SG11201806925PA - System and method for compensation of illumination beam misalignment - Google Patents

System and method for compensation of illumination beam misalignment

Info

Publication number
SG11201806925PA
SG11201806925PA SG11201806925PA SG11201806925PA SG11201806925PA SG 11201806925P A SG11201806925P A SG 11201806925PA SG 11201806925P A SG11201806925P A SG 11201806925PA SG 11201806925P A SG11201806925P A SG 11201806925PA SG 11201806925P A SG11201806925P A SG 11201806925PA
Authority
SG
Singapore
Prior art keywords
international
california
corrected
drive
parameters
Prior art date
Application number
SG11201806925PA
Inventor
Zhiwei Steve Xu
Yury Yuditsky
Frank Li
Timothy Swisher
Kwan Auyeung
Original Assignee
Kla Tencor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kla Tencor Corp filed Critical Kla Tencor Corp
Publication of SG11201806925PA publication Critical patent/SG11201806925PA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G02B26/108—Scanning systems having one or more prisms as scanning elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Slot Machines And Peripheral Devices (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Mounting And Adjusting Of Optical Elements (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

International Patent Classification: HOlL 21/66 (2006.01) HOlL 21/67 (2006.01) (21) International Application Number: PCT/US2017/030258 (22) International Filing Date: 28 April 2017 (28.04.2017) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 62/330,756 02 May 2016 (02.05.2016) US 15/477,885 03 April 2017 (03.04.2017) US (71) Applicant: KLA-TENCOR CORPORATION [US/US]; Legal Department, One Technology Drive, Milpitas, Cali- fornia 95035 (US). (72) Inventors: XU, Zhiwei Steve; 1780 Laurentian Way, Sun- nyvale, California 94087 (US). YUDITSKY, Yury; 49 Showers Drive, Apt. N272, Mountain View, California 94040 (US). LI, Frank; 3039 Griffon Street East, Danville, California 94506 (US). SWISHER, Timothy; 3488 Sky- line Drive, Hayward, California 94542 (US). AUYEUNG, Kwan; 5069 Ridgewood Drive, Fremont, California 94555 (US). (74) Agent: MCANDREWS, Kevin et al.; KLA-Tencor Corp., Legal Department, One Technology Drive, Milpitas, Cali- fornia 95035 (US). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). (54) Title: SYSTEM AND METHOD FOR COMPENSATION OF ILLUMINATION BEAM MISALIGNMENT (57) : A system includes a beam steering assembly configured to ad- just an incident beam to form a corrected beam; a beam monitoring assembly %, - 200 configured to generate monitoring data for the corrected beam including one or more offset parameters of the corrected beam; and a controller configured to store one or more zero parameters of the corrected beam, calculate at least 240 Th one difference between the one or more zero parameters and the one or more 203 offset parameters of the corrected beam, determine one or more beam position 250- \ adjustments of the incident beam based on the at least one difference between the one or more zero parameters and the one or more offset parameters of the corrected beam, and direct the beam steering assembly via one or more motor drivers to actuate one or more motors to adjust the incident beam to form the corrected beam. BEAM MONITORING ASSEMBLY BEAM STEERING ASSEMBLY ILLUMINATION SOURCE 222 MOTOR DRIVER FIG.2 205 BEAM MODULATOR W O 20 17 / 19 2403 Al (12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 09 November 2017 (09.11.2017) WIP0 I PCT omit VIII Hot 0 VIII Elm moiminiflom (10) International Publication Number WO 2017/192403 Al [Continued on next page] WO 2017/192403 Al MIDEDIMOMMIDIRMEM300101010HOMMOVOIMIE Published: with international search report (Art. 21(3)) before the expiration of the time limit for amending the claims and to be republished in the event of receipt of amendments (Rule 48.2(h))
SG11201806925PA 2016-05-02 2017-04-28 System and method for compensation of illumination beam misalignment SG11201806925PA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662330756P 2016-05-02 2016-05-02
US15/477,885 US10495579B2 (en) 2016-05-02 2017-04-03 System and method for compensation of illumination beam misalignment
PCT/US2017/030258 WO2017192403A1 (en) 2016-05-02 2017-04-28 System and method for compensation of illumination beam misalignment

Publications (1)

Publication Number Publication Date
SG11201806925PA true SG11201806925PA (en) 2018-11-29

