JP6595548B2 - 電解銅箔、電解銅箔の製造方法、電池の集電体、及び回路基板 - Google Patents
電解銅箔、電解銅箔の製造方法、電池の集電体、及び回路基板 Download PDFInfo
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- JP6595548B2 JP6595548B2 JP2017173747A JP2017173747A JP6595548B2 JP 6595548 B2 JP6595548 B2 JP 6595548B2 JP 2017173747 A JP2017173747 A JP 2017173747A JP 2017173747 A JP2017173747 A JP 2017173747A JP 6595548 B2 JP6595548 B2 JP 6595548B2
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- copper foil
- electrolytic
- electrolytic copper
- electrolytic solution
- treatment
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 250
- 239000011889 copper foil Substances 0.000 title claims description 231
- 238000004519 manufacturing process Methods 0.000 title claims description 28
- 239000008151 electrolyte solution Substances 0.000 claims description 75
- 239000013078 crystal Substances 0.000 claims description 54
- 238000010438 heat treatment Methods 0.000 claims description 34
- 239000010949 copper Substances 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 21
- 229910052802 copper Inorganic materials 0.000 claims description 19
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 16
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 12
- 229910001431 copper ion Inorganic materials 0.000 claims description 12
- 238000005868 electrolysis reaction Methods 0.000 claims description 10
- 239000000460 chlorine Substances 0.000 claims description 8
- -1 chlorine ions Chemical class 0.000 claims description 8
- 102000004169 proteins and genes Human genes 0.000 claims description 7
- 108090000623 proteins and genes Proteins 0.000 claims description 7
- 238000004381 surface treatment Methods 0.000 claims description 7
- 229910052801 chlorine Inorganic materials 0.000 claims description 6
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 4
- 230000008878 coupling Effects 0.000 claims description 4
- 238000010168 coupling process Methods 0.000 claims description 4
- 238000005859 coupling reaction Methods 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 4
- 229910000077 silane Inorganic materials 0.000 claims description 4
- 150000004676 glycans Chemical class 0.000 claims description 3
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims description 3
- 229920001282 polysaccharide Polymers 0.000 claims description 3
- 239000005017 polysaccharide Substances 0.000 claims description 3
- 230000002265 prevention Effects 0.000 claims description 3
- 238000007788 roughening Methods 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 2
- 239000000654 additive Substances 0.000 description 28
- 230000000996 additive effect Effects 0.000 description 20
- 239000003792 electrolyte Substances 0.000 description 11
- 230000003746 surface roughness Effects 0.000 description 11
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 9
- 238000002441 X-ray diffraction Methods 0.000 description 6
