TW201611358A - 半導體發光裝置及導線架 - Google Patents

半導體發光裝置及導線架 Download PDF

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Publication number
TW201611358A
TW201611358A TW104128920A TW104128920A TW201611358A TW 201611358 A TW201611358 A TW 201611358A TW 104128920 A TW104128920 A TW 104128920A TW 104128920 A TW104128920 A TW 104128920A TW 201611358 A TW201611358 A TW 201611358A
Authority
TW
Taiwan
Prior art keywords
wafer
wall
lead frame
light
emitting device
Prior art date
Application number
TW104128920A
Other languages
English (en)
Chinese (zh)
Inventor
江越秀徳
野口吉雄
井上一裕
荒川崇
竹內輝雄
黑木敏宏
小串昌弘
Original Assignee
東芝股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東芝股份有限公司 filed Critical 東芝股份有限公司
Publication of TW201611358A publication Critical patent/TW201611358A/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Led Device Packages (AREA)
TW104128920A 2014-09-12 2015-09-02 半導體發光裝置及導線架 TW201611358A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014187089 2014-09-12
JP2015022237A JP6653119B2 (ja) 2014-09-12 2015-02-06 半導体発光装置及びリードフレーム

Publications (1)

Publication Number Publication Date
TW201611358A true TW201611358A (zh) 2016-03-16

Family

ID=55798306

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104128920A TW201611358A (zh) 2014-09-12 2015-09-02 半導體發光裝置及導線架

Country Status (2)

Country Link
JP (1) JP6653119B2 (enExample)
TW (1) TW201611358A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016207739A (ja) 2015-04-17 2016-12-08 株式会社東芝 半導体発光装置及びその製造方法
JP6793139B2 (ja) * 2018-01-25 2020-12-02 日機装株式会社 半導体発光装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101080355B1 (ko) * 2004-10-18 2011-11-04 삼성전자주식회사 발광다이오드와 그 렌즈
JP5212777B2 (ja) * 2007-11-28 2013-06-19 スタンレー電気株式会社 半導体発光装置及び照明装置
JP4985416B2 (ja) * 2008-01-16 2012-07-25 豊田合成株式会社 発光装置
JP2009224431A (ja) * 2008-03-14 2009-10-01 Nichia Corp 半導体装置
JP2011233645A (ja) * 2010-04-26 2011-11-17 Panasonic Corp 半導体装置及びその製造方法
JP2013089717A (ja) * 2011-10-17 2013-05-13 Rohm Co Ltd Ｌｅｄモジュール
JP2014036083A (ja) * 2012-08-08 2014-02-24 Toshiba Corp 半導体発光装置
CN103199183B (zh) * 2013-04-08 2016-01-27 厦门市三安光电科技有限公司 一种提高垂直发光二极管芯片亮度的封装结构

Also Published As

Publication number Publication date
JP2016063210A (ja) 2016-04-25
JP6653119B2 (ja) 2020-02-26

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