JP6634722B2 - 絶縁ブスバーおよび製造方法 - Google Patents
絶縁ブスバーおよび製造方法 Download PDFInfo
- Publication number
- JP6634722B2 JP6634722B2 JP2015140433A JP2015140433A JP6634722B2 JP 6634722 B2 JP6634722 B2 JP 6634722B2 JP 2015140433 A JP2015140433 A JP 2015140433A JP 2015140433 A JP2015140433 A JP 2015140433A JP 6634722 B2 JP6634722 B2 JP 6634722B2
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- Japan
- Prior art keywords
- resin
- bus bar
- connection terminals
- circuit conductor
- insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000004020 conductor Substances 0.000 claims description 123
- 229920005989 resin Polymers 0.000 claims description 118
- 239000011347 resin Substances 0.000 claims description 118
- 238000002347 injection Methods 0.000 claims description 32
- 239000007924 injection Substances 0.000 claims description 32
- 239000004065 semiconductor Substances 0.000 claims description 23
- 238000003780 insertion Methods 0.000 claims description 11
- 230000037431 insertion Effects 0.000 claims description 11
- 239000000758 substrate Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/18—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing bases or cases for contact members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R25/00—Coupling parts adapted for simultaneous co-operation with two or more identical counterparts, e.g. for distributing energy to two or more circuits
- H01R25/16—Rails or bus-bars provided with a plurality of discrete connecting locations for counterparts
- H01R25/161—Details
- H01R25/162—Electrical connections between or with rails or bus-bars
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
- H01R43/24—Assembling by moulding on contact members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
- H01R9/22—Bases, e.g. strip, block, panel
- H01R9/24—Terminal blocks
- H01R9/2458—Electrical interconnections between terminal blocks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
- H05K7/1432—Housings specially adapted for power drive units or power converters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
- H05K7/1432—Housings specially adapted for power drive units or power converters
- H05K7/14329—Housings specially adapted for power drive units or power converters specially adapted for the configuration of power bus bars
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Inverter Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Connection Or Junction Boxes (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Description
[先行技術文献]
[特許文献]
特許文献1 特開2010−129867号公報
Claims (2)
- 半導体チップを載置するモジュールと接続する絶縁ブスバーであって、
複数の回路導体と、
それぞれの回路導体を、前記モジュールに電気的に接続する複数の接続端子と、
それぞれの回路導体の間、および、それぞれの接続端子の周囲の少なくとも一部に一体に形成され、且つ、前記回路導体の間において隙間を有さない絶縁性の樹脂部と
を備えており、
それぞれの前記接続端子は、相手方端子が挿入される挿入孔を有し、前記挿入孔の内部に、前記相手方端子を押圧する弾性部を有する
絶縁ブスバー。 - 絶縁ブスバーを製造する製造方法であって、
複数の回路導体および複数の接続端子を、樹脂注入型の中の予め定められた位置に配置する段階と、
前記樹脂注入型の中を絶対圧で80kPa以下に減圧した状態で、前記樹脂注入型の中に絶縁性の樹脂を注入して、前記複数の回路導体および前記複数の接続端子の周囲に隙間なく樹脂部を形成する段階と
を備えており、
それぞれの前記接続端子は、相手方端子が挿入される挿入孔を有し、前記挿入孔の内部に、前記相手方端子を押圧する弾性部を有する、
製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015140433A JP6634722B2 (ja) | 2015-07-14 | 2015-07-14 | 絶縁ブスバーおよび製造方法 |
US15/203,755 US10109973B2 (en) | 2015-07-14 | 2016-07-06 | Insulating busbar and manufacturing method |
DE102016212381.5A DE102016212381A1 (de) | 2015-07-14 | 2016-07-07 | Isolierende Sammelschiene und Herstellungsverfahren |
