JP6632418B2 - 基板処理システムおよび基板処理方法 - Google Patents
基板処理システムおよび基板処理方法 Download PDFInfo
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- JP6632418B2 JP6632418B2 JP2016029467A JP2016029467A JP6632418B2 JP 6632418 B2 JP6632418 B2 JP 6632418B2 JP 2016029467 A JP2016029467 A JP 2016029467A JP 2016029467 A JP2016029467 A JP 2016029467A JP 6632418 B2 JP6632418 B2 JP 6632418B2
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- 239000000758 substrate Substances 0.000 title claims description 320
- 238000003672 processing method Methods 0.000 title claims description 6
- 238000007747 plating Methods 0.000 claims description 350
- 230000032258 transport Effects 0.000 claims description 172
- 238000000034 method Methods 0.000 claims description 89
- 230000008569 process Effects 0.000 claims description 84
- 238000003860 storage Methods 0.000 claims description 56
- 239000007788 liquid Substances 0.000 claims description 54
- 230000003028 elevating effect Effects 0.000 claims description 18
- 230000004044 response Effects 0.000 claims description 15
- 238000005406 washing Methods 0.000 description 63
- 238000004140 cleaning Methods 0.000 description 47
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 29
- 239000000126 substance Substances 0.000 description 16
- 238000001035 drying Methods 0.000 description 12
- 238000007781 pre-processing Methods 0.000 description 11
- 238000010586 diagram Methods 0.000 description 8
- 230000007246 mechanism Effects 0.000 description 8
- 239000012528 membrane Substances 0.000 description 7
- 238000004381 surface treatment Methods 0.000 description 7
- 238000011068 loading method Methods 0.000 description 6
- 238000011144 upstream manufacturing Methods 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- 238000007599 discharging Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000006870 function Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/20—Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
- B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/041—Cleaning travelling work
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/6723—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one plating chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67715—Changing the direction of the conveying path
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Automation & Control Theory (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Chemically Coating (AREA)
Description
51…ローラ搬送部(第2搬送部)
52…洗浄液供給部(処理液供給部)
53…洗浄液吐出ノズル
61…ローラ搬送部(第1搬送部)
62…枠体
63…昇降部
64,64A…めっき液供給部
68…給電部
72…Y方向搬送部(第3搬送部)
73…X方向搬送部(第3搬送部)
622…スリット(排出部)
623…切欠(排出部)
631…バックアッププレート(昇降部材)
632…昇降機構
651…アノード電極
661…カソード電極
PB…前処理装置(前々段装置)
PC,PH…水洗装置(前段装置)
PG…移送装置(前々段装置)
RA,RA1…貯留空間
S…基板
S1…基板の表面(一方主面)
S2…基板の裏面(他方主面)
SP…被めっき領域
Claims (5)
- 第1基板を搬送する第1搬送部を有し、静止した状態で前記第1基板の表面にめっき処理を施した後で前記第1基板を前記第1搬送部により搬出するめっき装置と、
第2基板を搬送する第2搬送部を有し、前記第1搬送部による前記第1基板の搬出に対応して前記第2基板を前記第1基板として前記第2搬送部により前記めっき装置に搬送する前段装置と、を備え、
前記第2搬送部は前記めっき装置に向かう搬送方向において前記第2基板を往復移動可能となっており、前記めっき処理の時間に応じて、前記前段装置内で前記第2基板を往復移動させて前記第2基板を前記めっき装置に搬送するタイミングを制御することを特徴とする基板処理システム。 - 請求項1に記載の基板処理システムであって、
