JP6705312B2 - 樹脂組成物 - Google Patents

樹脂組成物 Download PDF

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Publication number
JP6705312B2
JP6705312B2 JP2016131902A JP2016131902A JP6705312B2 JP 6705312 B2 JP6705312 B2 JP 6705312B2 JP 2016131902 A JP2016131902 A JP 2016131902A JP 2016131902 A JP2016131902 A JP 2016131902A JP 6705312 B2 JP6705312 B2 JP 6705312B2
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JP
Japan
Prior art keywords
resin
resin composition
epoxy
mass
layer
Prior art date
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Active
Application number
JP2016131902A
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English (en)
Japanese (ja)
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JP2018002886A (ja
Inventor
中村　茂雄
茂雄 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ajinomoto Co Inc
Original Assignee
Ajinomoto Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Co Inc filed Critical Ajinomoto Co Inc
Priority to JP2016131902A priority Critical patent/JP6705312B2/ja
Priority to TW106120390A priority patent/TWI725199B/zh
Priority to KR1020170082081A priority patent/KR102336087B1/ko
Publication of JP2018002886A publication Critical patent/JP2018002886A/ja
Application granted granted Critical
Publication of JP6705312B2 publication Critical patent/JP6705312B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • C08L53/025—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes modified
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP2016131902A 2016-07-01 2016-07-01 樹脂組成物 Active JP6705312B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2016131902A JP6705312B2 (ja) 2016-07-01 2016-07-01 樹脂組成物
TW106120390A TWI725199B (zh) 2016-07-01 2017-06-19 樹脂組成物
KR1020170082081A KR102336087B1 (ko) 2016-07-01 2017-06-28 수지 조성물

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016131902A JP6705312B2 (ja) 2016-07-01 2016-07-01 樹脂組成物

Publications (2)

Publication Number Publication Date
JP2018002886A JP2018002886A (ja) 2018-01-11
JP6705312B2 true JP6705312B2 (ja) 2020-06-03

Family

ID=60948581

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016131902A Active JP6705312B2 (ja) 2016-07-01 2016-07-01 樹脂組成物

Country Status (3)

Country Link
JP (1) JP6705312B2 (zh)
KR (1) KR102336087B1 (zh)
TW (1) TWI725199B (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019127501A (ja) * 2018-01-22 2019-08-01 藤森工業株式会社 熱硬化性接着剤組成物、接着フィルム、カバーレイフィルム及びフレキシブルプリント配線板
WO2020262405A1 (ja) * 2019-06-27 2020-12-30 太陽インキ製造株式会社 積層体、硬化物および、電子部品
JP2021014546A (ja) * 2019-07-12 2021-02-12 味の素株式会社 樹脂組成物
JP7336288B2 (ja) * 2019-07-17 2023-08-31 太陽ホールディングス株式会社 硬化性樹脂組成物、ドライフィルム、樹脂付き銅箔、プリプレグ、硬化物および、電子部品
JP7314837B2 (ja) * 2020-02-28 2023-07-26 味の素株式会社 樹脂組成物
JP7409262B2 (ja) * 2020-08-24 2024-01-09 味の素株式会社 樹脂組成物
CN116724068A (zh) * 2021-01-22 2023-09-08 住友电木株式会社 成型用树脂组合物

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04202402A (ja) * 1990-11-30 1992-07-23 Nippon Oil Co Ltd フェノール類付加ブタジエン重合体あるいは共重合体の製造方法および硬化性エポキシ樹脂組成物
JP6427861B2 (ja) 2013-10-21 2018-11-28 味の素株式会社 回路基板の製造方法
JP6301173B2 (ja) * 2014-03-28 2018-03-28 新日鉄住金化学株式会社 硬化性樹脂組成物、その硬化物、複合材料

Also Published As

Publication number Publication date
KR20180004014A (ko) 2018-01-10
TW201819498A (zh) 2018-06-01
TWI725199B (zh) 2021-04-21
JP2018002886A (ja) 2018-01-11
KR102336087B1 (ko) 2021-12-08

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