JP6641463B2 - 電力変換装置 - Google Patents
電力変換装置 Download PDFInfo
- Publication number
- JP6641463B2 JP6641463B2 JP2018514164A JP2018514164A JP6641463B2 JP 6641463 B2 JP6641463 B2 JP 6641463B2 JP 2018514164 A JP2018514164 A JP 2018514164A JP 2018514164 A JP2018514164 A JP 2018514164A JP 6641463 B2 JP6641463 B2 JP 6641463B2
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- JP
- Japan
- Prior art keywords
- flow path
- power semiconductor
- semiconductor module
- forming body
- path forming
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- 239000004065 semiconductor Substances 0.000 claims description 105
- 238000007789 sealing Methods 0.000 claims description 18
- 230000005855 radiation Effects 0.000 claims description 14
- 238000003780 insertion Methods 0.000 claims description 8
- 230000037431 insertion Effects 0.000 claims description 8
- 238000006243 chemical reaction Methods 0.000 claims description 5
- 239000002826 coolant Substances 0.000 claims description 2
- 239000003507 refrigerant Substances 0.000 description 26
- 238000010586 diagram Methods 0.000 description 11
- 239000003990 capacitor Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/42—Conversion of dc power input into ac power output without possibility of reversal
- H02M7/44—Conversion of dc power input into ac power output without possibility of reversal by static converters
- H02M7/48—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/115—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Thermal Sciences (AREA)
- Inverter Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
Description
・本実施形態では、第1放熱部305a及び第2放熱部305bに放熱用フィン305cが配置されている。また放熱用フィン305cは筒形状である必要は無く、別形状を成していても良く、または放熱用フィン305cが無い形状を成していても良い。
直流入力バスバー、260…回路基板、270…筐体上部カバー、300a…パワー半導体モジュール、300b…パワー半導体モジュール、300c…パワー半導体モジュール
、300d…パワー半導体モジュール、300e…パワー半導体モジュール、301…モジュールケース、302…挿入口、303…封止体、304…第1突出部、304a…流路側壁、305a…第1放熱部、305b…第2放熱部、305c…放熱用フィン、306…第1溝部、307…第1シール面、308…第2溝部、309…第2シール面、310…パワー半導体モジュール底面、311…第2突出部、311a…流路側壁、320…第1端子、321…第2端子、400…流路、400a…一面、401…第1開口、402…第2開口、500…固定板、801…第1シール部材、802…第2シール部材
Claims (5)
- パワー半導体モジュールと、
前記パワー半導体モジュールを収納するとともに冷媒を流す流路を形成する流路形成体と、を備え、
前記流路形成体は、当該流路形成体の一面から前記流路へと連通する第1開口を形成し、
前記パワー半導体モジュールは、
前記第1開口から前記流路へ挿入され、
当該パワー半導体モジュールの前記流路への挿入方向に沿って形成されかつ前記流路形成体と対向する第1シール面と、前記挿入方向に沿って形成されかつ前記流路形成体と対向する第2シール面と、を形成する電力変換装置。 - 請求項1に記載の電力変換装置であって、
前記流路形成体と接触するとともに前記第1シール面側に配置される第1シール部材と、
前記流路形成体と接触するとともに前記第2シール面側に配置される第2シール部材と、を備える電力変換装置。 - 請求項1又は2に記載の電力変換装置であって、
前記流路形成体は、前記第1開口とは異なる当該流路形成体の面に形成されかつ当該流路形成体の一面から前記流路へと連通する第2開口を形成し、
前記パワー半導体モジュールは、前記第1開口から突出する第1端子と、前記第2開口から突出する第2端子と、を有する電力変換装置。 - 請求項1ないし3に記載のいずれかの電力変換装置であって、
前記パワー半導体モジュールは、放熱面を形成する本体部と、当該本体部から突出しかつ当該突出の先端面に前記第1シール面を形成する第1突出部を有する電力変換装置。 - 請求項4に記載の電力変換装置であって、
前記パワー半導体モジュールは、当該本体部から突出しかつ当該突出の先端面に前記第2シール面を形成する第2突出部を有する電力変換装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016090042 | 2016-04-28 | ||
JP2016090042 | 2016-04-28 | ||
PCT/JP2017/008301 WO2017187781A1 (ja) | 2016-04-28 | 2017-03-02 | 電力変換装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2017187781A1 JPWO2017187781A1 (ja) | 2019-02-21 |
JP6641463B2 true JP6641463B2 (ja) | 2020-02-05 |
Family
ID=60161395
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018514164A Active JP6641463B2 (ja) | 2016-04-28 | 2017-03-02 | 電力変換装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20190123659A1 (ja) |
JP (1) | JP6641463B2 (ja) |
WO (1) | WO2017187781A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20220346286A1 (en) * | 2021-04-22 | 2022-10-27 | Hyundai Motor Company | Power inverter |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7436415B2 (ja) | 2021-03-29 | 2024-02-21 | 株式会社日立製作所 | 電力変換ユニットおよび電力変換装置 |
CN115250590A (zh) * | 2021-04-28 | 2022-10-28 | 比亚迪股份有限公司 | 电机控制器和具有其的车辆 |
DE102021210938A1 (de) | 2021-09-30 | 2023-03-30 | Zf Friedrichshafen Ag | Inverter mit optimiertem elektromagnetischem Verhalten |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5439309B2 (ja) * | 2010-07-28 | 2014-03-12 | 日立オートモティブシステムズ株式会社 | 電力変換装置 |
JP6215151B2 (ja) * | 2014-08-01 | 2017-10-18 | 日立オートモティブシステムズ株式会社 | 電力変換装置 |
JP2016092868A (ja) * | 2014-10-30 | 2016-05-23 | トヨタ自動車株式会社 | 積層ユニット |
-
2017
- 2017-03-02 US US16/096,564 patent/US20190123659A1/en not_active Abandoned
- 2017-03-02 JP JP2018514164A patent/JP6641463B2/ja active Active
- 2017-03-02 WO PCT/JP2017/008301 patent/WO2017187781A1/ja active Application Filing
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20220346286A1 (en) * | 2021-04-22 | 2022-10-27 | Hyundai Motor Company | Power inverter |
Also Published As
Publication number | Publication date |
---|---|
JPWO2017187781A1 (ja) | 2019-02-21 |
WO2017187781A1 (ja) | 2017-11-02 |
US20190123659A1 (en) | 2019-04-25 |
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