JP6583073B2 - 温度センサ - Google Patents
温度センサ Download PDFInfo
- Publication number
- JP6583073B2 JP6583073B2 JP2016052659A JP2016052659A JP6583073B2 JP 6583073 B2 JP6583073 B2 JP 6583073B2 JP 2016052659 A JP2016052659 A JP 2016052659A JP 2016052659 A JP2016052659 A JP 2016052659A JP 6583073 B2 JP6583073 B2 JP 6583073B2
- Authority
- JP
- Japan
- Prior art keywords
- pair
- insulating film
- connection
- lead frames
- sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 claims description 54
- 230000001681 protective effect Effects 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 6
- 239000010408 film Substances 0.000 description 75
- 229920001721 polyimide Polymers 0.000 description 7
- 239000010409 thin film Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 238000003466 welding Methods 0.000 description 5
- 238000005259 measurement Methods 0.000 description 4
- 238000000059 patterning Methods 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 229910004349 Ti-Al Inorganic materials 0.000 description 1
- 229910010037 TiAlN Inorganic materials 0.000 description 1
- 229910004692 Ti—Al Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910001120 nichrome Inorganic materials 0.000 description 1
- 238000005121 nitriding Methods 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000005546 reactive sputtering Methods 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- 238000005477 sputtering target Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
Images
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
- Thermistors And Varistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016052659A JP6583073B2 (ja) | 2016-03-16 | 2016-03-16 | 温度センサ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016052659A JP6583073B2 (ja) | 2016-03-16 | 2016-03-16 | 温度センサ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017166988A JP2017166988A (ja) | 2017-09-21 |
| JP2017166988A5 JP2017166988A5 (enExample) | 2018-01-18 |
| JP6583073B2 true JP6583073B2 (ja) | 2019-10-02 |
Family
ID=59913279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016052659A Active JP6583073B2 (ja) | 2016-03-16 | 2016-03-16 | 温度センサ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6583073B2 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6842600B2 (ja) * | 2018-08-10 | 2021-03-17 | Ｓｅｍｉｔｅｃ株式会社 | 温度センサ及び温度センサを備えた装置 |
| CN116295901A (zh) * | 2022-11-18 | 2023-06-23 | 广东万诺传感技术有限公司 | 一种接触式温度传感器 |
-
2016
- 2016-03-16 JP JP2016052659A patent/JP6583073B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2017166988A (ja) | 2017-09-21 |
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Legal Events
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|---|---|---|---|
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| A01 | Written decision to grant a patent or to grant a registration (utility model) |
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