JP6600318B2 - ウェルレジスタ及びポリシリコンレジスタ - Google Patents

ウェルレジスタ及びポリシリコンレジスタ Download PDF

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JP6600318B2
JP6600318B2 JP2016569994A JP2016569994A JP6600318B2 JP 6600318 B2 JP6600318 B2 JP 6600318B2 JP 2016569994 A JP2016569994 A JP 2016569994A JP 2016569994 A JP2016569994 A JP 2016569994A JP 6600318 B2 JP6600318 B2 JP 6600318B2
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integrated circuit
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polysilicon
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JP2017517154A5 (https=
JP2017517154A (ja
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キース ハインリッヒ バルナ ステファン
ピー バーレット ダグラス
ジェイ ツァオ アルウィン
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日本テキサス・インスツルメンツ合同会社
テキサス インスツルメンツ インコーポレイテッド
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/40—Resistors
    • H10D1/47—Resistors having no potential barriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/01—Manufacture or treatment
    • H10D1/025—Manufacture or treatment of resistors having potential barriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/40—Resistors
    • H10D1/43—Resistors having PN junctions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/113—Isolations within a component, i.e. internal isolations
    • H10D62/115—Dielectric isolations, e.g. air gaps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/0123—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
    • H10D84/0126—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
    • H10D84/013—Manufacturing their source or drain regions, e.g. silicided source or drain regions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/02—Manufacture or treatment characterised by using material-based technologies
    • H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
    • H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/201—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits
    • H10D84/204—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors
    • H10D84/209—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors of only resistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P30/00—Ion implantation into wafers, substrates or parts of devices
    • H10P30/20—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping
    • H10P30/202—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping characterised by the semiconductor materials
    • H10P30/204—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping characterised by the semiconductor materials into Group IV semiconductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P30/00—Ion implantation into wafers, substrates or parts of devices
    • H10P30/20—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping
    • H10P30/21—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping of electrically active species
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P30/00—Ion implantation into wafers, substrates or parts of devices
    • H10P30/20—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping
    • H10P30/28—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping characterised by an annealing step, e.g. for activation of dopants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/90—Thermal treatments, e.g. annealing or sintering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/01—Manufacture or treatment
    • H10W10/011—Manufacture or treatment of isolation regions comprising dielectric materials
    • H10W10/014—Manufacture or treatment of isolation regions comprising dielectric materials using trench refilling with dielectric materials, e.g. shallow trench isolations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/10—Isolation regions comprising dielectric materials
    • H10W10/17—Isolation regions comprising dielectric materials formed using trench refilling with dielectric materials, e.g. shallow trench isolations

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Element Separation (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
JP2016569994A 2014-05-27 2015-05-27 ウェルレジスタ及びポリシリコンレジスタ Active JP6600318B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/287,434 2014-05-27
US14/287,434 US9202859B1 (en) 2014-05-27 2014-05-27 Well resistors and polysilicon resistors
PCT/US2015/032690 WO2015183964A1 (en) 2014-05-27 2015-05-27 Well resistors and polysilicon resistors

Publications (3)

Publication Number Publication Date
JP2017517154A JP2017517154A (ja) 2017-06-22
JP2017517154A5 JP2017517154A5 (https=) 2018-06-21
JP6600318B2 true JP6600318B2 (ja) 2019-10-30

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Family Applications (1)

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JP2016569994A Active JP6600318B2 (ja) 2014-05-27 2015-05-27 ウェルレジスタ及びポリシリコンレジスタ

Country Status (4)

Country Link
US (2) US9202859B1 (https=)
JP (1) JP6600318B2 (https=)
CN (1) CN106463505B (https=)
WO (1) WO2015183964A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9202859B1 (en) * 2014-05-27 2015-12-01 Texas Instruments Incorporated Well resistors and polysilicon resistors
JP2016040814A (ja) * 2014-08-13 2016-03-24 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
US10879106B2 (en) * 2018-02-21 2020-12-29 Texas Instruments Incorporated Apparatus with overlapping deep trench and shallow trench and method of fabricating the same with low defect density
CN110265294B (zh) * 2019-06-17 2021-06-15 武汉新芯集成电路制造有限公司 一种提高浮栅厚度均匀性的方法及一种半导体结构
US10985244B2 (en) * 2019-06-25 2021-04-20 Globalfoundries U.S. Inc. N-well resistor
US11637173B2 (en) * 2020-09-29 2023-04-25 Globalfoundries U.S. Inc. Structure including polycrystalline resistor with dopant-including polycrystalline region thereunder
CN114823842B (zh) * 2021-01-21 2025-12-05 中芯北方集成电路制造(北京)有限公司 半导体结构及其形成方法
US12513918B2 (en) * 2021-08-03 2025-12-30 Mediatek Inc. Semiconductor device with improved matching characteristics of polysilicon resistive structures

