JP6722745B2 - チップホルダ付きリードフレーム構造 - Google Patents
チップホルダ付きリードフレーム構造 Download PDFInfo
- Publication number
- JP6722745B2 JP6722745B2 JP2018215661A JP2018215661A JP6722745B2 JP 6722745 B2 JP6722745 B2 JP 6722745B2 JP 2018215661 A JP2018215661 A JP 2018215661A JP 2018215661 A JP2018215661 A JP 2018215661A JP 6722745 B2 JP6722745 B2 JP 6722745B2
- Authority
- JP
- Japan
- Prior art keywords
- chip holder
- lead frame
- portions
- wiring
- frame structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004033 plastic Substances 0.000 claims description 12
- 230000017525 heat dissipation Effects 0.000 claims description 11
- 229910000679 solder Inorganic materials 0.000 claims description 8
- 239000007769 metal material Substances 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 239000003566 sealing material Substances 0.000 claims 1
- 238000000034 method Methods 0.000 description 13
- 238000004519 manufacturing process Methods 0.000 description 11
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- 238000010147 laser engraving Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000007736 thin film deposition technique Methods 0.000 description 2
- 238000000427 thin-film deposition Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 229920006336 epoxy molding compound Polymers 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49517—Additional leads
- H01L23/4952—Additional leads the additional leads being a bump or a wire
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107112938 | 2018-04-16 | ||
| TW107112938A TWI653724B (zh) | 2018-04-16 | 2018-04-16 | 具有晶片座的導線架結構 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2019186522A JP2019186522A (ja) | 2019-10-24 |
| JP6722745B2 true JP6722745B2 (ja) | 2020-07-15 |
Family
ID=66590627
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018215661A Active JP6722745B2 (ja) | 2018-04-16 | 2018-11-16 | チップホルダ付きリードフレーム構造 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6722745B2 (zh) |
| CN (1) | CN110391204A (zh) |
| TW (1) | TWI653724B (zh) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08316269A (ja) * | 1995-05-16 | 1996-11-29 | Fujitsu Ltd | 半導体チップおよびチップホルダとそれに用いた半導体装置の製造方法 |
| US20100164078A1 (en) * | 2008-12-31 | 2010-07-01 | Ruben Madrid | Package assembly for semiconductor devices |
| TWI490988B (zh) * | 2012-03-21 | 2015-07-01 | Chipmos Technologies Inc | 半導體封裝結構 |
| TWM552187U (zh) * | 2017-05-18 | 2017-11-21 | Fusheng Electronics Corp | 具線路之導線架結構 |
| TWM567481U (zh) * | 2018-04-16 | 2018-09-21 | 復盛精密工業股份有限公司 | 具有晶片座的導線架結構 |
-
2018
- 2018-04-16 TW TW107112938A patent/TWI653724B/zh active
- 2018-04-26 CN CN201810387626.0A patent/CN110391204A/zh active Pending
- 2018-11-16 JP JP2018215661A patent/JP6722745B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| TW201944563A (zh) | 2019-11-16 |
| CN110391204A (zh) | 2019-10-29 |
| JP2019186522A (ja) | 2019-10-24 |
| TWI653724B (zh) | 2019-03-11 |
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