JP6639320B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP6639320B2
JP6639320B2 JP2016089226A JP2016089226A JP6639320B2 JP 6639320 B2 JP6639320 B2 JP 6639320B2 JP 2016089226 A JP2016089226 A JP 2016089226A JP 2016089226 A JP2016089226 A JP 2016089226A JP 6639320 B2 JP6639320 B2 JP 6639320B2
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JP
Japan
Prior art keywords
bus bar
cooler
phase
power
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2016089226A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017200315A (ja
JP2017200315A5 (https=
Inventor
佐藤　豊
豊 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Marelli Corp
Original Assignee
Marelli Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marelli Corp filed Critical Marelli Corp
Priority to JP2016089226A priority Critical patent/JP6639320B2/ja
Priority to PCT/JP2017/016696 priority patent/WO2017188368A1/ja
Priority to US16/097,143 priority patent/US11348855B2/en
Publication of JP2017200315A publication Critical patent/JP2017200315A/ja
Publication of JP2017200315A5 publication Critical patent/JP2017200315A5/ja
Application granted granted Critical
Publication of JP6639320B2 publication Critical patent/JP6639320B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60L—PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
    • B60L9/00—Electric propulsion with power supply external to the vehicle
    • B60L9/16—Electric propulsion with power supply external to the vehicle using AC induction motors
    • B60L9/18—Electric propulsion with power supply external to the vehicle using AC induction motors fed from DC supply lines
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00—Details of apparatus for conversion
    • H02M1/32—Means for protecting converters other than automatic disconnection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/411—Insulated-gate bipolar transistors [IGBT]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/811—Multiple chips on leadframes
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Sustainable Energy (AREA)
  • Transportation (AREA)
  • Mechanical Engineering (AREA)
  • Inverter Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Electric Propulsion And Braking For Vehicles (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
JP2016089226A 2016-04-27 2016-04-27 半導体装置 Expired - Fee Related JP6639320B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2016089226A JP6639320B2 (ja) 2016-04-27 2016-04-27 半導体装置
PCT/JP2017/016696 WO2017188368A1 (ja) 2016-04-27 2017-04-27 半導体装置及びパワーモジュール
US16/097,143 US11348855B2 (en) 2016-04-27 2017-04-27 Semiconductor component and power module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016089226A JP6639320B2 (ja) 2016-04-27 2016-04-27 半導体装置

Publications (3)

Publication Number Publication Date
JP2017200315A JP2017200315A (ja) 2017-11-02
JP2017200315A5 JP2017200315A5 (https=) 2019-07-25
JP6639320B2 true JP6639320B2 (ja) 2020-02-05

Family

ID=60159789

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016089226A Expired - Fee Related JP6639320B2 (ja) 2016-04-27 2016-04-27 半導体装置

Country Status (3)

Country Link
US (1) US11348855B2 (https=)
JP (1) JP6639320B2 (https=)
WO (1) WO2017188368A1 (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020053611A (ja) * 2018-09-28 2020-04-02 三菱電機株式会社 半導体モジュール、および、半導体モジュールの製造方法
JP7147859B2 (ja) 2018-10-05 2022-10-05 富士電機株式会社 半導体装置、半導体モジュールおよび車両
JP6760691B1 (ja) * 2019-05-10 2020-09-23 三菱電機株式会社 電力変換装置
JP6752381B1 (ja) * 2019-06-06 2020-09-09 三菱電機株式会社 半導体モジュールおよび電力変換装置
JP7694072B2 (ja) * 2021-03-11 2025-06-18 富士電機株式会社 半導体モジュール
JP7632011B2 (ja) * 2021-04-09 2025-02-19 株式会社デンソー パワーカード
JP7484817B2 (ja) * 2021-06-02 2024-05-16 株式会社デンソー 電気機器
JP7707676B2 (ja) * 2021-06-16 2025-07-15 富士電機株式会社 半導体モジュール
JP7166408B1 (ja) 2021-09-06 2022-11-07 三菱電機株式会社 回転電機
DE112022006534T5 (de) * 2022-03-25 2024-11-28 Hitachi Astemo, Ltd. Leistungsumwandlungsvorrichtung
JP7439158B2 (ja) * 2022-03-31 2024-02-27 本田技研工業株式会社 電力変換装置
WO2026034269A1 (ja) * 2024-08-05 2026-02-12 ローム株式会社 半導体モジュール、車両、および半導体モジュールの製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH077836B2 (ja) * 1986-10-31 1995-01-30 オムロン株式会社 固体継電器
JPH09129796A (ja) * 1995-10-27 1997-05-16 Rohm Co Ltd 半導体装置
JP3406753B2 (ja) 1995-11-30 2003-05-12 三菱電機株式会社 半導体装置および半導体モジュール
JP2004200264A (ja) * 2002-12-17 2004-07-15 Renesas Technology Corp 半導体装置およびその製造方法
KR101221805B1 (ko) * 2006-03-03 2013-01-14 페어차일드코리아반도체 주식회사 전력 소자용 패키지 및 패키지 어셈블리
JP4840165B2 (ja) * 2007-01-29 2011-12-21 株式会社デンソー 半導体装置
TW201011869A (en) * 2008-09-10 2010-03-16 Cyntec Co Ltd Chip package structure
US8513784B2 (en) * 2010-03-18 2013-08-20 Alpha & Omega Semiconductor Incorporated Multi-layer lead frame package and method of fabrication
JP5581822B2 (ja) * 2010-06-07 2014-09-03 日産自動車株式会社 半導体装置
JP5257817B2 (ja) * 2010-06-15 2013-08-07 三菱電機株式会社 半導体装置
JP5220245B2 (ja) 2010-12-28 2013-06-26 三菱電機株式会社 電力変換装置
JP5813963B2 (ja) * 2011-02-28 2015-11-17 ローム株式会社 半導体装置、および、半導体装置の実装構造
JP5484429B2 (ja) * 2011-11-18 2014-05-07 三菱電機株式会社 電力変換装置
DE102013219192A1 (de) * 2013-09-24 2015-03-26 Conti Temic Microelectronic Gmbh Leistungsmodul, Stromrichter und Antriebsanordnung mit einem Leistungsmodul
JP6125984B2 (ja) 2013-12-11 2017-05-10 トヨタ自動車株式会社 半導体装置

Also Published As

Publication number Publication date
WO2017188368A1 (ja) 2017-11-02
JP2017200315A (ja) 2017-11-02
US11348855B2 (en) 2022-05-31
US20210225724A1 (en) 2021-07-22

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