- 239000011888 foil Substances 0.000 description 5
- 239000007788 liquid Substances 0.000 description 4
- 238000001228 spectrum Methods 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 230000002596 correlated effect Effects 0.000 description 3
- 230000000875 corresponding effect Effects 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- OBDVFOBWBHMJDG-UHFFFAOYSA-M 3-sulfanylpropane-1-sulfonate Chemical compound [O-]S(=O)(=O)CCCS OBDVFOBWBHMJDG-UHFFFAOYSA-M 0.000 description 1
- 241000283690 Bos taurus Species 0.000 description 1
- LEVWYRKDKASIDU-IMJSIDKUSA-N L-cystine Chemical compound [O-]C(=O)[C@@H]([NH3+])CSSC[C@H]([NH3+])C([O-])=O LEVWYRKDKASIDU-IMJSIDKUSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000006259 organic additive Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000001878 scanning electron micrograph Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- FRTIVUOKBXDGPD-UHFFFAOYSA-M sodium;3-sulfanylpropane-1-sulfonate Chemical compound [Na+].[O-]S(=O)(=O)CCCS FRTIVUOKBXDGPD-UHFFFAOYSA-M 0.000 description 1
- NPAWNPCNZAPTKA-UHFFFAOYSA-M sodium;propane-1-sulfonate Chemical compound [Na+].CCCS([O-])(=O)=O NPAWNPCNZAPTKA-UHFFFAOYSA-M 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Electrochemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mechanical Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrolytic Production Of Metals (AREA)
Description
10 電解槽
11 陽極板
12 陰極ドラム
13 ローラ
14 給液配管
L1 電解液
2 電源供給装置
3、3’ 電解銅箔
30 銅箔層
3a 第1の側
3b 第2の側
300 粗構造
31 銅ノジュール層
T、T’ 厚み
4 電気部品
40 基材
41 回路層
S100〜S400 プロセス工程
Claims (7)
- 70g/Lの銅イオン、105g/Lの硫酸及び濃度が1.0ppmより小さい塩素イオンを含む電解液を入れるための電解槽と、前記電解槽に対応して設けられる陰極ドラムと、前記電解槽内に設けられる陽極板とを含む電解装置を提供する工程と、
前記陽極板及び前記陰極ドラムを介して前記電解液に電流を印加する工程と、
銅箔層と、前記銅箔層の一側に位置すると共に前記銅箔層の表面に形成された複数の粒状突起である粗構造とを含む電解銅箔を形成する工程と
を含み、
前記電解液は、膠、タンパク質又は高分子多糖類を含んでいないことを特徴とする電解銅箔の製造方法。 - 前記電解液に電流を印加する工程において、前記電解液の温度を65℃に維持することを更に含むことを特徴とする請求項1に記載の電解銅箔の製造方法。
- 前記電解液に電流を印加する工程において、前記電解液の温度を40℃に維持することを更に含むことを特徴とする請求項1に記載の電解銅箔の製造方法。
- 前記陽極板及び前記陰極ドラムを介して前記電解液に電流を印加する工程後に、粗化処理、防錆処理及びシランカップリング処理のうちの少なくとも1つを含む表面処理を実行することを更に含み、
前記電解銅箔は、前記銅箔層上に位置すると共に厚みが0.1〜3μmである銅ノジュール層を更に含む
ことを特徴とする請求項1〜請求項3のいずれか1項に記載の電解銅箔の製造方法。 - 前記銅箔層の初期結晶は180℃より低い再成長温度を有し、
前記初期結晶の寸法を0.1〜10μmとする場合、前記電解銅箔が熱処理を通じて生じた伸び率差は、前記銅箔層の初期結晶の寸法と負の相関関係があり、
前記熱処理の温度は前記再成長温度より大きい
ことを特徴とする請求項1〜請求項4のいずれか1項に記載の電解銅箔の製造方法。 - 前記熱処理の温度は125℃〜180℃であることを特徴とする請求項5に記載の電解銅箔の製造方法。
- 粗化処理、防錆処理、及びシランカップリング処理からなる群より選ばれる少なくとも1種の表面処理工程を更に含むことを特徴とする請求項1〜請求項6のいずれか1項に記載の電解銅箔の製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW106106453 | 2017-02-24 | ||
TW106106453A TWI619850B (zh) | 2017-02-24 | 2017-02-24 | 電解液、電解銅箔及其製造方法 |
Publications (2)
Publication Number | Publication Date |
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JP2018141230A JP2018141230A (ja) | 2018-09-13 |
JP6595548B2 true JP6595548B2 (ja) | 2019-10-23 |
