JP6717103B2 - 半導体モジュール - Google Patents

半導体モジュール Download PDF

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Publication number
JP6717103B2
JP6717103B2 JP2016153084A JP2016153084A JP6717103B2 JP 6717103 B2 JP6717103 B2 JP 6717103B2 JP 2016153084 A JP2016153084 A JP 2016153084A JP 2016153084 A JP2016153084 A JP 2016153084A JP 6717103 B2 JP6717103 B2 JP 6717103B2
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JP
Japan
Prior art keywords
electrode
joint portion
insulating member
substrate
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2016153084A
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English (en)
Japanese (ja)
Other versions
JP2018022777A (ja
JP2018022777A5 (https=
Inventor
直毅 加藤
直毅 加藤
森　昌吾
昌吾 森
晴光 佐藤
晴光 佐藤
大城 渡辺
大城 渡辺
洋史 湯口
洋史 湯口
音部　優里
優里 音部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Industries Corp
Original Assignee
Toyota Industries Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2016153084A priority Critical patent/JP6717103B2/ja
Application filed by Toyota Industries Corp filed Critical Toyota Industries Corp
Priority to KR1020197002978A priority patent/KR20190024993A/ko
Priority to EP17836570.6A priority patent/EP3496141A4/en
Priority to CN201780047686.1A priority patent/CN109564912A/zh
Priority to US16/322,401 priority patent/US10770400B2/en
Priority to PCT/JP2017/018052 priority patent/WO2018025463A1/ja
Publication of JP2018022777A publication Critical patent/JP2018022777A/ja
Publication of JP2018022777A5 publication Critical patent/JP2018022777A5/ja
Application granted granted Critical
Publication of JP6717103B2 publication Critical patent/JP6717103B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07621—Aligning
    • H10W72/07627—Aligning involving guiding structures, e.g. spacers or supporting members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07631—Techniques
    • H10W72/07636—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07651—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting
    • H10W72/07653—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/641—Dispositions of strap connectors
    • H10W72/642—Dispositions of strap connectors being orthogonal to a side surface of the chip, e.g. in parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/641—Dispositions of strap connectors
    • H10W72/647—Dispositions of multiple strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/681—Auxiliary members, e.g. flow barriers
    • H10W72/683—Reinforcing structures, e.g. bump collars
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/681—Auxiliary members, e.g. flow barriers
    • H10W72/685—Alignment aids, e.g. alignment marks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/926—Multiple bond pads having different sizes

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
JP2016153084A 2016-08-03 2016-08-03 半導体モジュール Expired - Fee Related JP6717103B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2016153084A JP6717103B2 (ja) 2016-08-03 2016-08-03 半導体モジュール
EP17836570.6A EP3496141A4 (en) 2016-08-03 2017-05-12 SEMICONDUCTOR MODULE
CN201780047686.1A CN109564912A (zh) 2016-08-03 2017-05-12 半导体模块
US16/322,401 US10770400B2 (en) 2016-08-03 2017-05-12 Semiconductor module
KR1020197002978A KR20190024993A (ko) 2016-08-03 2017-05-12 반도체 모듈
PCT/JP2017/018052 WO2018025463A1 (ja) 2016-08-03 2017-05-12 半導体モジュール

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016153084A JP6717103B2 (ja) 2016-08-03 2016-08-03 半導体モジュール

Publications (3)

Publication Number Publication Date
JP2018022777A JP2018022777A (ja) 2018-02-08
JP2018022777A5 JP2018022777A5 (https=) 2018-11-29
JP6717103B2 true JP6717103B2 (ja) 2020-07-01

Family

ID=61074071

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016153084A Expired - Fee Related JP6717103B2 (ja) 2016-08-03 2016-08-03 半導体モジュール

Country Status (6)

Country Link
US (1) US10770400B2 (https=)
EP (1) EP3496141A4 (https=)
JP (1) JP6717103B2 (https=)
KR (1) KR20190024993A (https=)
CN (1) CN109564912A (https=)
WO (1) WO2018025463A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7634456B2 (ja) * 2021-09-28 2025-02-21 三菱電機株式会社 半導体装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3614386B2 (ja) 2001-08-23 2005-01-26 株式会社ルネサステクノロジ パワーｍｏｓｆｅｔ
JP3904541B2 (ja) * 2003-09-26 2007-04-11 沖電気工業株式会社 半導体装置内蔵基板の製造方法
JP2007288044A (ja) * 2006-04-19 2007-11-01 Sumitomo Electric Ind Ltd 半導体装置
JP5268786B2 (ja) * 2009-06-04 2013-08-21 三菱電機株式会社 半導体モジュール
JP5659663B2 (ja) * 2010-09-28 2015-01-28 富士電機株式会社 半導体装置及び半導体装置の製造方法
JP2012151353A (ja) * 2011-01-20 2012-08-09 Sharp Corp 半導体モジュール
CN102148215B (zh) * 2011-01-21 2012-06-06 哈尔滨理工大学 提高ccga 器件软钎焊焊点可靠性的互连结构及实现方法
JP2013004943A (ja) 2011-06-22 2013-01-07 Renesas Electronics Corp 半導体装置及びその製造方法
JP5708359B2 (ja) * 2011-08-11 2015-04-30 株式会社デンソー 半導体装置及び半導体装置の製造方法
JP2015080383A (ja) 2013-10-18 2015-04-23 日本精工株式会社 半導体モジュール
WO2015178296A1 (ja) * 2014-05-20 2015-11-26 三菱電機株式会社 電力用半導体装置
CN105981167B (zh) * 2014-08-12 2019-05-28 富士电机株式会社 半导体装置
JP6361448B2 (ja) * 2014-10-15 2018-07-25 住友電気工業株式会社 半導体モジュール

Also Published As

Publication number Publication date
US20190172788A1 (en) 2019-06-06
EP3496141A4 (en) 2019-07-17
JP2018022777A (ja) 2018-02-08
US10770400B2 (en) 2020-09-08
EP3496141A1 (en) 2019-06-12
CN109564912A (zh) 2019-04-02
KR20190024993A (ko) 2019-03-08
WO2018025463A1 (ja) 2018-02-08

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