JP6710120B2 - 導電性接着剤、電子部品および電子部品の製造方法 - Google Patents

導電性接着剤、電子部品および電子部品の製造方法 Download PDF

Info

Publication number
JP6710120B2
JP6710120B2 JP2016130791A JP2016130791A JP6710120B2 JP 6710120 B2 JP6710120 B2 JP 6710120B2 JP 2016130791 A JP2016130791 A JP 2016130791A JP 2016130791 A JP2016130791 A JP 2016130791A JP 6710120 B2 JP6710120 B2 JP 6710120B2
Authority
JP
Japan
Prior art keywords
conductive
meth
conductive adhesive
acrylate
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016130791A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017066367A (ja
Inventor
福島 和信
和信 福島
佐々木 正樹
正樹 佐々木
和貴 仲田
和貴 仲田
大作 須藤
大作 須藤
健太郎 大渕
健太郎 大渕
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Ink Manufacturing Co Ltd
Original Assignee
Taiyo Ink Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Manufacturing Co Ltd filed Critical Taiyo Ink Manufacturing Co Ltd
Priority to TW105128951A priority Critical patent/TWI716445B/zh
Priority to KR1020160123808A priority patent/KR102570880B1/ko
Priority to CN201610861050.8A priority patent/CN106916547A/zh
Publication of JP2017066367A publication Critical patent/JP2017066367A/ja
Application granted granted Critical
Publication of JP6710120B2 publication Critical patent/JP6710120B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02Electrically-conducting adhesives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08Macromolecular additives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • C09J133/14Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/002Physical properties
    • C08K2201/003Additives being defined by their diameter
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00Applications
    • C08L2203/20Applications use in electrical or conductive gadgets
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/03Polymer mixtures characterised by other features containing three or more polymers in a blend

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Combinations Of Printed Boards (AREA)
  • Wire Bonding (AREA)
  • Non-Insulated Conductors (AREA)
JP2016130791A 2015-09-30 2016-06-30 導電性接着剤、電子部品および電子部品の製造方法 Active JP6710120B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW105128951A TWI716445B (zh) 2015-09-30 2016-09-07 導電性接著劑、電子零件以及電子零件之製造方法
KR1020160123808A KR102570880B1 (ko) 2015-09-30 2016-09-27 도전성 접착제, 전자 부품 및 전자 부품의 제조 방법
CN201610861050.8A CN106916547A (zh) 2015-09-30 2016-09-28 导电性粘接剂、电子部件以及电子部件的制造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015194909 2015-09-30
JP2015194909 2015-09-30

Publications (2)

Publication Number Publication Date
JP2017066367A JP2017066367A (ja) 2017-04-06
JP6710120B2 true JP6710120B2 (ja) 2020-06-17

Family

ID=58491782

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016130791A Active JP6710120B2 (ja) 2015-09-30 2016-06-30 導電性接着剤、電子部品および電子部品の製造方法

Country Status (4)

Country Link
JP (1) JP6710120B2 (zh)
KR (1) KR102570880B1 (zh)
CN (1) CN106916547A (zh)
TW (1) TWI716445B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6899069B2 (ja) * 2016-06-27 2021-07-07 株式会社スリーボンド 熱硬化型導電性接着剤
JP2018060788A (ja) * 2016-09-30 2018-04-12 太陽インキ製造株式会社 導電性接着剤、硬化物および電子部品
CN112839439A (zh) * 2019-11-25 2021-05-25 Oppo(重庆)智能科技有限公司 印刷线路板组件及制备方法、电子设备

