JP6653119B2 - 半導体発光装置及びリードフレーム - Google Patents

半導体発光装置及びリードフレーム Download PDF

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Publication number
JP6653119B2
JP6653119B2 JP2015022237A JP2015022237A JP6653119B2 JP 6653119 B2 JP6653119 B2 JP 6653119B2 JP 2015022237 A JP2015022237 A JP 2015022237A JP 2015022237 A JP2015022237 A JP 2015022237A JP 6653119 B2 JP6653119 B2 JP 6653119B2
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JP
Japan
Prior art keywords
wall
chip
light emitting
lead frame
emitting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2015022237A
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English (en)
Japanese (ja)
Other versions
JP2016063210A5 (enExample
JP2016063210A (ja
Inventor
秀徳 江越
秀徳 江越
野口　吉雄
吉雄 野口
一裕 井上
一裕 井上
崇 荒川
崇 荒川
輝雄 竹内
輝雄 竹内
敏宏 黒木
敏宏 黒木
小串　昌弘
昌弘 小串
Original Assignee
アルパッド株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by アルパッド株式会社 filed Critical アルパッド株式会社
Priority to US14/838,850 priority Critical patent/US20160079217A1/en
Priority to TW104128920A priority patent/TW201611358A/zh
Priority to CN201510556155.8A priority patent/CN105428511A/zh
Publication of JP2016063210A publication Critical patent/JP2016063210A/ja
Publication of JP2016063210A5 publication Critical patent/JP2016063210A5/ja
Application granted granted Critical
Publication of JP6653119B2 publication Critical patent/JP6653119B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Led Device Packages (AREA)
JP2015022237A 2014-09-12 2015-02-06 半導体発光装置及びリードフレーム Expired - Fee Related JP6653119B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US14/838,850 US20160079217A1 (en) 2014-09-12 2015-08-28 Semiconductor light emitting device and lead frame
TW104128920A TW201611358A (zh) 2014-09-12 2015-09-02 半導體發光裝置及導線架
CN201510556155.8A CN105428511A (zh) 2014-09-12 2015-09-02 半导体发光装置及导线架

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014187089 2014-09-12
JP2014187089 2014-09-12

Publications (3)

Publication Number Publication Date
JP2016063210A JP2016063210A (ja) 2016-04-25
JP2016063210A5 JP2016063210A5 (enExample) 2018-03-15
JP6653119B2 true JP6653119B2 (ja) 2020-02-26

Family

ID=55798306

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015022237A Expired - Fee Related JP6653119B2 (ja) 2014-09-12 2015-02-06 半導体発光装置及びリードフレーム

Country Status (2)

Country Link
JP (1) JP6653119B2 (enExample)
TW (1) TW201611358A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016207739A (ja) 2015-04-17 2016-12-08 株式会社東芝 半導体発光装置及びその製造方法
JP6793139B2 (ja) * 2018-01-25 2020-12-02 日機装株式会社 半導体発光装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101080355B1 (ko) * 2004-10-18 2011-11-04 삼성전자주식회사 발광다이오드와 그 렌즈
JP5212777B2 (ja) * 2007-11-28 2013-06-19 スタンレー電気株式会社 半導体発光装置及び照明装置
JP4985416B2 (ja) * 2008-01-16 2012-07-25 豊田合成株式会社 発光装置
JP2009224431A (ja) * 2008-03-14 2009-10-01 Nichia Corp 半導体装置
JP2011233645A (ja) * 2010-04-26 2011-11-17 Panasonic Corp 半導体装置及びその製造方法
JP2013089717A (ja) * 2011-10-17 2013-05-13 Rohm Co Ltd Ｌｅｄモジュール
JP2014036083A (ja) * 2012-08-08 2014-02-24 Toshiba Corp 半導体発光装置
CN103199183B (zh) * 2013-04-08 2016-01-27 厦门市三安光电科技有限公司 一种提高垂直发光二极管芯片亮度的封装结构

Also Published As

Publication number Publication date
TW201611358A (zh) 2016-03-16
JP2016063210A (ja) 2016-04-25

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