JP6648817B2 - 脆性基板の分断方法 - Google Patents
脆性基板の分断方法 Download PDFInfo
- Publication number
- JP6648817B2 JP6648817B2 JP2018501636A JP2018501636A JP6648817B2 JP 6648817 B2 JP6648817 B2 JP 6648817B2 JP 2018501636 A JP2018501636 A JP 2018501636A JP 2018501636 A JP2018501636 A JP 2018501636A JP 6648817 B2 JP6648817 B2 JP 6648817B2
- Authority
- JP
- Japan
- Prior art keywords
- line
- assist
- cutting edge
- crack
- trench line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005520 cutting process Methods 0.000 title claims description 176
- 239000000758 substrate Substances 0.000 title claims description 122
- 238000000034 method Methods 0.000 title claims description 59
- 239000000314 lubricant Substances 0.000 claims description 5
- 239000011521 glass Substances 0.000 description 54
- 230000015572 biosynthetic process Effects 0.000 description 20
- 206010011376 Crepitations Diseases 0.000 description 14
- 208000037656 Respiratory Sounds Diseases 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 10
- 230000006378 damage Effects 0.000 description 9
- 229910003460 diamond Inorganic materials 0.000 description 7
- 239000010432 diamond Substances 0.000 description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000007790 scraping Methods 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B5/00—Producing shaped articles from the material in moulds or on moulding surfaces, carried or formed by, in or on conveyors irrespective of the manner of shaping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/027—Scoring tool holders; Driving mechanisms therefor
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Dicing (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016035045 | 2016-02-26 | ||
| JP2016035045 | 2016-02-26 | ||
| PCT/JP2017/005934 WO2017145937A1 (ja) | 2016-02-26 | 2017-02-17 | 脆性基板の分断方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019166518A Division JP2019214213A (ja) | 2016-02-26 | 2019-09-12 | 脆性基板の分断方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2017145937A1 JPWO2017145937A1 (ja) | 2018-11-29 |
| JP6648817B2 true JP6648817B2 (ja) | 2020-02-14 |
Family
ID=59685211
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018501636A Expired - Fee Related JP6648817B2 (ja) | 2016-02-26 | 2017-02-17 | 脆性基板の分断方法 |
| JP2019166518A Pending JP2019214213A (ja) | 2016-02-26 | 2019-09-12 | 脆性基板の分断方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019166518A Pending JP2019214213A (ja) | 2016-02-26 | 2019-09-12 | 脆性基板の分断方法 |
Country Status (5)
| Country | Link |
|---|---|
| JP (2) | JP6648817B2 (zh) |
| KR (2) | KR102155598B1 (zh) |
| CN (2) | CN108698254B (zh) |
| TW (2) | TW202039193A (zh) |
| WO (1) | WO2017145937A1 (zh) |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3680213A (en) * | 1969-02-03 | 1972-08-01 | Karl O Reichert | Method of grooving semiconductor wafer for the dividing thereof |
| JP3074143B2 (ja) | 1995-11-06 | 2000-08-07 | 三星ダイヤモンド工業株式会社 | ガラスカッターホイール |
| JP2003183040A (ja) * | 2001-12-18 | 2003-07-03 | Oputo System:Kk | ポイントカッター並びにその使用の方法及び装置 |
| JP4373922B2 (ja) * | 2002-11-06 | 2009-11-25 | 三星ダイヤモンド工業株式会社 | スクライブライン形成装置及びスクライブライン形成方法 |
| WO2005063459A1 (ja) * | 2003-12-29 | 2005-07-14 | Mitsuboshi Diamond Industrial Co., Ltd. | スクライブライン形成機構、スクライブヘッドおよびスクライブ装置 |
| KR101203903B1 (ko) * | 2004-02-02 | 2012-11-23 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | 커터휠, 이를 사용한 취성재료 기판의 스크라이브방법, 절단방법 및 커터휠의 제조방법 |
| JP5129826B2 (ja) * | 2010-02-05 | 2013-01-30 | 三星ダイヤモンド工業株式会社 | 脆性材料基板のブレイク方法 |
| JP2013071335A (ja) * | 2011-09-28 | 2013-04-22 | Mitsuboshi Diamond Industrial Co Ltd | マザー基板の分断方法 |
| TWI488824B (zh) * | 2011-12-05 | 2015-06-21 | Mitsuboshi Diamond Ind Co Ltd | The method and scribing device of glass substrate |
| JP2014031292A (ja) * | 2012-08-03 | 2014-02-20 | Mitsuboshi Diamond Industrial Co Ltd | 強化ガラス基板のスクライブ方法 |
| JP6344787B2 (ja) * | 2012-11-30 | 2018-06-20 | 三星ダイヤモンド工業株式会社 | セラミックス基板の分断方法及びスクライブ装置 |
| JP6201608B2 (ja) * | 2013-10-08 | 2017-09-27 | 三星ダイヤモンド工業株式会社 | スクライブ方法 |
| US10927031B2 (en) * | 2014-03-31 | 2021-02-23 | Mitsuboshi Diamond Industrial Co., Ltd. | Method for dividing brittle-material substrate |
| JP6421472B2 (ja) * | 2014-06-24 | 2018-11-14 | 三星ダイヤモンド工業株式会社 | 脆性基板の分断方法および表示パネルの製造方法 |
| JP6303861B2 (ja) * | 2014-06-25 | 2018-04-04 | 三星ダイヤモンド工業株式会社 | 単結晶基板の分断方法 |
| TWI651182B (zh) * | 2014-06-26 | 2019-02-21 | 日商三星鑽石工業股份有限公司 | 脆性基板之切斷方法及劃線裝置 |
| JP2016030413A (ja) * | 2014-07-30 | 2016-03-07 | 三星ダイヤモンド工業株式会社 | 貼り合わせ基板の分断方法及び分断装置 |
-
2017
- 2017-02-09 TW TW109124597A patent/TW202039193A/zh unknown
- 2017-02-09 TW TW106104255A patent/TWI715718B/zh not_active IP Right Cessation
- 2017-02-17 JP JP2018501636A patent/JP6648817B2/ja not_active Expired - Fee Related
- 2017-02-17 CN CN201780012693.8A patent/CN108698254B/zh not_active Expired - Fee Related
- 2017-02-17 KR KR1020187024459A patent/KR102155598B1/ko active IP Right Grant
- 2017-02-17 CN CN202010254014.1A patent/CN111347574A/zh not_active Withdrawn
- 2017-02-17 WO PCT/JP2017/005934 patent/WO2017145937A1/ja active Application Filing
- 2017-02-17 KR KR1020207004086A patent/KR102205786B1/ko active IP Right Grant
-
2019
- 2019-09-12 JP JP2019166518A patent/JP2019214213A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017145937A1 (ja) | 2017-08-31 |
| CN108698254B (zh) | 2020-08-25 |
| CN111347574A (zh) | 2020-06-30 |
| KR102205786B1 (ko) | 2021-01-20 |
| JPWO2017145937A1 (ja) | 2018-11-29 |
| TWI715718B (zh) | 2021-01-11 |
| KR102155598B1 (ko) | 2020-09-14 |
| CN108698254A (zh) | 2018-10-23 |
| KR20200017563A (ko) | 2020-02-18 |
| JP2019214213A (ja) | 2019-12-19 |
| TW202039193A (zh) | 2020-11-01 |
| KR20180105208A (ko) | 2018-09-27 |
| TW201741107A (zh) | 2017-12-01 |
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| LAPS | Cancellation because of no payment of annual fees |