JP6620314B2 - 液状樹脂組成物、硬化物、配線構造体及びこの配線構造体を用いた実装体 - Google Patents
液状樹脂組成物、硬化物、配線構造体及びこの配線構造体を用いた実装体 Download PDFInfo
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- JP6620314B2 JP6620314B2 JP2016510034A JP2016510034A JP6620314B2 JP 6620314 B2 JP6620314 B2 JP 6620314B2 JP 2016510034 A JP2016510034 A JP 2016510034A JP 2016510034 A JP2016510034 A JP 2016510034A JP 6620314 B2 JP6620314 B2 JP 6620314B2
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
- C08K5/3445—Five-membered rings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49894—Materials of the insulating layers or coatings
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/16—Solid spheres
- C08K7/18—Solid spheres inorganic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
120 配線構造体
130 金属配線
130A 金属板
140 硬化物
150 半導体
160 実装体
170A,170B,170C,170D 評価サンプル
180A,180B,180C 治具
190 矢印
200 樹脂基板
210 剥離部
220 隙間
230 指
240 クラック
250 メタルマスク
260 液状樹脂組成物
270 スキージ
280,310 金属板
290 凸部
300 凹部
Claims (9)
- ポリアルキレングリコール骨格を有する液状の第1エポキシ樹脂と液状のビスフェノールF型エポキシ樹脂である第2エポキシ樹脂とを含む液状エポキシ樹脂と、
フェノール性水酸基を1分子中に複数個有するとともに、25℃における粘度が1000mPa・s以下である液状硬化剤と、
硬化促進剤と、
セラミック充填剤と、を含む液状樹脂組成物であって、
前記液状エポキシ樹脂における前記第1エポキシ樹脂の割合は30質量%以上、70質量%以下であり、
前記セラミック充填剤の平均粒径は50μm以下で、前記液状樹脂組成物における前記セラミック充填剤の割合は50質量%以上、90質量%以下であり、
25℃における粘度が100Pa・s以下であり、
前記液状硬化剤は酸無水物と芳香族アミンとを含まず、
前記液状樹脂組成物の硬化物の熱膨張係数は11ppm/K以上、28ppm/K以下であり、
前記液状樹脂組成物の硬化物の25℃におけるショアD硬度は40以上である、
液状樹脂組成物。 - エポキシ系希釈剤と有機溶剤との少なくともいずれかである粘度調整材をさらに含む、
請求項1に記載の液状樹脂組成物。 - 前記液状樹脂組成物における前記粘度調整材の割合は0質量%を超え、10質量%以下である、
請求項2に記載の液状樹脂組成物。 - 前記第1エポキシ樹脂の分子量は、500以上、1000以下である、
請求項1に記載の液状樹脂組成物。 - 前記硬化促進剤はイミダゾール化合物を含む、
請求項1に記載の液状樹脂組成物。 - ウレタン樹脂またはシリコーン樹脂の少なくともいずれかを、0.5質量%以上、40質量%以下含む、
請求項1に記載の液状樹脂組成物。 - 請求項1に記載の液状樹脂組成物の硬化物であって、
ガラス転移温度が50℃以上、120℃以下であり、25℃における弾性率が20GPa以下である、
硬化物。 - 請求項1に記載の液状樹脂組成物の硬化物と、
前記硬化物と一部が密着している、または前記硬化物に一部が埋設されている金属配線と、を備え、
前記硬化物のガラス転移温度が50℃以上、120℃以下であり、前記硬化物の25℃における弾性率が20GPa以下であり、
厚み0.2mm以下のコアレスインターポーザーである、
配線構造体。 - 請求項1に記載の液状樹脂組成物の硬化物と、
前記硬化物と一部が密着している、または前記硬化物に一部が埋設されている金属配線と、を有する厚み0.2mm以下のコアレスインターポーザーである配線構造体と、
前記配線構造体に実装された半導体と、を備え、
前記硬化物のガラス転移温度が50℃以上、120℃以下であり、前記硬化物の25℃における弾性率が20GPa以下である、
実装体。
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Application Number | Priority Date | Filing Date | Title |
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JP2014061327 | 2014-03-25 | ||
JP2014061327 | 2014-03-25 | ||
PCT/JP2015/001658 WO2015146149A1 (ja) | 2014-03-25 | 2015-03-24 | 液状樹脂組成物、硬化物、配線構造体及びこの配線構造体を用いた実装体 |
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JPWO2015146149A1 JPWO2015146149A1 (ja) | 2017-04-13 |
JP6620314B2 true JP6620314B2 (ja) | 2019-12-18 |
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US (1) | US9624369B2 (ja) |
JP (1) | JP6620314B2 (ja) |
KR (1) | KR101842822B1 (ja) |
CN (1) | CN106133054B (ja) |
WO (1) | WO2015146149A1 (ja) |
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JP6793517B2 (ja) | 2016-10-17 | 2020-12-02 | 株式会社ダイセル | シート状プリプレグ |
