLA Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KLA Corp filed Critical KLA Corp
Publication of JP2019523981A publication Critical patent/JP2019523981A/ja
Publication of JP2019523981A5 publication Critical patent/JP2019523981A5/ja
Application granted granted Critical
Publication of JP6741787B2 publication Critical patent/JP6741787B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8806Specially adapted optical and illumination features
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501Semiconductor wafers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10Scanning systems
    • G02B26/108Scanning systems having one or more prisms as scanning elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10Measuring as part of the manufacturing process
    • H01L22/12Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/24Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Mounting And Adjusting Of Optical Elements (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
  • Slot Machines And Peripheral Devices (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2018557327A 2016-05-02 2017-04-28 照明ビームの位置ずれの補償のためのシステムおよび方法 Active JP6741787B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201662330756P 2016-05-02 2016-05-02
US62/330,756 2016-05-02
US15/477,885 US10495579B2 (en) 2016-05-02 2017-04-03 System and method for compensation of illumination beam misalignment
US15/477,885 2017-04-03
PCT/US2017/030258 WO2017192403A1 (en) 2016-05-02 2017-04-28 System and method for compensation of illumination beam misalignment

Publications (3)

Publication Number Publication Date
JP2019523981A JP2019523981A (ja) 2019-08-29
JP2019523981A5 JP2019523981A5 (enExample) 2020-06-11
JP6741787B2 true JP6741787B2 (ja) 2020-08-19

Family

ID=60203214

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018557327A Active JP6741787B2 (ja) 2016-05-02 2017-04-28 照明ビームの位置ずれの補償のためのシステムおよび方法

Country Status (9)

Country Link
US (1) US10495579B2 (enExample)
JP (1) JP6741787B2 (enExample)
KR (1) KR102190345B1 (enExample)
CN (1) CN109075099B (enExample)
DE (1) DE112017002293B4 (enExample)
IL (1) IL262231B (enExample)
SG (1) SG11201806925PA (enExample)
TW (1) TWI728104B (enExample)
WO (1) WO2017192403A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10365211B2 (en) * 2017-09-26 2019-07-30 Kla-Tencor Corporation Systems and methods for metrology beam stabilization
DE102020209268B3 (de) 2020-07-22 2021-10-14 Hochschule Emden/Leer Optisches System
CN117110311B (zh) * 2022-05-17 2025-09-12 深圳中科飞测科技股份有限公司 一种光学检测系统及图像动态对准方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60221720A (ja) * 1984-04-18 1985-11-06 Fuji Photo Film Co Ltd 光ビ−ム走査装置
US4696047A (en) 1985-02-28 1987-09-22 Texas Instruments Incorporated Apparatus for automatically inspecting electrical connecting pins
US6618421B2 (en) 1998-07-18 2003-09-09 Cymer, Inc. High repetition rate gas discharge laser with precise pulse timing control
JP2001334376A (ja) 2000-05-26 2001-12-04 Nec Toyama Ltd レーザ加工装置及びレーザ光スポット位置補正方法
JP2003179142A (ja) 2001-12-10 2003-06-27 Nec Microsystems Ltd ジッタ検査回路を搭載した半導体装置およびそのジッタ検査方法
US6831736B2 (en) 2002-10-07 2004-12-14 Applied Materials Israel, Ltd. Method of and apparatus for line alignment to compensate for static and dynamic inaccuracies in scanning
US6940879B2 (en) 2002-12-06 2005-09-06 New Focus, Inc. External cavity laser with dispersion compensation for mode-hop-free tuning
US7307711B2 (en) * 2004-10-29 2007-12-11 Hitachi Via Mechanics (Usa), Inc. Fluorescence based laser alignment and testing of complex beam delivery systems and lenses
US7321114B2 (en) * 2005-03-10 2008-01-22 Hitachi Via Mechanics, Ltd. Apparatus and method for beam drift compensation
JP4908925B2 (ja) * 2006-02-08 2012-04-04 株式会社日立ハイテクノロジーズ ウェハ表面欠陥検査装置およびその方法
KR20080014385A (ko) 2006-08-11 2008-02-14 동부일렉트로닉스 주식회사 레이저 빔 위치 자동 조정 장치 및 이를 이용한 레이저 빔위치 자동 조정 방법
US8379204B1 (en) 2007-08-17 2013-02-19 Gsi Group Corporation System and method for automatic laser beam alignment
JP5801558B2 (ja) 2008-02-26 2015-10-28 スリーエム イノベイティブ プロパティズ カンパニー 多光子露光システム
JP5331586B2 (ja) * 2009-06-18 2013-10-30 株式会社日立ハイテクノロジーズ 欠陥検査装置および検査方法
US9068952B2 (en) * 2009-09-02 2015-06-30 Kla-Tencor Corporation Method and apparatus for producing and measuring dynamically focussed, steered, and shaped oblique laser illumination for spinning wafer inspection system
JP5134603B2 (ja) * 2009-09-09 2013-01-30 株式会社日立ハイテクノロジーズ 光ビーム調整方法及び光ビーム調整装置
KR20110050821A (ko) 2009-11-09 2011-05-17 삼성전자주식회사 지터를 감소시킬 수 있는 dll회로 및 이를 포함하는 반도체 장치
WO2012023211A1 (ja) 2010-08-20 2012-02-23 富士通株式会社 半導体装置
US8995746B2 (en) 2013-03-15 2015-03-31 KLA—Tencor Corporation Image synchronization of scanning wafer inspection system