Family Cites Families (20)

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JPS57100755A (en) * 1980-12-15 1982-06-23 Fujitsu Ltd Semiconductor device
US6103592A (en) * 1997-05-01 2000-08-15 International Business Machines Corp. Manufacturing self-aligned polysilicon fet devices isolated with maskless shallow trench isolation and gate conductor fill technology with active devices and dummy doped regions formed in mesas
US6555476B1 (en) * 1997-12-23 2003-04-29 Texas Instruments Incorporated Silicon carbide as a stop layer in chemical mechanical polishing for isolation dielectric
US6121078A (en) * 1998-09-17 2000-09-19 International Business Machines Corporation Integrated circuit planarization and fill biasing design method
US6528389B1 (en) * 1998-12-17 2003-03-04 Lsi Logic Corporation Substrate planarization with a chemical mechanical polishing stop layer
US6444581B1 (en) * 1999-07-15 2002-09-03 International Business Machines Corporation AB etch endpoint by ABFILL compensation
JP2002158278A (ja) * 2000-11-20 2002-05-31 Hitachi Ltd 半導体装置およびその製造方法ならびに設計方法
US7172948B2 (en) * 2004-01-20 2007-02-06 Taiwan Semiconductor Manufacturing Co., Ltd. Method to avoid a laser marked area step height
US7304354B2 (en) * 2004-02-17 2007-12-04 Silicon Space Technology Corp. Buried guard ring and radiation hardened isolation structures and fabrication methods
JP4744103B2 (ja) * 2004-06-28 2011-08-10 富士通セミコンダクター株式会社 抵抗素子を含む半導体装置及びその製造方法
US7141831B1 (en) * 2004-07-28 2006-11-28 National Semiconductor Corporation Snapback clamp having low triggering voltage for ESD protection
JP4811988B2 (ja) * 2005-03-23 2011-11-09 セイコーインスツル株式会社 半導体装置
US7403094B2 (en) * 2005-04-11 2008-07-22 Texas Instruments Incorporated Thin film resistor and dummy fill structure and method to improve stability and reduce self-heating
US7449354B2 (en) * 2006-01-05 2008-11-11 Fairchild Semiconductor Corporation Trench-gated FET for power device with active gate trenches and gate runner trench utilizing one-mask etch
JP2008226935A (ja) * 2007-03-09 2008-09-25 Fujitsu Ltd 半導体装置の製造方法
US20090047870A1 (en) * 2007-08-16 2009-02-19 Dupont Air Products Nanomaterials Llc Reverse Shallow Trench Isolation Process
US8618610B2 (en) * 2009-12-31 2013-12-31 Taiwan Semiconductor Manufacturing Company, Ltd. Dummy pattern design for thermal annealing
US8536072B2 (en) * 2012-02-07 2013-09-17 United Microelectronics Corp. Semiconductor process
US9953975B2 (en) * 2013-07-19 2018-04-24 Taiwan Semiconductor Manufacturing Company, Ltd. Methods for forming STI regions in integrated circuits
US9202859B1 (en) * 2014-05-27 2015-12-01 Texas Instruments Incorporated Well resistors and polysilicon resistors

Also Published As

Publication number Publication date
US20150349046A1 (en) 2015-12-03
US9202859B1 (en) 2015-12-01
US9379176B2 (en) 2016-06-28
JP2017517154A (ja) 2017-06-22
CN106463505A (zh) 2017-02-22
US20160056227A1 (en) 2016-02-25
WO2015183964A1 (en) 2015-12-03
CN106463505B (zh) 2020-05-08

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