US11292871B2 (en) | 2017-06-09 | 2022-04-05 | Hexion Inc. | Epoxy resin systems for composites |
JP7426587B2 (ja) * | 2017-09-04 | 2024-02-02 | パナソニックIpマネジメント株式会社 | 伸縮性回路基板、及び、それを用いたパッチデバイス |
JP6658790B2 (ja) * | 2018-04-19 | 2020-03-04 | 大日本印刷株式会社 | 蒸着マスク、フレーム付き蒸着マスク、蒸着マスク準備体、蒸着マスクの製造方法、有機半導体素子の製造方法、有機elディスプレイの製造方法、及びパターンの形成方法 |
WO2020100345A1 (ja) * | 2018-11-14 | 2020-05-22 | ナガセケムテックス株式会社 | 硬化性樹脂組成物および硬化性シート |
WO2022085522A1 (ja) * | 2020-10-21 | 2022-04-28 | パナソニックIpマネジメント株式会社 | 液状樹脂組成物及びその硬化物 |
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JPH01271422A (ja) | 1988-04-21 | 1989-10-30 | Mitsui Petrochem Ind Ltd | 制振材用組成物および制振材 |
JP2003292572A (ja) | 2002-04-08 | 2003-10-15 | Sumitomo Bakelite Co Ltd | 液状封止樹脂組成物及びそれを用いた半導体装置 |
JP3794349B2 (ja) * | 2002-06-25 | 2006-07-05 | 松下電工株式会社 | 封止用液状エポキシ樹脂組成物及び半導体装置 |
JP2006176678A (ja) * | 2004-12-22 | 2006-07-06 | Matsushita Electric Works Ltd | エポキシ樹脂組成物及び電子部品 |
JP2006232950A (ja) * | 2005-02-23 | 2006-09-07 | Matsushita Electric Works Ltd | 封止用液状エポキシ樹脂組成物、半導体装置及びその製造方法 |
KR20080030581A (ko) * | 2005-05-31 | 2008-04-04 | 스미토모 베이클리트 컴퍼니 리미티드 | 프리어플리케이션용 봉지 수지 조성물, 이를 이용한반도체장치 및 그 제조방법 |
EP1741734A1 (de) * | 2005-07-05 | 2007-01-10 | Sika Technology AG | Tieftemperaturschlagzähe hitze-härtbare Epoxidharzzusammensetzung mit Epoxidfestharzen |
JP5270833B2 (ja) * | 2006-12-20 | 2013-08-21 | パナソニック株式会社 | 液状樹脂組成物、半導体装置及びその製造方法 |
JP2009097013A (ja) | 2007-09-27 | 2009-05-07 | Hitachi Chem Co Ltd | 封止用液状樹脂組成物、電子部品装置及びウエハーレベルチップサイズパッケージ |
WO2010098066A1 (ja) | 2009-02-25 | 2010-09-02 | パナソニック株式会社 | 熱伝導性組成物とこれを用いた放熱板、放熱基板、回路モジュール、熱伝導性組成物の製造方法 |
JP2010229266A (ja) | 2009-03-26 | 2010-10-14 | Panasonic Electric Works Co Ltd | 封止用液状エポキシ樹脂組成物および電子部品 |
JP5552788B2 (ja) | 2009-10-05 | 2014-07-16 | 日立化成株式会社 | エポキシ樹脂組成物、半導体封止充てん用樹脂組成物及び半導体装置 |
JP2012036320A (ja) * | 2010-08-10 | 2012-02-23 | Daicel Corp | 硬化性樹脂組成物及びその硬化物 |
JP5799694B2 (ja) * | 2011-09-12 | 2015-10-28 | 日立化成株式会社 | 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置 |
JP6135991B2 (ja) * | 2012-10-11 | 2017-05-31 | パナソニックIpマネジメント株式会社 | 封止用エポキシ樹脂無機複合シート |
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- 2015-03-24 WO PCT/JP2015/001658 patent/WO2015146149A1/ja active Application Filing
- 2015-03-24 US US15/120,768 patent/US9624369B2/en active Active
- 2015-03-24 CN CN201580015637.0A patent/CN106133054B/zh active Active
- 2015-03-24 KR KR1020167025766A patent/KR101842822B1/ko active IP Right Grant
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Publication number | Publication date |
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WO2015146149A1 (ja) | 2015-10-01 |
US20160362546A1 (en) | 2016-12-15 |
JPWO2015146149A1 (ja) | 2017-04-13 |
CN106133054B (zh) | 2017-07-28 |
CN106133054A (zh) | 2016-11-16 |
KR20160124838A (ko) | 2016-10-28 |
US9624369B2 (en) | 2017-04-18 |
KR101842822B1 (ko) | 2018-03-27 |
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