JP6694833B2 - 樹脂組成物 - Google Patents

樹脂組成物 Download PDF

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Publication number
JP6694833B2
JP6694833B2 JP2017002165A JP2017002165A JP6694833B2 JP 6694833 B2 JP6694833 B2 JP 6694833B2 JP 2017002165 A JP2017002165 A JP 2017002165A JP 2017002165 A JP2017002165 A JP 2017002165A JP 6694833 B2 JP6694833 B2 JP 6694833B2
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Japan
Prior art keywords
resin composition
resin
mass
epoxy resin
group
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JP2017002165A
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Japanese (ja)
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JP2017071798A5 (https=
JP2017071798A (ja
Inventor
真俊 渡邊
真俊 渡邊
中村　茂雄
茂雄 中村
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Ajinomoto Co Inc
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Ajinomoto Co Inc
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Priority to JP2017002165A priority Critical patent/JP6694833B2/ja
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Publication of JP2017071798A5 publication Critical patent/JP2017071798A5/ja
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  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2017002165A 2017-01-10 2017-01-10 樹脂組成物 Active JP6694833B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2017002165A JP6694833B2 (ja) 2017-01-10 2017-01-10 樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017002165A JP6694833B2 (ja) 2017-01-10 2017-01-10 樹脂組成物

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2012174552A Division JP6308713B2 (ja) 2012-08-07 2012-08-07 樹脂組成物

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2019048075A Division JP7263069B2 (ja) 2019-03-15 2019-03-15 樹脂組成物

Publications (3)

Publication Number Publication Date
JP2017071798A JP2017071798A (ja) 2017-04-13
JP2017071798A5 JP2017071798A5 (https=) 2018-03-01
JP6694833B2 true JP6694833B2 (ja) 2020-05-20

Family

ID=58539673

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017002165A Active JP6694833B2 (ja) 2017-01-10 2017-01-10 樹脂組成物

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JP (1) JP6694833B2 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6801608B2 (ja) * 2017-08-21 2020-12-16 味の素株式会社 樹脂組成物
JP7114987B2 (ja) * 2018-03-29 2022-08-09 Dic株式会社 硬化性組成物及びその硬化物
CN112457632A (zh) * 2020-11-18 2021-03-09 广州凯协科技有限公司 一种高介电性能的SiO2-蒙脱土协同改性环氧树脂及其制法
CN117043199A (zh) * 2021-03-24 2023-11-10 松下知识产权经营株式会社 树脂组合物、预浸料、带树脂的膜、带树脂的金属箔、覆金属箔层压板、以及布线板
JP7811709B2 (ja) * 2021-03-24 2026-02-06 パナソニックＩｐマネジメント株式会社 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板
JP2025042674A (ja) * 2023-09-15 2025-03-28 味の素株式会社 樹脂組成物

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4058672B2 (ja) * 2002-02-28 2008-03-12 大日本インキ化学工業株式会社 エポキシ樹脂組成物およびその硬化物
US7595362B2 (en) * 2004-01-30 2009-09-29 Nippon Steel Chemical Co., Ltd. Curable resin composition
JP5050764B2 (ja) * 2007-04-09 2012-10-17 日立化成工業株式会社 絶縁樹脂組成物
JP2009040919A (ja) * 2007-08-09 2009-02-26 Sekisui Chem Co Ltd 熱硬化性樹脂組成物、及びこれを用いてなる樹脂フィルム、積層板、プリプレグ
JP2009091450A (ja) * 2007-10-09 2009-04-30 Sumitomo Bakelite Co Ltd 樹脂組成物、プリプレグおよび積層板
JP5439841B2 (ja) * 2009-02-16 2014-03-12 日立化成株式会社 接着剤組成物、接着シート及び半導体装置
TWI565750B (zh) * 2009-02-20 2017-01-11 Ajinomoto Kk Resin composition
JP5589292B2 (ja) * 2009-03-27 2014-09-17 日立化成株式会社 熱硬化性絶縁樹脂組成物、並びにこれを用いた支持体付絶縁フィルム、プリプレグ、積層板及び多層プリント配線板
JP5569270B2 (ja) * 2010-09-06 2014-08-13 住友ベークライト株式会社 プリプレグ、金属張積層板、プリント配線板及び半導体装置

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JP2017071798A (ja) 2017-04-13

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