JP6710120B2 - 導電性接着剤、電子部品および電子部品の製造方法 - Google Patents
導電性接着剤、電子部品および電子部品の製造方法 Download PDFInfo
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- JP6710120B2 JP6710120B2 JP2016130791A JP2016130791A JP6710120B2 JP 6710120 B2 JP6710120 B2 JP 6710120B2 JP 2016130791 A JP2016130791 A JP 2016130791A JP 2016130791 A JP2016130791 A JP 2016130791A JP 6710120 B2 JP6710120 B2 JP 6710120B2
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- 238000002844 melting Methods 0.000 claims description 22
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- 229910052787 antimony Inorganic materials 0.000 description 1
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- 125000003118 aryl group Chemical group 0.000 description 1
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- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
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- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
- Combinations Of Printed Boards (AREA)
- Wire Bonding (AREA)
- Non-Insulated Conductors (AREA)
Priority Applications (3)
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|---|---|---|---|
| TW105128951A TWI716445B (zh) | 2015-09-30 | 2016-09-07 | 導電性接著劑、電子零件以及電子零件之製造方法 |
| KR1020160123808A KR102570880B1 (ko) | 2015-09-30 | 2016-09-27 | 도전성 접착제, 전자 부품 및 전자 부품의 제조 방법 |
| CN201610861050.8A CN106916547A (zh) | 2015-09-30 | 2016-09-28 | 导电性粘接剂、电子部件以及电子部件的制造方法 |
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| JP2015194909 | 2015-09-30 | ||
| JP2015194909 | 2015-09-30 |
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| JP2017066367A JP2017066367A (ja) | 2017-04-06 |
| JP6710120B2 true JP6710120B2 (ja) | 2020-06-17 |
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| KR (1) | KR102570880B1 (zh) |
| CN (1) | CN106916547A (zh) |
| TW (1) | TWI716445B (zh) |
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| JP6899069B2 (ja) * | 2016-06-27 | 2021-07-07 | 株式会社スリーボンド | 熱硬化型導電性接着剤 |
| JP2018060788A (ja) * | 2016-09-30 | 2018-04-12 | 太陽インキ製造株式会社 | 導電性接着剤、硬化物および電子部品 |
| CN112839439A (zh) * | 2019-11-25 | 2021-05-25 | Oppo（重庆）智能科技有限公司 | 印刷线路板组件及制备方法、电子设备 |
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| JP2948038B2 (ja) * | 1992-12-18 | 1999-09-13 | 住友ベークライト株式会社 | 異方導電フィルム |
| JP2000340036A (ja) * | 1999-05-27 | 2000-12-08 | Asahi Chem Ind Co Ltd | 異方導電性接続体 |
| US7799853B2 (en) * | 2005-09-05 | 2010-09-21 | Nitto Denko Corporation | Adhesive composition, adhesive sheet, and surface protective film |
| KR20080109895A (ko) * | 2006-04-27 | 2008-12-17 | 스미토모 베이클리트 컴퍼니 리미티드 | 접착 테이프, 반도체 패키지 및 전자기기 |
| US20120048606A1 (en) * | 2007-08-08 | 2012-03-01 | Hitachi Chemical Company, Ltd. | Adhesive composition, film-like adhesive, and connection structure for circuit member |
| JP5540916B2 (ja) * | 2010-06-15 | 2014-07-02 | デクセリアルズ株式会社 | 接続構造体の製造方法 |
| JP5964597B2 (ja) | 2011-03-30 | 2016-08-03 | 株式会社タムラ製作所 | 異方性導電性ペーストおよびそれを用いた電子部品の接続方法 |
| JP5802081B2 (ja) | 2011-08-24 | 2015-10-28 | 株式会社タムラ製作所 | 異方性導電性ペースト |
| JP2013143426A (ja) * | 2012-01-10 | 2013-07-22 | Nitto Denko Corp | 導電性接着シートおよび太陽電池モジュール |
| JP2013179272A (ja) * | 2012-02-08 | 2013-09-09 | Hitachi Chemical Co Ltd | 太陽電池モジュールの製造方法、及び樹脂組成物 |
| JP5907377B2 (ja) * | 2012-02-09 | 2016-04-26 | Dic株式会社 | 湿気硬化型ポリウレタンホットメルト樹脂組成物 |
| JP6061644B2 (ja) * | 2012-09-24 | 2017-01-18 | 株式会社タムラ製作所 | 異方性導電性ペーストおよびそれを用いたプリント配線基板 |
| JP2014065766A (ja) * | 2012-09-24 | 2014-04-17 | Dexerials Corp | 異方性導電接着剤 |
| JP2014084395A (ja) * | 2012-10-23 | 2014-05-12 | Hitachi Chemical Co Ltd | 導電性接着剤組成物、導電性接着剤付金属導線、接続体及び太陽電池モジュールとその製造方法 |
| JP6170376B2 (ja) * | 2013-08-27 | 2017-07-26 | 日東電工株式会社 | 導電性接合組成物、導電性接合シート、電子部品およびその製造方法 |
| KR102334672B1 (ko) * | 2014-06-03 | 2021-12-06 | 다이요 잉키 세이조 가부시키가이샤 | 경화성 조성물 및 전자 부품 |
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| CN106916547A (zh) | 2017-07-04 |
| JP2017066367A (ja) | 2017-04-06 |
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| TWI716445B (zh) | 2021-01-21 |
| KR102570880B1 (ko) | 2023-08-25 |
| TW201728720A (zh) | 2017-08-16 |
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