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JP2017173747A Active JP6595548B2 (ja) | 2017-02-24 | 2017-09-11 | 電解銅箔、電解銅箔の製造方法、電池の集電体、及び回路基板 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6595548B2 (ja) |
CN (1) | CN108505076B (ja) |
TW (1) | TWI619850B (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10581081B1 (en) | 2019-02-01 | 2020-03-03 | Chang Chun Petrochemical Co., Ltd. | Copper foil for negative electrode current collector of lithium ion secondary battery |
CN109881221A (zh) * | 2019-03-04 | 2019-06-14 | 深圳市汇美新科技有限公司 | 一种高断裂延伸率的超薄薄膜电镀工艺 |
TWI731330B (zh) * | 2019-04-30 | 2021-06-21 | 南亞塑膠工業股份有限公司 | 電解銅箔、其製造方法、及鋰離子二次電池 |
CN110894616B (zh) * | 2019-12-30 | 2021-04-20 | 中国科学院青海盐湖研究所 | 一种高密度铜箔及其制备方法 |
CN113444990A (zh) * | 2021-06-02 | 2021-09-28 | 清远市进田企业有限公司 | 一种电解铜重结晶热处理工艺 |
CN114481233A (zh) * | 2021-11-29 | 2022-05-13 | 龙岩学院 | 一种制备极薄电解铜箔的生箔装置及其应用 |
CN115198319B (zh) * | 2021-12-15 | 2023-11-17 | 长春石油化学股份有限公司 | 电解铜箔及包含所述电解铜箔的电极与锂离子电池 |
KR102435606B1 (ko) * | 2021-12-15 | 2022-08-23 | 장 춘 페트로케미컬 컴퍼니 리미티드 | 전해 동박, 이를 포함하는 전극 및 리튬-이온 전지 |
CN114318429B (zh) * | 2021-12-29 | 2024-07-26 | 浙江花园新能源股份有限公司 | 一种超低轮廓电解铜箔的纳米粗化电解液、方法及产品 |
CN117051447A (zh) * | 2023-08-24 | 2023-11-14 | 江西铜博科技股份有限公司 | 电解铜箔的制备方法、电解铜箔及锂离子电池负极材料 |
Family Cites Families (10)
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US5431803A (en) * | 1990-05-30 | 1995-07-11 | Gould Electronics Inc. | Electrodeposited copper foil and process for making same |
JP3608840B2 (ja) * | 1995-04-07 | 2005-01-12 | 古河サーキットフォイル株式会社 | フレキシブル配線板用電解銅箔 |
JPH08296082A (ja) * | 1995-04-21 | 1996-11-12 | Nikko Gould Foil Kk | 印刷回路用銅箔の製造方法 |
US6132887A (en) * | 1995-06-16 | 2000-10-17 | Gould Electronics Inc. | High fatigue ductility electrodeposited copper foil |
TW432124B (en) * | 1996-05-13 | 2001-05-01 | Mitsui Mining & Amp Smelting C | Electrolytic copper foil with high post heat tensile strength and its manufacturing method |
CN1250775C (zh) * | 2002-12-27 | 2006-04-12 | 财团法人工业技术研究院 | 具耐折性的电解铜箔的制造方法 |
JP4583149B2 (ja) * | 2004-12-01 | 2010-11-17 | 三井金属鉱業株式会社 | 電解銅箔及びその製造方法 |
KR101385761B1 (ko) * | 2010-07-01 | 2014-04-17 | 미쓰이금속광업주식회사 | 전해 동박 및 그 제조 방법 |
CN102711393B (zh) * | 2011-03-28 | 2015-01-14 | 南亚塑胶工业股份有限公司 | 一种印刷电路基板用表面细晶粒铜箔的制造方法 |
JP2013095972A (ja) * | 2011-11-02 | 2013-05-20 | Furukawa Electric Co Ltd:The | 電解銅箔、該電解銅箔を使用した配線板及び電池 |
-
2017
- 2017-02-24 TW TW106106453A patent/TWI619850B/zh active
- 2017-03-17 CN CN201710161342.5A patent/CN108505076B/zh active Active
- 2017-09-11 JP JP2017173747A patent/JP6595548B2/ja active Active
Also Published As
Publication number | Publication date |
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JP2018141230A (ja) | 2018-09-13 |
CN108505076B (zh) | 2020-04-28 |
TWI619850B (zh) | 2018-04-01 |
CN108505076A (zh) | 2018-09-07 |
TW201831732A (zh) | 2018-09-01 |
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