JP6654562B2 - 熱伝導性電気絶縁粒子および組成物 - Google Patents

熱伝導性電気絶縁粒子および組成物 Download PDF

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JP6654562B2
JP6654562B2 JP2016519996A JP2016519996A JP6654562B2 JP 6654562 B2 JP6654562 B2 JP 6654562B2 JP 2016519996 A JP2016519996 A JP 2016519996A JP 2016519996 A JP2016519996 A JP 2016519996A JP 6654562 B2 JP6654562 B2 JP 6654562B2
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particles
thermally conductive
core
conductive particles
resin
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JP2017504177A (ja
JP2017504177A5 (enExample
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裕司 佐賀
裕司 佐賀
賢志 平原
賢志 平原
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EIDP Inc
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EI Du Pont de Nemours and Co
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/08—Ingredients agglomerated by treatment with a binding agent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
    • H01B3/04—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances mica
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
    • H01B3/10—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances metallic oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
    • H01B3/12—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances ceramics
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/002—Inhomogeneous material in general
    • H01B3/004—Inhomogeneous material in general with conductive additives or conductive layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2016519996A 2013-10-04 2014-10-06 熱伝導性電気絶縁粒子および組成物 Expired - Fee Related JP6654562B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013209304 2013-10-04
PCT/US2014/059239 WO2015051354A1 (en) 2013-10-04 2014-10-06 Thermally conductive electrically insulating particles and compositions

Publications (3)

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JP2017504177A JP2017504177A (ja) 2017-02-02
JP2017504177A5 JP2017504177A5 (enExample) 2017-08-31
JP6654562B2 true JP6654562B2 (ja) 2020-02-26

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JP (1) JP6654562B2 (enExample)
KR (1) KR20160068762A (enExample)
CN (1) CN105764969B (enExample)
WO (1) WO2015051354A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101933417B1 (ko) 2016-12-28 2018-12-28 삼성전기 주식회사 유전체 파우더 및 이를 이용한 적층형 커패시터
CN107445520A (zh) * 2017-07-27 2017-12-08 泾县信达工贸有限公司 一种电饭锅加热盘用耐高温导热绝缘材料
JP7236211B2 (ja) * 2017-12-15 2023-03-09 株式会社フジミインコーポレーテッド フィラー及びフィラーの製造方法、並びに成形体の製造方法
CN115702196A (zh) * 2020-06-15 2023-02-14 3M创新有限公司 可流动的可硬化组合物、导热组合物和包含其的电子散热器组件
CN111725160A (zh) * 2020-06-16 2020-09-29 杰群电子科技（东莞）有限公司 一种高功率半导体模组、封装方法及电子产品
CN111725159A (zh) * 2020-06-16 2020-09-29 杰群电子科技（东莞）有限公司 一种高散热半导体产品、封装方法及电子产品
CN111725145A (zh) * 2020-06-16 2020-09-29 杰群电子科技（东莞）有限公司 一种半导体封装结构、封装方法及电子产品
US12176125B2 (en) 2020-07-15 2024-12-24 Ge Aviation Systems Llc Method of making an insulated conductive component
KR102411685B1 (ko) * 2020-11-30 2022-06-22 한국과학기술연구원 고절연성 및 고내열성을 갖는 필러 복합 소재, 및 건식 입자-입자 복합화를 통한 제조 방법
JP7751433B2 (ja) * 2021-09-27 2025-10-08 東特塗料株式会社 電気絶縁電線

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6620497B2 (en) * 2000-01-11 2003-09-16 Cool Options, Inc. Polymer composition with boron nitride coated carbon flakes
JP5133338B2 (ja) * 2007-04-17 2013-01-30 株式会社日立ハイテクノロジーズ 樹脂混合用複合フィラー
CN101149995A (zh) * 2007-10-29 2008-03-26 苏州巨峰绝缘材料有限公司 C级高导热柔软复合绝缘材料
JP2012124449A (ja) * 2010-11-19 2012-06-28 Bando Chem Ind Ltd 熱伝導性複合粒子、熱伝導性シート及びこれらの製造方法
US8552101B2 (en) * 2011-02-25 2013-10-08 Sabic Innovative Plastics Ip B.V. Thermally conductive and electrically insulative polymer compositions containing a low thermally conductive filler and uses thereof
US8741998B2 (en) * 2011-02-25 2014-06-03 Sabic Innovative Plastics Ip B.V. Thermally conductive and electrically insulative polymer compositions containing a thermally insulative filler and uses thereof
JP5660324B2 (ja) * 2011-06-20 2015-01-28 株式会社豊田中央研究所 樹脂組成物およびその製造方法
JP2013122003A (ja) * 2011-12-09 2013-06-20 Sato Research Co Ltd 熱伝導フィラー及びその製造方法
CN102615873A (zh) * 2012-03-07 2012-08-01 华中科技大学 低温制备非瓷质绝缘导热材料的方法
JP5263429B1 (ja) * 2012-05-21 2013-08-14 東洋インキＳｃホールディングス株式会社 熱伝導性易変形性凝集体およびその製造方法
JP2014065769A (ja) * 2012-09-25 2014-04-17 Tokai Rubber Ind Ltd エラストマー成形体およびその製造方法
CN103013411B (zh) * 2012-12-26 2013-11-13 赛伦（厦门）新材料科技有限公司 一种绝缘导热薄膜粘结剂及其制备方法

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WO2015051354A1 (en) 2015-04-09
CN105764969B (zh) 2018-03-30
JP2017504177A (ja) 2017-02-02
CN105764969A (zh) 2016-07-13
KR20160068762A (ko) 2016-06-15

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