JP6708464B2 - 半導体装置および半導体装置の製造方法 - Google Patents
半導体装置および半導体装置の製造方法 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims description 122
- 238000004519 manufacturing process Methods 0.000 title claims description 27
- 238000000034 method Methods 0.000 claims description 42
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 24
- 239000012535 impurity Substances 0.000 claims description 14
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 11
- 229920005591 polysilicon Polymers 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 8
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 230000001678 irradiating effect Effects 0.000 claims 1
- 238000001947 vapour-phase growth Methods 0.000 claims 1
- 238000003384 imaging method Methods 0.000 description 18
- 238000010586 diagram Methods 0.000 description 14
- 239000000758 substrate Substances 0.000 description 13
- 238000005286 illumination Methods 0.000 description 12
- 229910004298 SiO 2 Inorganic materials 0.000 description 11
- 239000004020 conductor Substances 0.000 description 11
- 239000007789 gas Substances 0.000 description 9
- 150000002500 ions Chemical class 0.000 description 9
- 238000005229 chemical vapour deposition Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 239000012212 insulator Substances 0.000 description 7
- 238000005468 ion implantation Methods 0.000 description 7
- 239000013078 crystal Substances 0.000 description 6
- 230000007547 defect Effects 0.000 description 6
- 238000009792 diffusion process Methods 0.000 description 6
- 229910052581 Si3N4 Inorganic materials 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 5
- 238000004050 hot filament vapor deposition Methods 0.000 description 4
- 238000002955 isolation Methods 0.000 description 4
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 229910052785 arsenic Inorganic materials 0.000 description 3
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 3
- 229910021478 group 5 element Inorganic materials 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 3
- 229910000077 silane Inorganic materials 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 238000005224 laser annealing Methods 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
- G02B1/11—Anti-reflection coatings
- G02B1/113—Anti-reflection coatings using inorganic layer materials only
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/562—Protection against mechanical damage
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1464—Back illuminated imager structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14685—Process for coatings or optical elements
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Optics & Photonics (AREA)
- Solid State Image Pick-Up Elements (AREA)
Description
図1は、本発明の第1の実施形態に係る裏面照射型の固体撮像装置を構成する半導体装置100の構成を示す断面図である。
図3は、本発明の第2の実施形態に係る裏面照射型の固体撮像装置を構成する半導体装置101の構成を示す断面図である。半導体装置101は、第1の実施形態に係る半導体装置100と同様、n型の半導体層10の内部に設けられたフォトダイオードを構成するp型の受光部30と、受光部30の光入射側に設けられ、n型のアモルファスシリコンで構成された緩衝層40と、緩衝層40の光入射側に設けられ、半導体層10および緩衝層40の屈折率よりも低い屈折率を有する低屈折率層41と、を含む。
30 受光部
40 緩衝層
41 低屈折率層
100、101 半導体装置
Claims (9)
- 第1の導電型を有する半導体層の内部に設けられ、前記第1の導電型とは異なる第2の導電型を有する受光部と、
前記受光部の光入射側に設けられ、前記第1の導電型を有するアモルファスシリコンで構成された緩衝層と、
前記緩衝層の光入射側に設けられ、前記半導体層および前記緩衝層の屈折率よりも低い屈折率を有する低屈折率層と、
前記低屈折率層の光入射側に設けられ、前記低屈折率層の屈折率よりも低い屈折率を有する絶縁膜と、
