CN214281344U - 可堆叠emi滤波器 - Google Patents

可堆叠emi滤波器 Download PDF

Info

Publication number
CN214281344U
CN214281344U CN202021807330.9U CN202021807330U CN214281344U CN 214281344 U CN214281344 U CN 214281344U CN 202021807330 U CN202021807330 U CN 202021807330U CN 214281344 U CN214281344 U CN 214281344U
Authority
CN
China
Prior art keywords
additional
emi filter
line
stackable
power
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202021807330.9U
Other languages
English (en)
Inventor
A·阿马杜奇
E·马佐拉
J-P·格雷贝尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schaffner Electromagnetic Compatibility Shanghai Co Ltd
Original Assignee
Schaffner EMV AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schaffner EMV AG filed Critical Schaffner EMV AG
Priority to CN202021807330.9U priority Critical patent/CN214281344U/zh
Priority to ES202130714A priority patent/ES2897005B2/es
Priority to DE202021103955.8U priority patent/DE202021103955U1/de
Priority to ATGM8035/2022U priority patent/AT17874U1/de
Priority to ATA137/2021A priority patent/AT524151A3/de
Priority to FR2108831A priority patent/FR3113806A1/fr
Application granted granted Critical
Publication of CN214281344U publication Critical patent/CN214281344U/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00Details of apparatus for conversion
    • H02M1/44Circuits or arrangements for compensating for electromagnetic interference in converters or inverters
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02JCIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J3/00Circuit arrangements for ac mains or ac distribution networks
    • H02J3/01Arrangements for reducing harmonics or ripples
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00Details of apparatus for conversion
    • H02M1/12Arrangements for reducing harmonics from ac input or output
    • H02M1/126Arrangements for reducing harmonics from ac input or output using passive filters
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H1/00Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
    • H03H1/0007Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network of radio frequency interference filters
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/42Networks for transforming balanced signals into unbalanced signals and vice versa, e.g. baluns
    • H03H7/425Balance-balance networks
    • H03H7/427Common-mode filters
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/144Stacked arrangements of planar printed circuit boards
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/51Fixed connections for rigid printed circuits or like structures
    • H01R12/52Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/523Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures by an interconnection through aligned holes in the boards or multilayer board
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/51Fixed connections for rigid printed circuits or like structures
    • H01R12/55Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H01R12/585Terminals having a press fit or a compliant portion and a shank passing through a hole in the printed circuit board
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H1/00Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
    • H03H2001/0021Constructional details
    • H03H2001/0028RFI filters with housing divided in two bodies
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231Capacitors or dielectric substances
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0233Filters, inductors or a magnetic substance
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0234Resistors or by disposing resistive or lossy substances in or near power planes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/141One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04Assemblies of printed circuits
    • H05K2201/042Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04Assemblies of printed circuits
    • H05K2201/048Second PCB mounted on first PCB by inserting in window or holes of the first PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/1006Non-printed filter
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E40/00Technologies for an efficient electrical power generation, transmission or distribution
    • Y02E40/40Arrangements for reducing harmonics

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Filters And Equalizers (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Magnetically Actuated Valves (AREA)
  • Detergent Compositions (AREA)

Abstract

一种EMI滤波器,包括与可堆叠附加元件(120)可连接的主单元(115),所述主单元具有用于在功率源和电负载之间连接的连接器(51、52;53、54),通过所述功率源和所述电负载之间的所述连接器电可连接的功率导体(42、44),用于阻挡叠加在电源电压上的不希望的干扰信号的电感元件(L1‑L4);所述可堆叠附加元件包括印刷电路板(127)上的附加电路(20),所述印刷电路板(127)通过附加元件连接部件(32、34)永久电连接到所述功率导体(42、44),由此所述可堆叠附加元件被配置为堆叠在所述主单元上,由此所述印刷电路板在被堆叠时结合所述附加元件连接部件,而不中断所述功率导体(42、44)的电连续性。

Description

可堆叠EMI滤波器
技术领域
本发明涉及抗电磁干扰的滤波器(EMI滤波器)。EMI滤波器的概念与电磁兼容性滤波器(EMC滤波器)、线路滤波器、EMI/EMC扼流圈和低通滤波器重叠,并且为了本公开的目的,EMI滤波器是它们的同义词。
背景技术
EMI滤波器的大多数应用涉及无源模块,所述模块沿供电导体插在设备和其功率源之间,所述供电导体既可以传输直流(DC)电源电流,也可以传输具有电力(utility)频率低于400Hz(通常处于50/60Hz)的交流(AC)电源电流。
低通滤波器应用于(come in)几乎无限多种的电路,其中的许多适合于用作EMI滤波器。DC或单相AC EMI滤波器通常具有两个线路端子和两个负载端子,它们通过包括导体和电感元件的低电阻路径内部连接。滤波器还包括分流元件,其通常是电容性或电阻性质的,由此电源电流将在很小或没有改变的情况下通过滤波器,并且发生在较高频率的电磁干扰被强烈衰减。通常,线路和负载端子之间的路径由厚规格的导体或实心母线所确保,以将欧姆损耗减到最少。
多相AC EMI滤波器也存在,并且本发明也适用于它们。这些设备中的线路和负载端子的数量对应于相的数量,可选地加上一对中性导体。
尽管EMI滤波器的端口通常表示为“线路”和“负载”或“输入”和“输出”,但是许多滤波器实际上是双向的,并且双向上衰减干扰。EMI滤波器并不限于直接插在供电线路和负载之间,而是在更复杂的装置中(诸如在电机驱动单元中)也能找到它们的位置。
除了它们的电气和滤波特性,EMI滤波器还必须满足对于尺寸、散热性、耐热性、对振动的抗扰度和许多其他参数的规格。在汽车应用中,其中电子元件越来越普遍,这些规格尤其严苛。因此,尽管底层电路明显简单,但是EMI滤波器是复杂的产品,其很难针对所有可能的应用进行设计和定制。
发明内容
本发明提出了一种可堆叠的滤波器,所述滤波器可以通过将不同的附加元件(add-on)模块叠加到基础单元上来适应不同的应用。EMI滤波器包括与可堆叠附加元件(120)可连接的主单元(115),所述主单元具有用于在功率源和电负载之间连接的连接器(51、52;53、54),通过所述功率源和所述电负载之间的所述连接器电可连接的功率导体(42、44),用于阻挡叠加在电源电压上的不希望的干扰信号的电感元件(L1-L4);所述可堆叠附加元件包括印刷电路板(127)上的附加电路(20),所述印刷电路板(127)通过附加元件连接部件(32、34)永久电连接到所述功率导体(42、44),由此所述可堆叠附加元件被配置为堆叠在所述主单元上,由此所述印刷电路板在被堆叠时结合所述附加元件连接部件,而不中断所述功率导体(42、44)的电连续性。
可选地,根据本发明的一个实施例,所述功率导体是实心母线。
可选地,根据本发明的一个实施例,所述附加元件连接部件是导电柱,所述导电柱从与其电接触的所述母线升起。
可选地,根据本发明的一个实施例,所述附加元件连接部件与所述母线整体地构建,或者焊接到所述母线,或者熔接到所述母线,或者压配合紧固到所述母线,或者压在所述母线上。
可选地,根据本发明的一个实施例,所述附加电路(20)改善在确定频带中的衰减,或者抑制谐振,或者增加功能。
可选地,根据本发明的一个实施例,所述附加电路(20)包括在电源线路和接地之间的电容器,和/或线路间电容器,和/或阻尼电阻器,和/或RLC网络,和/或有源元件。
可选地,根据本发明的一个实施例,所述主单元是具有作为功率导体的一对母线的DC或单相AC单元,其包括与作为电感元件的功率母线磁耦合的磁芯,以及线路到接地电容器,所述线路到接地电容器用于分路不需要的干扰分量,并且所述可堆叠附加元件单元包括串联或并联的附加的线路到接地和线路到线路电容器以及阻尼电阻器。
可选地,根据本发明的一个实施例,所述主单元是安装在电缆上的滤波器,其配置为安装在负载侧上的或线路侧上的一对电缆导体上,其中柔性导体与所述EMI滤波器的磁芯磁耦合并插入所述磁芯中。
根据本发明,这些目的通过所附权利要求的客体来实现。
附图说明
在说明书中公开了本发明的示例性实施例,并通过附图来示出,在所述附图中:
图1a示意性地示出了EMI滤波器的电路。
图1b和1c示出了由于包括附加元件而具有不同于图1a的电特性的滤波器。
图2示出了本发明的可堆叠滤波器。
具体实施方式
图1a表示DC或单相EMI滤波器15。为了简洁起见,本公开将参考这种类型的设备,但应理解的是,本发明还包括多相滤波器。滤波器具有用于连接到电源线路的线路端子51、52,以及用于向未表示的负载提供经滤波的功率的负载端子53、54。线路和负载通过母线42、44或其他合适的功率导体连接,电感元件L1-L4插入在母线42、44中。
电容器C1,C2分路到接地不需要的干扰电流。它们连接在母线41、42和接地之间,或者在干扰发生的频率下连接在适当低阻抗的另一个节点上。
EMI滤波器15可以被包括在本发明的滤波器的基础单元中,如将在下文中公开的。
图1b示出了具有滤波器15的所有元件以及附加分路元件20的滤波器。分路元件包括母线和接地之间的两个附加分路元件:R2、C4(相应为R3、C5)以及由R1和C3组成的线路到线路分路器。
在呈现的示例中,附加元件各自通过串联的电容器和电阻器组成,以用于改善衰减和阻尼,但是这不是必需的,并且本发明不限于此。在其他未表示的变型中,附加元件20可以具有与电抗组件并联的阻尼电阻器,而不是如所示的串联的阻尼电阻器,或者简单地由连接在线路与线路之间的或线路与接地之间的、与主电路15中的电容器并联电连接的阻尼电阻器组成,或者简单地由线路与接地之间的或线路与线路之间的电容器组成。附加组件还可以包括任何拓扑的RLC网络和有源元件。
向滤波器15附加分路组件20改变了滤波器的传递函数和/或修改了其性能,可能改善了某些期望频带中的衰减,抑制了谐振,或者借助于有源元件增加了某些功能。
附加元件20可以被包括在根据本发明的可堆叠附加元件中,如将在后面解释的。
图1c示出了如何在不损害母线22、24的连续性的情况下将附加元件20添加到原始滤波器15中。附加元件20和原始滤波器15可以方便地保持在不同的水平,并且通过两个导电元件32、34确保连接,所述两个导电元件依靠母线42、44到附加电路20的合适节点。导体32、34在干扰发生的频率下应具有低阻抗,但是它们在DC或低频下不会被负载电流所穿过,并且它们不会对功率损耗产生明显的影响。原始电路15的和附加元件20的接地点之间的电连续性是暗示的。
图2示出了本发明的可堆叠滤波器,其具有基础元件15和可堆叠在主元件上的附加元件120,所述基础元件15包括用于线路和负载端子、母线、电感元件以及可能的分路元件的连接器,所述附加元件120具有包括安装在PCB 127上的附加电子元件(诸如例如上面所示的附加电路20)的电路。组件还包括两个导体元件132、134,所述两个导体元件132、134依赖于基础元件15的侧上的母线或连接器,并且与可堆叠附加元件的印刷电路板相接。用于接地的第三电连接可以通过使用专用导体或基础元件115的金属底盘来获得。在所呈现的示例中,接地连接器138被焊接在PCB 127的对应孔128中,并且被拧到主滤波器单元115的合适接地点。
接触元件134、132可以是母线结构的整体部分(来自于相同的铜部分),或者是熔接到母线、焊接到母线或者通过干扰和摩擦(压配合)紧固到母线的独立元件。接触元件也可以是压在母线上的独立部分。元件134、132和电路板127中的对应轨道之间的接触优选是焊接或压配合的。图2的示例在PCB 127中具有孔122、124,以用于接收和焊接接触元件134、132。
图2的主单元是用于汽车应用的电缆安装式EMI滤波器,其配置为与负载侧上的或线路侧上的一对柔性导体耦合。导体穿过磁芯137的中心孔,并被紧固到主单元115的螺钉端子(图中不可见)。主单元115具有穴139,以用于插入螺丝刀或其他合适的工具,并拧紧螺钉端子。同样,可堆叠附加元件120的PCB具有与主单元115的对应检查穴(accessaperture)139对齐的穴129,以允许螺丝刀插入。
图2中所示的可堆叠滤波器是高度集成且紧凑的设备,并且要对其进行重新设计以改变其性能非常困难。本发明通过将相同的基础单元与不同的可堆叠的附加元件相组合在相同的封装中或兼容的封装中提供了具有不同性能的滤波器的搭配。
此外,可堆叠附加元件120的附加以期望的方式改善了基础单元115的特性,而不影响母线设计、机械接口、连接器和磁芯设计。因此,本发明允许以较少的设计和工程努力来改善EMI滤波器性能,并提供定制的滤波器。
附图中的参考符号
15主电路
20附加电路
32导体
34导体
42母线
44母线
51线路端子
52线路端子
53负载端子
54负载端子
115主单元
120可堆叠附加元件
122 PCB孔
124 PCB孔
127印刷电路板
128 PCB孔
129螺丝刀检查穴
132导体、连接销
134导体、连接销
137磁芯
138接地导体
139螺丝刀检查穴

Claims (8)

1.一种EMI滤波器,其特征在于,包括与可堆叠附加元件(120)可连接的主单元(115),所述主单元具有用于在功率源和电负载之间连接的连接器(51、52;53、54),通过所述功率源和所述电负载之间的所述连接器电可连接的功率导体(42、44),用于阻挡叠加在电源电压上的不希望的干扰信号的电感元件(L1-L4);所述可堆叠附加元件包括印刷电路板(127)上的附加电路(20),所述印刷电路板(127)通过附加元件连接部件(32、34)永久电连接到所述功率导体(42、44),由此所述可堆叠附加元件被配置为堆叠在所述主单元上,由此所述印刷电路板在被堆叠时结合所述附加元件连接部件,而不中断所述功率导体(42、44)的电连续性。
2.根据权利要求1所述的EMI滤波器,其特征在于,所述功率导体是实心母线。
3.根据权利要求2所述的EMI滤波器,其特征在于,所述附加元件连接部件是导电柱,所述导电柱从与其电接触的所述母线升起。
4.根据权利要求3所述的EMI滤波器,其特征在于,所述附加元件连接部件与所述母线整体地构建,或者焊接到所述母线,或者熔接到所述母线,或者压配合紧固到所述母线,或者压在所述母线上。
5.根据权利要求1所述的EMI滤波器,其特征在于,所述附加电路(20)改善在确定频带中的衰减,或者抑制谐振,或者增加功能。
6.根据权利要求1所述的EMI滤波器,其特征在于,所述附加电路(20)包括在电源线路和接地之间的电容器,和/或线路间电容器,和/或阻尼电阻器,和/或RLC网络,和/或有源元件。
7.根据权利要求1所述的EMI滤波器,其特征在于,所述主单元是具有作为功率导体的一对母线的DC或单相AC单元,其包括与作为电感元件的功率母线磁耦合的磁芯,以及线路到接地电容器,所述线路到接地电容器用于分路不需要的干扰分量,并且所述可堆叠附加元件单元包括串联或并联的附加的线路到接地和线路到线路电容器以及阻尼电阻器。
8.根据权利要求7所述的EMI滤波器,其特征在于,所述主单元是安装在电缆上的滤波器,其配置为安装在负载侧上的或线路侧上的一对电缆导体上,其中柔性导体与所述EMI滤波器的磁芯磁耦合并插入所述磁芯中。
CN202021807330.9U 2020-08-26 2020-08-26 可堆叠emi滤波器 Active CN214281344U (zh)

