JP6668776B2 - ブレイク装置 - Google Patents
ブレイク装置 Download PDFInfo
- Publication number
- JP6668776B2 JP6668776B2 JP2016010475A JP2016010475A JP6668776B2 JP 6668776 B2 JP6668776 B2 JP 6668776B2 JP 2016010475 A JP2016010475 A JP 2016010475A JP 2016010475 A JP2016010475 A JP 2016010475A JP 6668776 B2 JP6668776 B2 JP 6668776B2
- Authority
- JP
- Japan
- Prior art keywords
- ring
- dicing
- dicing ring
- holding
- break bar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0052—Means for supporting or holding work during breaking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/042—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with blades or wires mounted in a reciprocating frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
Description
11 ステージ
12 Y軸移動機構
13,16 水平固定部材
14 サーボモータ
17 上移動部材
20 下移動部材
21 ブレイクバー
30 回転機構
31 ベース
32 ブラケット
33 ケーブルチェーン
34 駆動ユニット
41 クロスローラ
42 リング
43 下ベースリング
44 上ベースリング
45 歯車
46 リング
47 テーブル
48 テーブル固定ブロック
49 ブロック
53 保護位置決め板
51,55 ダイシングリング
52,54 弾性板
60 リング収めユニット
61 ブラケット
62 シリンダ
63 アーム
64,67 押さえアーム
65 押さえ板
72,73 カメラ
80 コントローラ
81 画像処理部
82 制御部
85 ブレイクバー駆動部
86 テーブル回転駆動部
87 Y軸駆動部
88,89 モータ
Claims (2)
- 分断の対象となる脆性材料基板を保持するテーブル及び前記テーブルを回転させる回動手段を有し、前記テーブル上に第1のダイシングリング及びこれよりサイズの小さい少なくとも1つの第2のダイシングリングを選択的に取付け、前記いずれかのダイシングリングに保持された脆性材料基板をブレイクするブレイク装置であって、
前記第2のダイシングリングより大きい外径を有し、内側に円形の開口を有する環状の保護位置決め板と、
回動自在の押さえアームによって前記第1又は第2のダイシングリングを前記テーブル上に保持するリング収めユニットと、
前記第1のダイシングリングの使用時に用いられ、前記テーブルと前記第1のダイシングリングの間に設けられる第1の弾性板と、
前記第2のダイシングリングの使用時に用いられ、前記保護位置決め板の開口内に保持されて前記テーブルと前記第2のダイシングリングの間に設けられる第2の弾性板と、を具備するブレイク装置。 - 前記リング収めユニットの押さえアームは、
前記第1のダイシングリングを保持する第1の押さえアームと前記第2のダイシングリングを保持する第2の押さえアームのうち一方が取付けられるものである請求項1記載のブレイク装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016010475A JP6668776B2 (ja) | 2016-01-22 | 2016-01-22 | ブレイク装置 |
TW105125053A TWI617408B (zh) | 2016-01-22 | 2016-08-05 | 分斷裝置 |
KR1020160101554A KR101833769B1 (ko) | 2016-01-22 | 2016-08-10 | 브레이크장치 |
CN201610765973.3A CN106994754B (zh) | 2016-01-22 | 2016-08-29 | 切断装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016010475A JP6668776B2 (ja) | 2016-01-22 | 2016-01-22 | ブレイク装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017128081A JP2017128081A (ja) | 2017-07-27 |
JP6668776B2 true JP6668776B2 (ja) | 2020-03-18 |
Family
ID=59394409
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016010475A Active JP6668776B2 (ja) | 2016-01-22 | 2016-01-22 | ブレイク装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6668776B2 (ja) |
KR (1) | KR101833769B1 (ja) |
CN (1) | CN106994754B (ja) |
TW (1) | TWI617408B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109624109A (zh) * | 2019-02-20 | 2019-04-16 | 广州安特激光技术有限公司 | 一种晶圆片切割装置的承载台 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50183B1 (ja) * | 1970-03-26 | 1975-01-07 | ||
US4227348A (en) * | 1978-12-26 | 1980-10-14 | Rca Corporation | Method of slicing a wafer |
JPH062684U (ja) * | 1992-06-03 | 1994-01-14 | 日新ハイボルテージ株式会社 | イオン注入装置用ウエファサイズ変換アダプタ |
JP3042604B2 (ja) * | 1997-02-04 | 2000-05-15 | サンケン電気株式会社 | 半導体ウエハ組立体切断法及び半導体ウエハ用ワイヤソー切断機 |
JPH10284443A (ja) * | 1997-04-08 | 1998-10-23 | Hitachi Ltd | ブレーキング方法および装置 |
JP3657190B2 (ja) * | 2000-11-13 | 2005-06-08 | Necセミコンパッケージ・ソリューションズ株式会社 | エキスパンド装置 |
WO2004002705A1 (ja) * | 2002-07-01 | 2004-01-08 | Mitsuboshi Diamond Industrial Co.,Ltd. | 脆性材料基板のスクライブ装置及びスクライブ方法 |
JP4502260B2 (ja) * | 2004-10-28 | 2010-07-14 | 株式会社ディスコ | スピンナー洗浄装置及びダイシング装置 |
DE102005028112A1 (de) * | 2005-06-13 | 2006-12-21 | Schmid Technology Systems Gmbh | Verfahren zur Positionierung und Lageerhaltung von Substraten, insbesondere von dünnen Siliziumwafern nach dem Drahtsägen zu deren Vereinzelung |
DE102006032432B3 (de) * | 2006-07-13 | 2007-09-27 | Siltronic Ag | Sägeleiste sowie Verfahren zum gleichzeitigen Abtrennen einer Vielzahl von Scheiben von einem zylindrischen Werkstück unter Verwendung der Sägeleiste |
JP2010045117A (ja) * | 2008-08-11 | 2010-02-25 | Disco Abrasive Syst Ltd | 光デバイスウエーハの加工方法 |
JP5330845B2 (ja) * | 2009-01-30 | 2013-10-30 | 三星ダイヤモンド工業株式会社 | 基板ブレーク装置 |
FR2961014A1 (fr) * | 2010-06-08 | 2011-12-09 | St Microelectronics Tours Sas | Procede de fabrication de puces semiconductrices a partir d'une tranche semiconductrice |
-
2016
- 2016-01-22 JP JP2016010475A patent/JP6668776B2/ja active Active
- 2016-08-05 TW TW105125053A patent/TWI617408B/zh active
- 2016-08-10 KR KR1020160101554A patent/KR101833769B1/ko active IP Right Grant
- 2016-08-29 CN CN201610765973.3A patent/CN106994754B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
JP2017128081A (ja) | 2017-07-27 |
TWI617408B (zh) | 2018-03-11 |
TW201726342A (zh) | 2017-08-01 |
KR20170088269A (ko) | 2017-08-01 |
KR101833769B1 (ko) | 2018-03-02 |
CN106994754A (zh) | 2017-08-01 |
CN106994754B (zh) | 2019-03-12 |
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