Family

ID=60203214

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201806925PA SG11201806925PA (en) 2016-05-02 2017-04-28 System and method for compensation of illumination beam misalignment

Country Status (9)

Country Link
US (1) US10495579B2 (en)
JP (1) JP6741787B2 (en)
KR (1) KR102190345B1 (en)
CN (1) CN109075099B (en)
DE (1) DE112017002293T5 (en)
IL (1) IL262231B (en)
SG (1) SG11201806925PA (en)
TW (1) TWI728104B (en)
WO (1) WO2017192403A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10365211B2 (en) * 2017-09-26 2019-07-30 Kla-Tencor Corporation Systems and methods for metrology beam stabilization
DE102020209268B3 (en) * 2020-07-22 2021-10-14 Hochschule Emden/Leer Optical system

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60221720A (en) * 1984-04-18 1985-11-06 Fuji Photo Film Co Ltd Light beam scanner
US4696047A (en) 1985-02-28 1987-09-22 Texas Instruments Incorporated Apparatus for automatically inspecting electrical connecting pins
US6618421B2 (en) 1998-07-18 2003-09-09 Cymer, Inc. High repetition rate gas discharge laser with precise pulse timing control
JP2001334376A (en) 2000-05-26 2001-12-04 Nec Toyama Ltd Laser beam machining device and method of correction of laser beam spot position
JP2003179142A (en) 2001-12-10 2003-06-27 Nec Microsystems Ltd Semiconductor device equipped with jitter test circuit, and the jitter test method
US6831736B2 (en) 2002-10-07 2004-12-14 Applied Materials Israel, Ltd. Method of and apparatus for line alignment to compensate for static and dynamic inaccuracies in scanning
US6940879B2 (en) 2002-12-06 2005-09-06 New Focus, Inc. External cavity laser with dispersion compensation for mode-hop-free tuning
US7307711B2 (en) * 2004-10-29 2007-12-11 Hitachi Via Mechanics (Usa), Inc. Fluorescence based laser alignment and testing of complex beam delivery systems and lenses
US7321114B2 (en) * 2005-03-10 2008-01-22 Hitachi Via Mechanics, Ltd. Apparatus and method for beam drift compensation
JP4908925B2 (en) * 2006-02-08 2012-04-04 株式会社日立ハイテクノロジーズ Wafer surface defect inspection apparatus and method
KR20080014385A (en) 2006-08-11 2008-02-14 동부일렉트로닉스 주식회사 Auto-adjusting apparatus of laser beam and auto-adjusting method thereof
US8379204B1 (en) 2007-08-17 2013-02-19 Gsi Group Corporation System and method for automatic laser beam alignment
JP5801558B2 (en) 2008-02-26 2015-10-28 スリーエム イノベイティブ プロパティズ カンパニー Multi-photon exposure system
US9068952B2 (en) * 2009-09-02 2015-06-30 Kla-Tencor Corporation Method and apparatus for producing and measuring dynamically focussed, steered, and shaped oblique laser illumination for spinning wafer inspection system
JP5134603B2 (en) * 2009-09-09 2013-01-30 株式会社日立ハイテクノロジーズ Light beam adjusting method and light beam adjusting apparatus
KR20110050821A (en) 2009-11-09 2011-05-17 삼성전자주식회사 Delay locked loop circuit for reducing jitter and semiconductor device having the same
WO2012023211A1 (en) 2010-08-20 2012-02-23 富士通株式会社 Semiconductor device
US8995746B2 (en) 2013-03-15 2015-03-31 KLA—Tencor Corporation Image synchronization of scanning wafer inspection system

Also Published As

Publication number Publication date
US10495579B2 (en) 2019-12-03
US20170336329A1 (en) 2017-11-23
IL262231A (en) 2018-11-29
CN109075099B (en) 2023-07-14
CN109075099A (en) 2018-12-21
DE112017002293T5 (en) 2019-02-14
JP6741787B2 (en) 2020-08-19
TWI728104B (en) 2021-05-21
JP2019523981A (en) 2019-08-29
KR20180132923A (en) 2018-12-12
WO2017192403A1 (en) 2017-11-09
KR102190345B1 (en) 2020-12-11
IL262231B (en) 2021-06-30
TW201743048A (en) 2017-12-16

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