KR102155598B1 - 취성 기판의 분단 방법 - Google Patents
취성 기판의 분단 방법 Download PDFInfo
- Publication number
- KR102155598B1 KR102155598B1 KR1020187024459A KR20187024459A KR102155598B1 KR 102155598 B1 KR102155598 B1 KR 102155598B1 KR 1020187024459 A KR1020187024459 A KR 1020187024459A KR 20187024459 A KR20187024459 A KR 20187024459A KR 102155598 B1 KR102155598 B1 KR 102155598B1
- Authority
- KR
- South Korea
- Prior art keywords
- line
- blade tip
- assist
- brittle substrate
- crack
- Prior art date
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B5/00—Producing shaped articles from the material in moulds or on moulding surfaces, carried or formed by, in, or on conveyors irrespective of the manner of shaping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/027—Scoring tool holders; Driving mechanisms therefor
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016035045 | 2016-02-26 | ||
JPJP-P-2016-035045 | 2016-02-26 | ||
PCT/JP2017/005934 WO2017145937A1 (ja) | 2016-02-26 | 2017-02-17 | 脆性基板の分断方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020207004086A Division KR102205786B1 (ko) | 2016-02-26 | 2017-02-17 | 취성 기판의 분단 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20180105208A KR20180105208A (ko) | 2018-09-27 |
KR102155598B1 true KR102155598B1 (ko) | 2020-09-14 |
Family
ID=59685211
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020187024459A KR102155598B1 (ko) | 2016-02-26 | 2017-02-17 | 취성 기판의 분단 방법 |
KR1020207004086A KR102205786B1 (ko) | 2016-02-26 | 2017-02-17 | 취성 기판의 분단 방법 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020207004086A KR102205786B1 (ko) | 2016-02-26 | 2017-02-17 | 취성 기판의 분단 방법 |
Country Status (5)
Country | Link |
---|---|
JP (2) | JP6648817B2 (zh) |
KR (2) | KR102155598B1 (zh) |
CN (2) | CN108698254B (zh) |
TW (2) | TW202039193A (zh) |
WO (1) | WO2017145937A1 (zh) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014031292A (ja) | 2012-08-03 | 2014-02-20 | Mitsuboshi Diamond Industrial Co Ltd | 強化ガラス基板のスクライブ方法 |
WO2015151755A1 (ja) | 2014-03-31 | 2015-10-08 | 三星ダイヤモンド工業株式会社 | 脆性材料基板の分断方法 |
WO2015198748A1 (ja) * | 2014-06-26 | 2015-12-30 | 三星ダイヤモンド工業株式会社 | 脆性基板の分断方法およびスクライブ装置 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3680213A (en) * | 1969-02-03 | 1972-08-01 | Karl O Reichert | Method of grooving semiconductor wafer for the dividing thereof |
JP3074143B2 (ja) | 1995-11-06 | 2000-08-07 | 三星ダイヤモンド工業株式会社 | ガラスカッターホイール |
JP2003183040A (ja) * | 2001-12-18 | 2003-07-03 | Oputo System:Kk | ポイントカッター並びにその使用の方法及び装置 |
AU2003280723A1 (en) * | 2002-11-06 | 2004-06-07 | Mitsuboshi Diamond Industrial Co., Ltd. | Scribe line forming device and scribe line forming method |
WO2005063460A1 (ja) * | 2003-12-29 | 2005-07-14 | Mitsuboshi Diamond Industrial Co., Ltd. | スクライブヘッドおよびスクライブ装置 |
EP2851172A1 (en) * | 2004-02-02 | 2015-03-25 | Mitsuboshi Diamond Industrial Co., Ltd. | Cutter wheel and method for manufacturing the cutter wheel |
JP5129826B2 (ja) * | 2010-02-05 | 2013-01-30 | 三星ダイヤモンド工業株式会社 | 脆性材料基板のブレイク方法 |
JP2013071335A (ja) * | 2011-09-28 | 2013-04-22 | Mitsuboshi Diamond Industrial Co Ltd | マザー基板の分断方法 |
TWI488824B (zh) * | 2011-12-05 | 2015-06-21 | Mitsuboshi Diamond Ind Co Ltd | The method and scribing device of glass substrate |
JP6344787B2 (ja) * | 2012-11-30 | 2018-06-20 | 三星ダイヤモンド工業株式会社 | セラミックス基板の分断方法及びスクライブ装置 |
JP6201608B2 (ja) * | 2013-10-08 | 2017-09-27 | 三星ダイヤモンド工業株式会社 | スクライブ方法 |
JP6421472B2 (ja) * | 2014-06-24 | 2018-11-14 | 三星ダイヤモンド工業株式会社 | 脆性基板の分断方法および表示パネルの製造方法 |
JP6303861B2 (ja) * | 2014-06-25 | 2018-04-04 | 三星ダイヤモンド工業株式会社 | 単結晶基板の分断方法 |
JP2016030413A (ja) * | 2014-07-30 | 2016-03-07 | 三星ダイヤモンド工業株式会社 | 貼り合わせ基板の分断方法及び分断装置 |
-
2017
- 2017-02-09 TW TW109124597A patent/TW202039193A/zh unknown
- 2017-02-09 TW TW106104255A patent/TWI715718B/zh not_active IP Right Cessation
- 2017-02-17 WO PCT/JP2017/005934 patent/WO2017145937A1/ja active Application Filing
- 2017-02-17 CN CN201780012693.8A patent/CN108698254B/zh not_active Expired - Fee Related
- 2017-02-17 CN CN202010254014.1A patent/CN111347574A/zh not_active Withdrawn
- 2017-02-17 KR KR1020187024459A patent/KR102155598B1/ko active IP Right Grant
- 2017-02-17 KR KR1020207004086A patent/KR102205786B1/ko active IP Right Grant
- 2017-02-17 JP JP2018501636A patent/JP6648817B2/ja not_active Expired - Fee Related
-
2019
- 2019-09-12 JP JP2019166518A patent/JP2019214213A/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014031292A (ja) | 2012-08-03 | 2014-02-20 | Mitsuboshi Diamond Industrial Co Ltd | 強化ガラス基板のスクライブ方法 |
WO2015151755A1 (ja) | 2014-03-31 | 2015-10-08 | 三星ダイヤモンド工業株式会社 | 脆性材料基板の分断方法 |
WO2015198748A1 (ja) * | 2014-06-26 | 2015-12-30 | 三星ダイヤモンド工業株式会社 | 脆性基板の分断方法およびスクライブ装置 |
Also Published As
Publication number | Publication date |
---|---|
KR20200017563A (ko) | 2020-02-18 |
TWI715718B (zh) | 2021-01-11 |
WO2017145937A1 (ja) | 2017-08-31 |
KR102205786B1 (ko) | 2021-01-20 |
CN111347574A (zh) | 2020-06-30 |
CN108698254A (zh) | 2018-10-23 |
JP6648817B2 (ja) | 2020-02-14 |
CN108698254B (zh) | 2020-08-25 |
KR20180105208A (ko) | 2018-09-27 |
TW201741107A (zh) | 2017-12-01 |
JP2019214213A (ja) | 2019-12-19 |
JPWO2017145937A1 (ja) | 2018-11-29 |
TW202039193A (zh) | 2020-11-01 |
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E902 | Notification of reason for refusal | ||
A107 | Divisional application of patent | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant |