JP6578408B2 - 干渉信号の能動抑制装置 - Google Patents
干渉信号の能動抑制装置 Download PDFInfo
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- JP6578408B2 JP6578408B2 JP2018089147A JP2018089147A JP6578408B2 JP 6578408 B2 JP6578408 B2 JP 6578408B2 JP 2018089147 A JP2018089147 A JP 2018089147A JP 2018089147 A JP2018089147 A JP 2018089147A JP 6578408 B2 JP6578408 B2 JP 6578408B2
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B15/00—Suppression or limitation of noise or interference
- H04B15/02—Reducing interference from electric apparatus by means located at or near the interfering apparatus
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0071—Active shielding
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/44—Circuits or arrangements for compensating for electromagnetic interference in converters or inverters
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B49/00—Arrangement or mounting of control or safety devices
- F25B49/02—Arrangement or mounting of control or safety devices for compression type machines, plants or systems
- F25B49/022—Compressor control arrangements
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/14—Arrangements for reducing ripples from dc input or output
- H02M1/15—Arrangements for reducing ripples from dc input or output using active elements
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
- H05K7/1402—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards
- H05K7/1407—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards by turn-bolt or screw member
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
- H05K7/1432—Housings specially adapted for power drive units or power converters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
- H05K7/1432—Housings specially adapted for power drive units or power converters
- H05K7/14322—Housings specially adapted for power drive units or power converters wherein the control and power circuits of a power converter are arranged within the same casing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20936—Liquid coolant with phase change
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0037—Housings with compartments containing a PCB, e.g. partitioning walls
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2600/00—Control issues
- F25B2600/02—Compressor control
- F25B2600/021—Inverters therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the PCB
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Inverter Devices (AREA)
- Compressor (AREA)
Description
(1)純粋な受動EMCフィルターに比べ、必要な設置空間が減少、
(2)重量減少、
(3)費用減少、
(4)インバータ基板/主基板に比べ、能動EMCフィルターの遮蔽によるフィルター効果の向上、
(5)冷却剤によってハウジングを介して能動EMCフィルター基板の部品を能動的に冷却することによる許容される出力密度の増加。
本願発明は、特に、電気及びハイブリッド車両内の電気冷媒圧縮機のインバータで発生する干渉信号除去分野と関連して利用される。
能動EMCフィルター(4)は第1機能ブロック内に干渉信号(8)を検出する検出器(5)を含み、そして第2機能ブロック内に、検出器(5)によって検出された干渉信号(8)に基づいて提供された出力信号の位相を約180゜変位させて反転させる位相変位器(6)を含む。続いて、第3機能ユニット内の出力増幅器(7)は位相変位器(6)によって位相変位された信号の振幅を適当に調整して、前記信号を補償信号(9)として自身の出力部(Amp_Out−及びAmp_Out+)に出力する。
2 インバータ/変換機
3 受動EMCフィルター
4 能動EMCフィルター
5 検出器(第1機能ユニット)
6 位相変位器(第2機能ユニット)
7 出力増幅器(第3機能ユニット)
8 干渉信号
9 補償信号
10 ハウジング
11 冷却剤
12 主基板
13 電力半導体(IGBT)
14 凹部
15 基板
16 ねじ
17 電気接続部
18 遮蔽カバー
19 熱伝導層
Claims (10)
- インバータ(2)の一つ以上の主基板(main board)(12)、能動EMCフィルター(active EMC−filter)(4)及び冷媒圧縮機のハウジング(10)を含み、ハウジング(10)に囲まれて冷却剤(11)が配置されており、主基板(12)がハウジング(10)の表面に配置されている、干渉信号(interference signal)を能動的に抑制するための装置(1)であって、
ハウジング(10)内で、ハウジング(10)の表面に配置された主基板(12)下に凹部(14)が配置され、凹部(14)内に能動EMCフィルター(4)の基板(15)が内蔵される方式で配置されることを特徴とする、干渉信号の能動抑制装置。 - 凹部(14)と向き合う、主基板(12)の面が伝導性材料からなった遮蔽カバー(18)を有し、遮蔽カバー(18)が凹部(14)を完全に覆うことを特徴とする、請求項1に記載の干渉信号の能動抑制装置。
- 能動EMCフィルター(4)の基板(15)が熱伝導層(19)を介して冷媒圧縮機のハウジング(10)と連結していることを特徴とする、請求項1又は2に記載の干渉信号の能動抑制装置。
- 基板(15)とハウジング(10)間に絶縁ペースト(insulation paste)、または熱伝導材料(TIM: thermal interface material)が配置されることを特徴とする、請求項1乃至3のいずれか1項に記載の干渉信号の能動抑制装置。
- 基板(15)を固定するために、ハウジング(10)の表面にねじ、クランプ、または熱伝導性接着剤(thermally conductive adhesive)が配置されることを特徴とする、請求項1乃至4のいずれか1項に記載の干渉信号の能動抑制装置。
- 基板(15)がアルミニウム支持体(aluminium support)を有する絶縁金属基板(IMS: insulated metal substrate)であることを特徴とする、請求項1乃至5のいずれか1項に記載の干渉信号の能動抑制装置。
- 凹部(14)と向き合う、主基板(12)の面が伝導性材料からなった遮蔽カバー(18)が銅、金、又はアルミニウムからなることを特徴とする、請求項1乃至6のいずれか1項に記載の干渉信号の能動抑制装置。
- 基板(15)の電気接続部(17)が主基板(12)を貫通する方式で配置されることを特徴とする、請求項1乃至7のいずれか1項に記載の干渉信号の能動抑制装置。
- 基板(15)上に配置された一つ、または複数の構成部品が基板(15)と接続された熱伝導性材料を介して、冷媒圧縮機のハウジング(10)と連結されることを特徴とする、請求項1乃至8のいずれか1項に記載の干渉信号の能動抑制装置。
- 主基板(12)上に、能動EMCフィルター(4)の入力側に直列連結する受動EMCフィルター(passive EMC−filter)(3)が配置されることを特徴とする、請求項1乃至9にいずれか1項に記載の干渉信号の能動抑制装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102017111396.7A DE102017111396B4 (de) | 2017-05-24 | 2017-05-24 | Anordnung zur aktiven Unterdrückung von Störsignalen |
DE102017111396.7 | 2017-05-24 |
Publications (2)
Publication Number | Publication Date |
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JP2018198523A JP2018198523A (ja) | 2018-12-13 |
JP6578408B2 true JP6578408B2 (ja) | 2019-09-18 |
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Application Number | Title | Priority Date | Filing Date |
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JP2018089147A Active JP6578408B2 (ja) | 2017-05-24 | 2018-05-07 | 干渉信号の能動抑制装置 |
Country Status (5)
Country | Link |
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US (1) | US10840801B2 (ja) |
JP (1) | JP6578408B2 (ja) |
KR (1) | KR101889729B1 (ja) |
CN (1) | CN108933633B (ja) |
DE (1) | DE102017111396B4 (ja) |
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DE102017117183A1 (de) * | 2017-07-28 | 2019-01-31 | Brusa Elektronik Ag | Entstörvorrichtung für einen Gleichstromkreis |
DE102018129415A1 (de) * | 2018-11-22 | 2020-05-28 | Dr. Ing. H.C. F. Porsche Aktiengesellschaft | Ladevorrichtung für ein Fahrzeug und Fahrzeug mit einer Ladevorrichtung |
KR102258199B1 (ko) * | 2019-03-28 | 2021-06-02 | 이엠코어텍 주식회사 | 독립 능동 emi 필터 모듈 및 그 제조방법 |
KR102326924B1 (ko) * | 2019-09-19 | 2021-11-17 | 이엠코어텍 주식회사 | 분리형 능동 emi 필터 모듈 및 그 제조방법 |
WO2020197334A1 (ko) * | 2019-03-28 | 2020-10-01 | 이엠코어텍 주식회사 | 분리형 능동 emi 필터 모듈 |
US11949393B2 (en) | 2019-03-28 | 2024-04-02 | Em Coretech Co., Ltd. | Divided active electromagnetic interference filter module and manufacturing method thereof |
DE112020007383T5 (de) * | 2020-07-03 | 2023-04-20 | Mitsubishi Electric Corporation | Stromrichtereinrichtung |
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DE102021102950A1 (de) | 2021-02-09 | 2022-08-11 | Avl Software And Functions Gmbh | Aktiver Filter im Halbleitermodul |
JPWO2023042253A1 (ja) * | 2021-09-14 | 2023-03-23 | ||
DE102022103093A1 (de) | 2022-02-10 | 2023-08-10 | Webasto SE | Anordnung zum Betreiben eines Elektromotors in einem Fahrzeug |
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2017
- 2017-05-24 DE DE102017111396.7A patent/DE102017111396B4/de active Active
- 2017-06-30 KR KR1020170083124A patent/KR101889729B1/ko active IP Right Grant
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2018
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US10840801B2 (en) | 2020-11-17 |
US20180342947A1 (en) | 2018-11-29 |
CN108933633B (zh) | 2020-09-04 |
DE102017111396A1 (de) | 2018-11-29 |
CN108933633A (zh) | 2018-12-04 |
JP2018198523A (ja) | 2018-12-13 |
KR101889729B1 (ko) | 2018-08-20 |
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