JP6688065B2 - エポキシ樹脂組成物 - Google Patents

エポキシ樹脂組成物 Download PDF

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Publication number
JP6688065B2
JP6688065B2 JP2015247112A JP2015247112A JP6688065B2 JP 6688065 B2 JP6688065 B2 JP 6688065B2 JP 2015247112 A JP2015247112 A JP 2015247112A JP 2015247112 A JP2015247112 A JP 2015247112A JP 6688065 B2 JP6688065 B2 JP 6688065B2
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JP
Japan
Prior art keywords
epoxy resin
resin composition
alumina filler
present
underfill material
Prior art date
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Active
Application number
JP2015247112A
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English (en)
Japanese (ja)
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JP2017110146A (ja
Inventor
将宏 長谷川
将宏 長谷川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Namics Corp
Original Assignee
Namics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Namics Corp filed Critical Namics Corp
Priority to JP2015247112A priority Critical patent/JP6688065B2/ja
Priority to KR1020187016315A priority patent/KR102626002B1/ko
Priority to PCT/JP2016/083071 priority patent/WO2017104298A1/ja
Priority to CN201680070570.5A priority patent/CN108368326A/zh
Priority to TW105139260A priority patent/TWI711132B/zh
Publication of JP2017110146A publication Critical patent/JP2017110146A/ja
Application granted granted Critical
Publication of JP6688065B2 publication Critical patent/JP6688065B2/ja
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5033—Amines aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
JP2015247112A 2015-12-18 2015-12-18 エポキシ樹脂組成物 Active JP6688065B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2015247112A JP6688065B2 (ja) 2015-12-18 2015-12-18 エポキシ樹脂組成物
KR1020187016315A KR102626002B1 (ko) 2015-12-18 2016-11-08 에폭시 수지 조성물
PCT/JP2016/083071 WO2017104298A1 (ja) 2015-12-18 2016-11-08 エポキシ樹脂組成物
CN201680070570.5A CN108368326A (zh) 2015-12-18 2016-11-08 环氧树脂组合物
TW105139260A TWI711132B (zh) 2015-12-18 2016-11-29 環氧樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015247112A JP6688065B2 (ja) 2015-12-18 2015-12-18 エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JP2017110146A JP2017110146A (ja) 2017-06-22
JP6688065B2 true JP6688065B2 (ja) 2020-04-28

Family

ID=59056021

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015247112A Active JP6688065B2 (ja) 2015-12-18 2015-12-18 エポキシ樹脂組成物

Country Status (5)

Country Link
JP (1) JP6688065B2 (zh)
KR (1) KR102626002B1 (zh)
CN (1) CN108368326A (zh)
TW (1) TWI711132B (zh)
WO (1) WO2017104298A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109654388A (zh) * 2018-12-06 2019-04-19 安徽皇广实业有限公司 一种集成高导热基材led灯具
CN112080238B (zh) * 2020-09-07 2022-05-27 江苏矽时代材料科技有限公司 一种导热填充胶及其制备方法和应用
KR20230101813A (ko) 2020-11-02 2023-07-06 미쯔비시 케미컬 주식회사 제올라이트, 제올라이트의 제조 방법, 조성물, 액상 조성물, 액상 봉지제, 수지 복합재, 봉지재, 봉지재의 제조 방법, 및 디바이스
CN117795002A (zh) * 2021-11-16 2024-03-29 纳美仕有限公司 环氧树脂组合物、液状压缩模制材料、顶部包封材料以及半导体装置
KR20230108931A (ko) 2022-01-12 2023-07-19 주식회사 이포트 알루미나 제조방법 및 이에 의해 제조된 알루미나
CN114292613A (zh) * 2022-02-16 2022-04-08 武汉市三选科技有限公司 复合膜、倒装led芯片及其制造方法
CN116445117B (zh) * 2023-04-23 2023-12-29 有行鲨鱼（上海）科技股份有限公司 一种大尺寸芯片补强用光热双固封边胶及其制备与使用

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60124647A (ja) * 1983-12-09 1985-07-03 Sumitomo Bakelite Co Ltd 低放射線性エポキシ樹脂組成物
JPH0611845B2 (ja) * 1986-07-02 1994-02-16 住友ベ−クライト株式会社 低放射線性エポキシ樹脂組成物
JPH10173103A (ja) 1996-12-13 1998-06-26 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物
JP3446730B2 (ja) * 2000-09-26 2003-09-16 松下電工株式会社 エポキシ樹脂組成物及び半導体装置
JP3446731B2 (ja) * 2000-09-26 2003-09-16 松下電工株式会社 エポキシ樹脂組成物及び半導体装置
JP2003160642A (ja) * 2001-11-27 2003-06-03 Matsushita Electric Works Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
JP2003160643A (ja) * 2001-11-27 2003-06-03 Matsushita Electric Works Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
JP2003160644A (ja) * 2001-11-27 2003-06-03 Matsushita Electric Works Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
JP2003261647A (ja) * 2002-03-08 2003-09-19 Toray Ind Inc エポキシ樹脂組成物及び半導体装置
JP4631296B2 (ja) * 2004-03-05 2011-02-16 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
WO2006019041A1 (ja) * 2004-08-18 2006-02-23 Kaneka Corporation 半導体封止剤用エポキシ樹脂組成物およびエポキシ樹脂成形材料
JP2007308678A (ja) * 2005-11-02 2007-11-29 Shin Etsu Chem Co Ltd 液状エポキシ樹脂組成物
TWI494341B (zh) * 2008-03-31 2015-08-01 Nippon Steel & Sumikin Chem Co Epoxy resin compositions and shaped articles
CN103936676A (zh) * 2009-03-17 2014-07-23 日本曹达株式会社 包合配合物、固化剂、固化促进剂、环氧树脂组合物及半导体封装用环氧树脂组合物
JP5163912B2 (ja) * 2010-02-16 2013-03-13 信越化学工業株式会社 エポキシ樹脂組成物及び半導体装置
US8815205B2 (en) 2010-04-15 2014-08-26 Nippon Steel & Sumikin Materials Co., Ltd. Method for producing spherical alumina powder
JP5983085B2 (ja) * 2012-06-25 2016-08-31 住友ベークライト株式会社 エポキシ樹脂組成物及び電子部品装置
JP5968137B2 (ja) * 2012-07-20 2016-08-10 ナミックス株式会社 液状封止材、それを用いた電子部品
KR102192792B1 (ko) * 2013-09-30 2020-12-18 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 인 함유 에폭시 수지 조성물 및 경화물
JP5983590B2 (ja) * 2013-12-13 2016-08-31 株式会社デンソー 硬化性樹脂組成物、封止材、及びこれを用いた電子デバイス製品

Also Published As

Publication number Publication date
WO2017104298A1 (ja) 2017-06-22
CN108368326A (zh) 2018-08-03
JP2017110146A (ja) 2017-06-22
KR102626002B1 (ko) 2024-01-16
TWI711132B (zh) 2020-11-21
TW201727848A (zh) 2017-08-01
KR20180094882A (ko) 2018-08-24

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