JP6622940B1 - 両面実装基板、両面実装基板の製造方法、および半導体レーザ - Google Patents

両面実装基板、両面実装基板の製造方法、および半導体レーザ Download PDF

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Publication number
JP6622940B1
JP6622940B1 JP2019123365A JP2019123365A JP6622940B1 JP 6622940 B1 JP6622940 B1 JP 6622940B1 JP 2019123365 A JP2019123365 A JP 2019123365A JP 2019123365 A JP2019123365 A JP 2019123365A JP 6622940 B1 JP6622940 B1 JP 6622940B1
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Japan
Prior art keywords
film
double
sided mounting
wiring
layer
Prior art date
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Active
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JP2019123365A
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English (en)
Japanese (ja)
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JP2021009942A (ja
Inventor
英昭 竹盛
英昭 竹盛
青木　久
久 青木
直登 菊池
直登 菊池
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Hitachi Power Solutions Co Ltd
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Hitachi Power Solutions Co Ltd
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Application filed by Hitachi Power Solutions Co Ltd filed Critical Hitachi Power Solutions Co Ltd
Priority to JP2019123365A priority Critical patent/JP6622940B1/ja
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Publication of JP6622940B1 publication Critical patent/JP6622940B1/ja
Priority to SG10202005312XA priority patent/SG10202005312XA/en
Priority to CN202010553196.2A priority patent/CN112260055B/zh
Priority to MYPI2020003185A priority patent/MY197093A/en
Publication of JP2021009942A publication Critical patent/JP2021009942A/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/0206—Substrates, e.g. growth, shape, material, removal or bonding
    • H01S5/0208—Semi-insulating substrates

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Physical Vapour Deposition (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Semiconductor Lasers (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
JP2019123365A 2019-07-02 2019-07-02 両面実装基板、両面実装基板の製造方法、および半導体レーザ Active JP6622940B1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2019123365A JP6622940B1 (ja) 2019-07-02 2019-07-02 両面実装基板、両面実装基板の製造方法、および半導体レーザ
SG10202005312XA SG10202005312XA (en) 2019-07-02 2020-06-05 Double-sided mounting board, method of manufacturing double-sided mounting board, and semiconductor laser
CN202010553196.2A CN112260055B (zh) 2019-07-02 2020-06-17 两面安装基板、两面安装基板的制造方法及半导体激光器
MYPI2020003185A MY197093A (en) 2019-07-02 2020-06-19 Double-sided mounting board, method of manufacturing double-sided mounting board, and semiconductor laser

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019123365A JP6622940B1 (ja) 2019-07-02 2019-07-02 両面実装基板、両面実装基板の製造方法、および半導体レーザ

Publications (2)

Publication Number Publication Date
JP6622940B1 true JP6622940B1 (ja) 2019-12-18
JP2021009942A JP2021009942A (ja) 2021-01-28

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JP2019123365A Active JP6622940B1 (ja) 2019-07-02 2019-07-02 両面実装基板、両面実装基板の製造方法、および半導体レーザ

Country Status (4)

Country Link
JP (1) JP6622940B1 (zh)
CN (1) CN112260055B (zh)
MY (1) MY197093A (zh)
SG (1) SG10202005312XA (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113079626A (zh) * 2021-03-18 2021-07-06 扬州国宇电子有限公司 一种陶瓷基板薄膜电路结构及其制备方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101217136B (zh) * 2003-05-29 2011-03-02 日本电气株式会社 布线结构及其制造方法
KR101124999B1 (ko) * 2003-12-02 2012-03-27 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치와 그 제조 방법
JP4932268B2 (ja) * 2005-02-10 2012-05-16 株式会社半導体エネルギー研究所 半導体装置、及び半導体装置の作製方法
JP4679193B2 (ja) * 2005-03-22 2011-04-27 株式会社東芝 半導体装置の製造方法及び半導体装置
JP6213143B2 (ja) * 2013-10-23 2017-10-18 富士電機株式会社 半導体基板、及び、半導体基板の製造方法

Also Published As

Publication number Publication date
CN112260055B (zh) 2024-04-09
JP2021009942A (ja) 2021-01-28
MY197093A (en) 2023-05-24
SG10202005312XA (en) 2021-02-25
CN112260055A (zh) 2021-01-22

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