JP6584286B2 - ヒータユニット - Google Patents

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Publication number
JP6584286B2
JP6584286B2 JP2015209886A JP2015209886A JP6584286B2 JP 6584286 B2 JP6584286 B2 JP 6584286B2 JP 2015209886 A JP2015209886 A JP 2015209886A JP 2015209886 A JP2015209886 A JP 2015209886A JP 6584286 B2 JP6584286 B2 JP 6584286B2
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JP
Japan
Prior art keywords
heater unit
groove
heater
lid
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015209886A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017084523A (ja
JP2017084523A5 (enExample
Inventor
年彦 花待
年彦 花待
尚哉 相川
尚哉 相川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NHK Spring Co Ltd
Original Assignee
NHK Spring Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2015209886A priority Critical patent/JP6584286B2/ja
Application filed by NHK Spring Co Ltd filed Critical NHK Spring Co Ltd
Priority to KR1020187008003A priority patent/KR102093048B1/ko
Priority to CN201680059985.2A priority patent/CN108141917B/zh
Priority to PCT/JP2016/078575 priority patent/WO2017073230A1/ja
Priority to EP16859467.9A priority patent/EP3370477B1/en
Priority to TW105133771A priority patent/TWI629727B/zh
Publication of JP2017084523A publication Critical patent/JP2017084523A/ja
Priority to US15/948,473 priority patent/US10290529B2/en
Publication of JP2017084523A5 publication Critical patent/JP2017084523A5/ja
Application granted granted Critical
Publication of JP6584286B2 publication Critical patent/JP6584286B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065—Plasma etching; Reactive-ion etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/18—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor the conductor being embedded in an insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/28—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates
    • H05B3/74—Non-metallic plates, e.g. vitroceramic, ceramic or glassceramic hobs, also including power or control circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Plasma & Fusion (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Resistance Heating (AREA)
  • Drying Of Semiconductors (AREA)
  • Physical Vapour Deposition (AREA)
JP2015209886A 2015-10-26 2015-10-26 ヒータユニット Active JP6584286B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2015209886A JP6584286B2 (ja) 2015-10-26 2015-10-26 ヒータユニット
CN201680059985.2A CN108141917B (zh) 2015-10-26 2016-09-28 加热器单元
PCT/JP2016/078575 WO2017073230A1 (ja) 2015-10-26 2016-09-28 ヒータユニット
EP16859467.9A EP3370477B1 (en) 2015-10-26 2016-09-28 Heater unit
KR1020187008003A KR102093048B1 (ko) 2015-10-26 2016-09-28 히터 유닛
TW105133771A TWI629727B (zh) 2015-10-26 2016-10-19 加熱單元
US15/948,473 US10290529B2 (en) 2015-10-26 2018-04-09 Heater unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015209886A JP6584286B2 (ja) 2015-10-26 2015-10-26 ヒータユニット

Publications (3)

Publication Number Publication Date
JP2017084523A JP2017084523A (ja) 2017-05-18
JP2017084523A5 JP2017084523A5 (enExample) 2018-04-12
JP6584286B2 true JP6584286B2 (ja) 2019-10-02

Family

ID=58630349

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015209886A Active JP6584286B2 (ja) 2015-10-26 2015-10-26 ヒータユニット

Country Status (7)