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2948038B2 (ja) * 1992-12-18 1999-09-13 住友ベークライト株式会社 異方導電フィルム
JP2000340036A (ja) * 1999-05-27 2000-12-08 Asahi Chem Ind Co Ltd 異方導電性接続体
US7799853B2 (en) * 2005-09-05 2010-09-21 Nitto Denko Corporation Adhesive composition, adhesive sheet, and surface protective film
KR20080109895A (ko) * 2006-04-27 2008-12-17 스미토모 베이클리트 컴퍼니 리미티드 접착 테이프, 반도체 패키지 및 전자기기
US20120048606A1 (en) * 2007-08-08 2012-03-01 Hitachi Chemical Company, Ltd. Adhesive composition, film-like adhesive, and connection structure for circuit member
JP5540916B2 (ja) * 2010-06-15 2014-07-02 デクセリアルズ株式会社 接続構造体の製造方法
JP5964597B2 (ja) 2011-03-30 2016-08-03 株式会社タムラ製作所 異方性導電性ペーストおよびそれを用いた電子部品の接続方法
JP5802081B2 (ja) 2011-08-24 2015-10-28 株式会社タムラ製作所 異方性導電性ペースト
JP2013143426A (ja) * 2012-01-10 2013-07-22 Nitto Denko Corp 導電性接着シートおよび太陽電池モジュール
JP2013179272A (ja) * 2012-02-08 2013-09-09 Hitachi Chemical Co Ltd 太陽電池モジュールの製造方法、及び樹脂組成物
JP5907377B2 (ja) * 2012-02-09 2016-04-26 Dic株式会社 湿気硬化型ポリウレタンホットメルト樹脂組成物
JP6061644B2 (ja) * 2012-09-24 2017-01-18 株式会社タムラ製作所 異方性導電性ペーストおよびそれを用いたプリント配線基板
JP2014065766A (ja) * 2012-09-24 2014-04-17 Dexerials Corp 異方性導電接着剤
JP2014084395A (ja) * 2012-10-23 2014-05-12 Hitachi Chemical Co Ltd 導電性接着剤組成物、導電性接着剤付金属導線、接続体及び太陽電池モジュールとその製造方法
JP6170376B2 (ja) * 2013-08-27 2017-07-26 日東電工株式会社 導電性接合組成物、導電性接合シート、電子部品およびその製造方法
KR102334672B1 (ko) * 2014-06-03 2021-12-06 다이요 잉키 세이조 가부시키가이샤 경화성 조성물 및 전자 부품

Also Published As

Publication number Publication date
CN106916547A (zh) 2017-07-04
JP2017066367A (ja) 2017-04-06
KR20170038692A (ko) 2017-04-07
TWI716445B (zh) 2021-01-21
KR102570880B1 (ko) 2023-08-25
TW201728720A (zh) 2017-08-16

Similar Documents

Publication Publication Date Title
KR102334672B1 (ko) 경화성 조성물 및 전자 부품
JP5152191B2 (ja) 回路接続材料、接続構造体及びその製造方法
JP2017101131A (ja) 導電性接着剤、硬化物および電子部品
KR20140148333A (ko) 이방성 도전성 페이스트 및 그것을 사용한 프린트 배선기판
JP6710120B2 (ja) 導電性接着剤、電子部品および電子部品の製造方法
JP2017145382A (ja) 導電性接着剤とその製造方法、硬化物および電子部品
JP2020164744A (ja) 導電性接着剤およびシリンジ
JP2018168336A (ja) 導電性接着剤、硬化物、電子部品および電子部品の製造方法
JP4380328B2 (ja) 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法
KR20170038691A (ko) 도전성 접착제와 그의 제조 방법, 경화물 및 전자 부품
JP2017069543A (ja) 接続構造体および電子部品
KR102564310B1 (ko) 도전성 접착제, 경화물, 전자 부품 및 전자 부품의 제조 방법
JP2018060788A (ja) 導電性接着剤、硬化物および電子部品
JP4794704B2 (ja) 回路接続材料、回路端子の接続構造および回路端子の接続方法
JP2016148012A (ja) 硬化性組成物および電子部品
JP2019065231A (ja) 導電性接着剤、硬化物、電子部品および電子部品の製造方法
JP2016035044A (ja) 導電性接着剤および電子部品
KR102044574B1 (ko) 회로 접속 재료, 접속 구조체 및 그의 제조 방법
JP3885350B2 (ja) 回路接続材料、回路端子の接続構造および回路端子の接続方法
TW201720887A (zh) 導電性接著劑及其製造方法、硬化物與電子零件
JP4905502B2 (ja) 回路板の製造方法及び回路接続材料
JP2017066393A (ja) 導電性接着剤および電子部品
JP2010004067A (ja) 回路接続材料
JP2005290394A (ja) 回路接続用接着フィルム及びそれを用いた回路板の製造方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20190521

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20200128

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20200131

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20200326

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20200428

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20200526

R150 Certificate of patent or registration of utility model

Ref document number: 6710120

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313113

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250