前記前段装置は、前記第2搬送部により搬送される前記第2基板に処理液を吐出するノズルと、前記ノズルに前記処理液を供給する処理液供給部とを有し、
単位時間当たりに前記ノズルから吐出される前記処理液の量が制御可能となっている基板処理システム。 - 請求項1または2に記載の基板処理システムであって、
前記第2基板を前記前段装置に搬送する第3搬送部を有する前々段装置を備え、
前記めっき処理の時間に応じて、前記第3搬送部が前記第2基板を前記前段装置に搬送するタイミングが制御される基板処理システム。 - 請求項1ないし3のいずれか一項に記載の基板処理システムであって、
前記めっき装置は、
前記第1基板の一方主面の被めっき領域を取り囲む形状を有する枠体と、
前記枠体に対して前記基板を相対的に上昇させて前記枠体と前記被めっき領域とでめっき液を貯留する貯留空間を形成する昇降部と、
前記貯留空間にめっき液を供給する供給部と、
前記被めっき領域に電気的に接続されたカソード電極と、
前記貯留空間に貯留されためっき液に接液するアノード電極とを備え、
前記第1搬送部は、前記被めっき領域を上方に向けた状態で前記基板の他方主面を支持しながら前記基板を前記枠体の下方位置に搬送し、
前記昇降部および前記第1搬送部のうち少なくとも一方で前記基板の他方主面を下方から支持しながら前記カソード電極と前記アノード電極との間に電流を流して前記めっき処理を行う基板処理システム。 - めっき装置によって静止した状態で第1基板の表面にめっき処理を施した後で前記第1基板を前記めっき装置から搬出する工程と、
前段装置によって第2基板を前記第1基板として前記めっき装置に搬送する工程と、を備え、
前記めっき処理の時間に応じて前記前段装置内で前記めっき装置に向かう搬送方向において前記第2基板を往復移動させることで、前記第2基板を前記めっき装置に搬送するタイミングを制御することを特徴とする基板処理方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016029467A JP6632418B2 (ja) | 2016-02-19 | 2016-02-19 | 基板処理システムおよび基板処理方法 |
PCT/JP2016/081538 WO2017141495A1 (ja) | 2016-02-19 | 2016-10-25 | 基板処理システムおよび基板処理方法 |
US15/999,054 US20210010148A1 (en) | 2016-02-19 | 2016-10-25 | Substrate processing system and substrate processing method |
TW105137875A TWI640659B (zh) | 2016-02-19 | 2016-11-18 | 基板處理系統及基板處理方法 |
Applications Claiming Priority (1)
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JP2016029467A JP6632418B2 (ja) | 2016-02-19 | 2016-02-19 | 基板処理システムおよび基板処理方法 |
Publications (2)
Publication Number | Publication Date |
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JP2017145481A JP2017145481A (ja) | 2017-08-24 |
JP6632418B2 true JP6632418B2 (ja) | 2020-01-22 |
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Country Status (4)
Country | Link |
---|---|
US (1) | US20210010148A1 (ja) |
JP (1) | JP6632418B2 (ja) |
TW (1) | TWI640659B (ja) |
WO (1) | WO2017141495A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP7166817B2 (ja) * | 2018-07-12 | 2022-11-08 | 株式会社荏原製作所 | 基板搬送装置および基板搬送装置を備える基板処理装置 |
CN115672844B (zh) * | 2023-01-04 | 2023-03-28 | 河北橡一医药科技股份有限公司 | 可清洁内壁的医用胶塞清洗机 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05320954A (ja) * | 1992-05-21 | 1993-12-07 | Arumetsukusu:Kk | 平板形状ワークの給排装置 |
JP2001089899A (ja) * | 1999-09-21 | 2001-04-03 | Fujisash Co | 全自動小型表面処理装置 |
US20020027080A1 (en) * | 2000-03-17 | 2002-03-07 | Junichiro Yoshioka | Plating apparatus and method |
JP4136826B2 (ja) * | 2002-08-19 | 2008-08-20 | 住友精密工業株式会社 | 昇降式基板処理装置及びこれを備えた基板処理システム |
JP5876702B2 (ja) * | 2011-10-13 | 2016-03-02 | 株式会社Screenホールディングス | 基板処理装置 |
-
2016
- 2016-02-19 JP JP2016029467A patent/JP6632418B2/ja active Active
- 2016-10-25 US US15/999,054 patent/US20210010148A1/en not_active Abandoned
- 2016-10-25 WO PCT/JP2016/081538 patent/WO2017141495A1/ja active Application Filing
- 2016-11-18 TW TW105137875A patent/TWI640659B/zh active
Also Published As
Publication number | Publication date |
---|---|
TWI640659B (zh) | 2018-11-11 |
US20210010148A1 (en) | 2021-01-14 |
JP2017145481A (ja) | 2017-08-24 |
WO2017141495A1 (ja) | 2017-08-24 |
TW201800623A (zh) | 2018-01-01 |
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