Country Link
US (1) US10290529B2 (enExample)
EP (1) EP3370477B1 (enExample)
JP (1) JP6584286B2 (enExample)
KR (1) KR102093048B1 (enExample)
CN (1) CN108141917B (enExample)
TW (1) TWI629727B (enExample)
WO (1) WO2017073230A1 (enExample)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7133992B2 (ja) * 2018-06-07 2022-09-09 東京エレクトロン株式会社 基板載置台及び基板処理装置
KR20200023988A (ko) * 2018-08-27 2020-03-06 삼성전자주식회사 정전 척 및 상기 정전 척을 탑재한 웨이퍼 식각 장치
JP7594852B2 (ja) * 2018-10-11 2024-12-05 日本発條株式会社 ステージ、成膜装置、および膜加工装置
JP7199200B2 (ja) * 2018-11-01 2023-01-05 東京エレクトロン株式会社 基板載置台、基板処理装置及び基板処理方法
US11199562B2 (en) 2019-08-08 2021-12-14 Western Digital Technologies, Inc. Wafer testing system including a wafer-flattening multi-zone vacuum chuck and method for operating the same
WO2021039497A1 (ja) * 2019-08-29 2021-03-04 京セラ株式会社 基体構造体及び基体構造体を用いた対象物載置装置
JP7401279B2 (ja) * 2019-12-06 2023-12-19 株式会社アドバンテック 対象物を加熱及び冷却するためのステージ
CN115152322A (zh) * 2020-02-26 2022-10-04 日本碍子株式会社 陶瓷加热器及其制法
KR102677038B1 (ko) * 2020-05-22 2024-06-19 세메스 주식회사 정전 척과 그 제조 방법 및 기판 처리 장치
JP7613848B2 (ja) * 2020-06-23 2025-01-15 日本特殊陶業株式会社 保持装置
EP3982398A1 (en) * 2020-10-06 2022-04-13 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk Onderzoek TNO Controlled local heating of substrates
KR102635168B1 (ko) * 2021-04-26 2024-02-13 주식회사 이에스티 코팅 타입 고온 정전척
KR102843910B1 (ko) * 2021-05-04 2025-08-07 와틀로 일렉트릭 매뉴팩츄어링 컴파니 저항 히터가 설치된 금속 히터 조립체
JP7638152B2 (ja) * 2021-05-17 2025-03-03 日本特殊陶業株式会社 保持装置
KR102381360B1 (ko) * 2021-07-05 2022-04-01 한국세라믹기술원 균일한 온도분포를 갖는 히터
KR102888651B1 (ko) 2021-09-30 2025-11-19 세메스 주식회사 기판 처리 장치
JP7628979B2 (ja) * 2022-03-17 2025-02-12 日本碍子株式会社 高抵抗・高耐食セラミックス材料及びウエハ載置台
JP2023149343A (ja) * 2022-03-31 2023-10-13 日本特殊陶業株式会社 電極埋設部材、および基板保持部材
GB2621859A (en) * 2022-08-24 2024-02-28 Dyson Technology Ltd Heating element, heating system & manufacturing method
JP2024051933A (ja) * 2022-09-30 2024-04-11 日本発條株式会社 ステージ
JP2024051768A (ja) * 2022-09-30 2024-04-11 日本発條株式会社 ステージ
WO2024180642A1 (ja) * 2023-02-28 2024-09-06 株式会社日立ハイテク プラズマ処理装置およびプラズマ処理装置の試料台の製造方法

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JP2002184557A (ja) * 2000-12-12 2002-06-28 Ibiden Co Ltd 半導体製造・検査装置用ヒータ
JP4067858B2 (ja) * 2002-04-16 2008-03-26 東京エレクトロン株式会社 Ａｌｄ成膜装置およびａｌｄ成膜方法
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JP2007067036A (ja) * 2005-08-30 2007-03-15 Hitachi High-Technologies Corp 真空処理装置
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Also Published As

Publication number Publication date
EP3370477A4 (en) 2019-02-27
US20180226285A1 (en) 2018-08-09
US10290529B2 (en) 2019-05-14
KR20180044336A (ko) 2018-05-02
EP3370477A1 (en) 2018-09-05
CN108141917A (zh) 2018-06-08
TWI629727B (zh) 2018-07-11
EP3370477B1 (en) 2021-11-03
TW201715614A (zh) 2017-05-01
CN108141917B (zh) 2020-12-22
JP2017084523A (ja) 2017-05-18
KR102093048B1 (ko) 2020-03-24
WO2017073230A1 (ja) 2017-05-04

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