前記低屈折率層及び前記絶縁膜を貫通して前記緩衝層に達するコンタクトプラグと、
前記コンタクトプラグを介して前記緩衝層に電気的に接続された電極と、
を含む半導体装置。 - 前記緩衝層は、前記受光部に接している
請求項1に記載の半導体装置。 - 前記緩衝層は、前記受光部に接することなく前記半導体層に接している
請求項1または請求項2に記載の半導体装置。 - 前記緩衝層を、前記アモルファスシリコンに代えてポリシリコンで構成した
請求項1から請求項3のいずれか1項に記載の半導体装置。 - 第1の導電型を有する半導体層の内部に前記第1の導電型とは異なる第2の導電型を有する受光部を形成する工程と、
前記受光部の光入射側に前記第1の導電型を有するアモルファスシリコンで構成された緩衝層を形成する工程と、
前記緩衝層の光入射側に前記半導体層および前記緩衝層の屈折率よりも低い屈折率を有する低屈折率層を形成する工程と、
前記低屈折率層の光入射側に前記低屈折率層の屈折率よりも低い屈折率を有する絶縁膜を形成する工程と、
前記低屈折率層及び前記絶縁膜を貫通して前記緩衝層に達するコンタクトプラグを形成する工程と、
前記絶縁膜の表面に前記コンタクトプラグを介して前記緩衝層に電気的に接続された電極を形成する工程と、
を含む半導体装置の製造方法。 - 前記アモルファスシリコンの材料となる材料ガスと前記アモルファスシリコンに導電性を付与する不純物を含む不純物ガスとを混合した混合ガスを用いた気相成長法により前記緩衝層を形成する
請求項5に記載の製造方法。 - 前記緩衝層を形成する工程は、
前記受光部の光入射側にノンドープのアモルファスシリコン層を形成する工程と、
前記アモルファスシリコン層に不純物を注入して前記アモルファスシリコン層に導電性を付与する工程と、
を含む請求項5に記載の製造方法。 - 前記緩衝層にレーザを照射して前記緩衝層に含まれる不純物を活性化させる工程を更に含む
請求項6または請求項7に記載の製造方法。 - 前記緩衝層を、前記アモルファスシリコンに代えてポリシリコンで構成する
請求項5から請求項8のいずれか1項に記載の製造方法。
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JP2016074270A JP6708464B2 (ja) | 2016-04-01 | 2016-04-01 | 半導体装置および半導体装置の製造方法 |
US15/463,116 US9997553B2 (en) | 2016-04-01 | 2017-03-20 | Semiconductor device configuring a back-illuminated solid state imaging device and semiconductor device manufacturing method thereof |
CN201710212864.3A CN107425027B (zh) | 2016-04-01 | 2017-04-01 | 半导体装置以及半导体装置的制造方法 |
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JP6708464B2 true JP6708464B2 (ja) | 2020-06-10 |
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JP4017886B2 (ja) * | 2002-02-28 | 2007-12-05 | シャープ株式会社 | 薄膜トランジスタ装置及びその製造方法 |
JP4123415B2 (ja) * | 2002-05-20 | 2008-07-23 | ソニー株式会社 | 固体撮像装置 |
JP4779304B2 (ja) | 2004-03-19 | 2011-09-28 | ソニー株式会社 | 固体撮像素子、カメラモジュール及び電子機器モジュール |
JP4227069B2 (ja) * | 2004-05-07 | 2009-02-18 | ローム株式会社 | 光電変換デバイス、イメージセンサおよび光電変換デバイスの製造方法 |
JP4725095B2 (ja) * | 2004-12-15 | 2011-07-13 | ソニー株式会社 | 裏面入射型固体撮像装置及びその製造方法 |
CN100442530C (zh) * | 2005-02-21 | 2008-12-10 | 索尼株式会社 | 固态成像器件及其驱动方法和照相装置 |
US8049293B2 (en) * | 2005-03-07 | 2011-11-01 | Sony Corporation | Solid-state image pickup device, electronic apparatus using such solid-state image pickup device and method of manufacturing solid-state image pickup device |
US7781715B2 (en) * | 2006-09-20 | 2010-08-24 | Fujifilm Corporation | Backside illuminated imaging device, semiconductor substrate, imaging apparatus and method for manufacturing backside illuminated imaging device |
KR100869743B1 (ko) * | 2006-12-29 | 2008-11-21 | 동부일렉트로닉스 주식회사 | 씨모스 이미지 센서 및 그 제조방법 |
US7952096B2 (en) * | 2008-12-08 | 2011-05-31 | Omnivision Technologies, Inc. | CMOS image sensor with improved backside surface treatment |
KR20120098640A (ko) * | 2009-10-20 | 2012-09-05 | 아사히 가라스 가부시키가이샤 | 유리 적층체 및 그의 제조 방법, 및 표시 패널의 제조 방법 및 그 제조 방법에 의해 얻어지는 표시 패널 |
JP5481419B2 (ja) * | 2011-03-25 | 2014-04-23 | 株式会社東芝 | 半導体装置の製造方法 |
US8629524B2 (en) * | 2012-04-27 | 2014-01-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Apparatus for vertically integrated backside illuminated image sensors |
JP6119463B2 (ja) * | 2013-07-01 | 2017-04-26 | 住友電気工業株式会社 | 受光素子アレイを作製する方法 |
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JP2017188499A (ja) | 2017-10-12 |
US9997553B2 (en) | 2018-06-12 |
CN107425027A (zh) | 2017-12-01 |
CN107425027B (zh) | 2022-02-11 |
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