JP6740072B2 - 洗浄液カートリッジおよび該洗浄液カートリッジを用いた洗浄方法 - Google Patents

洗浄液カートリッジおよび該洗浄液カートリッジを用いた洗浄方法 Download PDF

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Publication number
JP6740072B2
JP6740072B2 JP2016188635A JP2016188635A JP6740072B2 JP 6740072 B2 JP6740072 B2 JP 6740072B2 JP 2016188635 A JP2016188635 A JP 2016188635A JP 2016188635 A JP2016188635 A JP 2016188635A JP 6740072 B2 JP6740072 B2 JP 6740072B2
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Japan
Prior art keywords
cleaning liquid
cleaning
liquid
opening
cartridge
Prior art date
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Active
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JP2016188635A
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English (en)
Japanese (ja)
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JP2018056242A (ja
Inventor
淳靖 三浦
淳靖 三浦
淳一 新庄
淳一 新庄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
Original Assignee
Screen Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Screen Holdings Co Ltd filed Critical Screen Holdings Co Ltd
Priority to JP2016188635A priority Critical patent/JP6740072B2/ja
Priority to PCT/JP2017/029748 priority patent/WO2018061520A1/ja
Priority to CN201780047633.XA priority patent/CN109564863B/zh
Priority to KR1020187036692A priority patent/KR102156486B1/ko
Priority to TW106130472A priority patent/TWI655036B/zh
Publication of JP2018056242A publication Critical patent/JP2018056242A/ja
Application granted granted Critical
Publication of JP6740072B2 publication Critical patent/JP6740072B2/ja
Active legal-status Critical Current
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
JP2016188635A 2016-09-27 2016-09-27 洗浄液カートリッジおよび該洗浄液カートリッジを用いた洗浄方法 Active JP6740072B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2016188635A JP6740072B2 (ja) 2016-09-27 2016-09-27 洗浄液カートリッジおよび該洗浄液カートリッジを用いた洗浄方法
PCT/JP2017/029748 WO2018061520A1 (ja) 2016-09-27 2017-08-21 洗浄液カートリッジおよび該洗浄液カートリッジを用いた洗浄方法
CN201780047633.XA CN109564863B (zh) 2016-09-27 2017-08-21 清洗液盒及使用该清洗液盒的清洗方法
KR1020187036692A KR102156486B1 (ko) 2016-09-27 2017-08-21 세정액 카트리지 및 그 세정액 카트리지를 사용한 세정 방법
TW106130472A TWI655036B (zh) 2016-09-27 2017-09-06 洗淨液匣及使用該洗淨液匣之洗淨方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016188635A JP6740072B2 (ja) 2016-09-27 2016-09-27 洗浄液カートリッジおよび該洗浄液カートリッジを用いた洗浄方法

Publications (2)

Publication Number Publication Date
JP2018056242A JP2018056242A (ja) 2018-04-05
JP6740072B2 true JP6740072B2 (ja) 2020-08-12

Family

ID=61762768

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016188635A Active JP6740072B2 (ja) 2016-09-27 2016-09-27 洗浄液カートリッジおよび該洗浄液カートリッジを用いた洗浄方法

Country Status (5)

Country Link
JP (1) JP6740072B2 (ko)
KR (1) KR102156486B1 (ko)
CN (1) CN109564863B (ko)
TW (1) TWI655036B (ko)
WO (1) WO2018061520A1 (ko)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4630881Y1 (ko) 1969-02-21 1971-10-26
KR20010076831A (ko) * 2000-01-28 2001-08-16 박종섭 반도체 제조용 약액 충전장치
JP4630881B2 (ja) * 2007-03-05 2011-02-09 シャープ株式会社 基板洗浄装置
JP5565482B2 (ja) * 2012-02-16 2014-08-06 東京エレクトロン株式会社 液処理方法及びフィルタ内の気体の除去装置
US9897257B2 (en) * 2012-09-21 2018-02-20 Entegris, Inc. Anti-spike pressure management of pressure-regulated fluid storage and delivery vessels
JP6291177B2 (ja) * 2013-07-11 2018-03-14 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置

Also Published As

Publication number Publication date
TWI655036B (zh) 2019-04-01
CN109564863A (zh) 2019-04-02
CN109564863B (zh) 2023-08-01
WO2018061520A1 (ja) 2018-04-05
JP2018056242A (ja) 2018-04-05
TW201813728A (zh) 2018-04-16
KR102156486B1 (ko) 2020-09-15
KR20190008360A (ko) 2019-01-23

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