Also Published As

Publication number Publication date
CN109075099B (zh) 2023-07-14
SG11201806925PA (en) 2018-11-29
US20170336329A1 (en) 2017-11-23
KR20180132923A (ko) 2018-12-12
DE112017002293B4 (de) 2025-06-05
IL262231B (en) 2021-06-30
DE112017002293T5 (de) 2019-02-14
US10495579B2 (en) 2019-12-03
WO2017192403A1 (en) 2017-11-09
TWI728104B (zh) 2021-05-21
CN109075099A (zh) 2018-12-21
TW201743048A (zh) 2017-12-16
KR102190345B1 (ko) 2020-12-11
JP2019523981A (ja) 2019-08-29
IL262231A (en) 2018-11-29

Similar Documents

Publication Publication Date Title
KR102448698B1 (ko) 오버레이 계측을 위한 국부적인 텔레센트릭시티와 초점 최적화
US10816648B2 (en) Methods and systems for LIDAR optics alignment
US9492889B2 (en) Laser processing machine
CN101636696B (zh) 微光刻投射曝光设备的照明系统中多镜阵列的监测方法和设备
CN116724225B (zh) 用于计量的光瞳平面光束扫描
CN110062678A (zh) 包括两个窗口、光学元件和xy-偏转装置的偏转单元
JP6741787B2 (ja) 照明ビームの位置ずれの補償のためのシステムおよび方法
CN107003619B (zh) 投影系统、光刻设备及其控制方法
KR102173946B1 (ko) 디스플레이 패널 커팅용 레이져 가공 동축 비젼시스템
KR20210025130A (ko) 다수의 파장을 사용하는 다수의 작업 거리 높이 센서
NL2008529C2 (en) Method and arrangement for the adjustment of characteristics of a beam bundle of high-energy radiation emitted from a plasma.
CN117110311B (zh) 一种光学检测系统及图像动态对准方法
CN118435024A (zh) 特别高的目标计量
KR102019488B1 (ko) 레이저 가공 장치 및 레이저 가공 방법
JP2019523981A5 (enExample)
KR101566347B1 (ko) 기판검사장치
JP5361425B2 (ja) 光伝送装置
WO2013051147A1 (ja) 画像取得装置の調整方法、画像取得装置および画像取得装置の製造方法
JP2024165098A (ja) 光軸調整装置、レーザ照準装置及び光軸調整方法
WO2025158581A1 (ja) 光学検査装置及び光学検査方法
JPWO2013051147A1 (ja) 画像取得装置の調整方法、画像取得装置および画像取得装置の製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20200424

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20200424

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20200424

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20200624

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20200707

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20200727

R150 Certificate of patent or registration of utility model

Ref document number: 6741787

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250