JP6591916B2 - マスク製造装置 - Google Patents

マスク製造装置 Download PDF

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Publication number
JP6591916B2
JP6591916B2 JP2016043423A JP2016043423A JP6591916B2 JP 6591916 B2 JP6591916 B2 JP 6591916B2 JP 2016043423 A JP2016043423 A JP 2016043423A JP 2016043423 A JP2016043423 A JP 2016043423A JP 6591916 B2 JP6591916 B2 JP 6591916B2
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JP
Japan
Prior art keywords
mask
unit
air
plate
rail
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2016043423A
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English (en)
Japanese (ja)
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JP2017162871A (ja
Inventor
米澤 良
米澤  良
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V Technology Co Ltd
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V Technology Co Ltd
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Publication date
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Priority to JP2016043423A priority Critical patent/JP6591916B2/ja
Priority to PCT/JP2017/007689 priority patent/WO2017154659A1/ja
Priority to TW106106615A priority patent/TWI709823B/zh
Publication of JP2017162871A publication Critical patent/JP2017162871A/ja
Application granted granted Critical
Publication of JP6591916B2 publication Critical patent/JP6591916B2/ja
Expired - Fee Related legal-status Critical Current
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2016043423A 2016-03-07 2016-03-07 マスク製造装置 Expired - Fee Related JP6591916B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2016043423A JP6591916B2 (ja) 2016-03-07 2016-03-07 マスク製造装置
PCT/JP2017/007689 WO2017154659A1 (ja) 2016-03-07 2017-02-28 マスク製造装置
TW106106615A TWI709823B (zh) 2016-03-07 2017-03-01 罩幕製造裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016043423A JP6591916B2 (ja) 2016-03-07 2016-03-07 マスク製造装置

Publications (2)

Publication Number Publication Date
JP2017162871A JP2017162871A (ja) 2017-09-14
JP6591916B2 true JP6591916B2 (ja) 2019-10-16

Family

ID=59790231

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016043423A Expired - Fee Related JP6591916B2 (ja) 2016-03-07 2016-03-07 マスク製造装置

Country Status (3)

Country Link
JP (1) JP6591916B2 (zh)
TW (1) TWI709823B (zh)
WO (1) WO2017154659A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023001459A1 (en) * 2021-07-21 2023-01-26 Asml Netherlands B.V. Systems and methods for thermally stable mounting of optical columns

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7017239B2 (ja) * 2018-06-25 2022-02-08 株式会社ブイ・テクノロジー 露光装置および高さ調整方法
JP7157587B2 (ja) * 2018-08-08 2022-10-20 キヤノン株式会社 保持装置、リソグラフィ装置及び物品の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5839361Y2 (ja) * 1978-08-30 1983-09-05 富士通株式会社 マスクパタ−ンの位置測定治具
JP3454743B2 (ja) * 1999-03-02 2003-10-06 シャープ株式会社 フォトマスク、tft基板の製造方法および表示装置の製造方法。
JP4080401B2 (ja) * 2003-09-05 2008-04-23 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP5506207B2 (ja) * 2009-02-24 2014-05-28 キヤノン株式会社 ステージ装置、露光装置及びデバイス製造方法
US8988655B2 (en) * 2010-09-07 2015-03-24 Nikon Corporation Exposure apparatus, movable body apparatus, flat-panel display manufacturing method, and device manufacturing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023001459A1 (en) * 2021-07-21 2023-01-26 Asml Netherlands B.V. Systems and methods for thermally stable mounting of optical columns

Also Published As

Publication number Publication date
JP2017162871A (ja) 2017-09-14
WO2017154659A1 (ja) 2017-09-14
TWI709823B (zh) 2020-11-11
TW201800865A (zh) 2018-01-01

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