CN201610532361.XA CN106684068B (zh) | 2015-07-14 | 2016-07-07 | 绝缘母线及制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015140433A JP6634722B2 (ja) | 2015-07-14 | 2015-07-14 | 絶縁ブスバーおよび製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017022309A JP2017022309A (ja) | 2017-01-26 |
JP6634722B2 true JP6634722B2 (ja) | 2020-01-22 |
Family
ID=57630161
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015140433A Active JP6634722B2 (ja) | 2015-07-14 | 2015-07-14 | 絶縁ブスバーおよび製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US10109973B2 (ja) |
JP (1) | JP6634722B2 (ja) |
CN (1) | CN106684068B (ja) |
DE (1) | DE102016212381A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9753980B1 (en) * | 2013-02-25 | 2017-09-05 | EMC IP Holding Company LLC | M X N dispatching in large scale distributed system |
EP3614550B1 (en) * | 2017-04-20 | 2021-02-17 | Mitsubishi Electric Corporation | Power conversion device |
JP6824840B2 (ja) * | 2017-07-11 | 2021-02-03 | 東芝三菱電機産業システム株式会社 | ラミネートブスバー |
JP6888525B2 (ja) * | 2017-11-06 | 2021-06-16 | 株式会社デンソー | 通電部材モジュールの製造方法 |
DE102021209438A1 (de) | 2021-08-27 | 2023-03-02 | Robert Bosch Gesellschaft mit beschränkter Haftung | Leistungshalbleiterbauteil und Verfahren zur Herstellung eines Leistungshalbleiterbauteils |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09139264A (ja) * | 1995-11-13 | 1997-05-27 | Yazaki Corp | Pcb用多極コネクタ |
JP3266023B2 (ja) * | 1996-12-26 | 2002-03-18 | 矢崎総業株式会社 | ブスバーの回路変更構造 |
US6093041A (en) * | 1998-10-30 | 2000-07-25 | Lucent Technologies Inc. | Connector block with internal power bus |
JP2003059598A (ja) * | 2001-08-21 | 2003-02-28 | Sumitomo Wiring Syst Ltd | ジョイントコネクタ |
JP2006217769A (ja) | 2005-02-07 | 2006-08-17 | Nissan Motor Co Ltd | バスバー構造体 |
JP2010129867A (ja) | 2008-11-28 | 2010-06-10 | Mitsubishi Electric Corp | 電力用半導体装置 |
JP2010274602A (ja) * | 2009-05-29 | 2010-12-09 | Hitachi Cable Ltd | モールド樹脂成形体 |
JP2011035277A (ja) | 2009-08-05 | 2011-02-17 | Denso Corp | ブスバーアセンブリ及びその製造方法 |
JP5549491B2 (ja) | 2010-09-06 | 2014-07-16 | 日立金属株式会社 | バスバーモジュールの製造方法、及びバスバーモジュール |
JP5301514B2 (ja) * | 2010-09-28 | 2013-09-25 | 株式会社神戸製鋼所 | バスバー、バスバーの製造方法、及び、バスバーおよびコネクタ |
JP2012182047A (ja) * | 2011-03-02 | 2012-09-20 | Auto Network Gijutsu Kenkyusho:Kk | バスバーセット及びその製造方法 |
JP2012235625A (ja) | 2011-05-02 | 2012-11-29 | Hitachi Cable Ltd | バスバーモジュール及びその製造方法 |
JP6064805B2 (ja) * | 2013-06-19 | 2017-01-25 | 富士電機株式会社 | 絶縁ブスバー及びその製造方法 |
JP5854011B2 (ja) * | 2013-09-06 | 2016-02-09 | トヨタ自動車株式会社 | 半導体装置、及び半導体装置の製造方法 |
US9674940B2 (en) * | 2014-08-14 | 2017-06-06 | Samsung Electronics Co., Ltd. | Electronic device and semiconductor package with thermally conductive via |
US9373585B2 (en) * | 2014-09-17 | 2016-06-21 | Invensas Corporation | Polymer member based interconnect |
-
2015
- 2015-07-14 JP JP2015140433A patent/JP6634722B2/ja active Active
-
2016
- 2016-07-06 US US15/203,755 patent/US10109973B2/en active Active
- 2016-07-07 CN CN201610532361.XA patent/CN106684068B/zh active Active
- 2016-07-07 DE DE102016212381.5A patent/DE102016212381A1/de active Pending
Also Published As
Publication number | Publication date |
---|---|
JP2017022309A (ja) | 2017-01-26 |
DE102016212381A1 (de) | 2017-01-19 |
CN106684068B (zh) | 2020-07-07 |
US20170018884A1 (en) | 2017-01-19 |
US10109973B2 (en) | 2018-10-23 |
CN106684068A (zh) | 2017-05-17 |
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