Priority Applications (6)

Application Number Priority Date Filing Date Title
CN202021807330.9U CN214281344U (zh) 2020-08-26 2020-08-26 可堆叠emi滤波器
ES202130714A ES2897005B2 (es) 2020-08-26 2021-07-23 Filtro emi apilable
DE202021103955.8U DE202021103955U1 (de) 2020-08-26 2021-07-23 Stapelbares Entstörfilter
ATGM8035/2022U AT17874U1 (de) 2020-08-26 2021-08-12 Stapelbares Entstörfilter
ATA137/2021A AT524151A3 (de) 2020-08-26 2021-08-12 Stapelbares Entstörfilter
FR2108831A FR3113806A1 (fr) 2020-08-26 2021-08-23 Filtre EMI empilable

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202021807330.9U CN214281344U (zh) 2020-08-26 2020-08-26 可堆叠emi滤波器

Publications (1)

Publication Number Publication Date
CN214281344U true CN214281344U (zh) 2021-09-24

Family

ID=77389077

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202021807330.9U Active CN214281344U (zh) 2020-08-26 2020-08-26 可堆叠emi滤波器

Country Status (5)

Country Link
CN (1) CN214281344U (zh)
AT (2) AT17874U1 (zh)
DE (1) DE202021103955U1 (zh)
ES (1) ES2897005B2 (zh)
FR (1) FR3113806A1 (zh)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE20316051U1 (de) * 2003-10-20 2003-12-18 Schaffner Emv Ag EMV-Modul
DE212004000075U1 (de) * 2004-01-29 2006-08-24 Schaffner Emv Ag Klemmenfilter
DE102005013509C5 (de) * 2004-03-30 2024-08-29 Schaffner Emv Ag EMV Filter
JP2014120518A (ja) * 2012-12-13 2014-06-30 Nec Tokin Corp インダクタンス素子及びノイズフィルタ
CN107005147B (zh) * 2014-12-18 2020-09-04 瑞典爱立信有限公司 具有紧凑型emi滤波器的电源接口模块
DE102017100381A1 (de) * 2017-01-10 2018-07-12 Intica Systems Ag Filteranordnung
US10917992B2 (en) * 2017-01-13 2021-02-09 Cree Fayetteville, Inc. High power multilayer module having low inductance and fast switching for paralleling power devices
DE102017105839A1 (de) * 2017-03-17 2018-09-20 Schaffner Emv Ag Aktives Filter
DE102017111396B4 (de) * 2017-05-24 2020-08-06 Hanon Systems Anordnung zur aktiven Unterdrückung von Störsignalen
JP7185894B2 (ja) * 2018-06-26 2022-12-08 北川工業株式会社 出力ノイズ低減装置
EP3696972A1 (en) * 2019-02-12 2020-08-19 Mahle International GmbH Filter module for reducing differential and common mode noise and method to manufacture such a filter module
CN111490323B (zh) * 2020-05-13 2021-06-25 合肥巨一动力系统有限公司 一种集成式母线emc滤波结构

Also Published As

Publication number Publication date
ES2897005B2 (es) 2022-10-21
AT524151A3 (de) 2022-12-15
AT524151A2 (de) 2022-03-15
ES2897005A1 (es) 2022-02-28
FR3113806A1 (fr) 2022-03-04
AT17874U1 (de) 2023-05-15
DE202021103955U1 (de) 2021-08-02

Similar Documents

Publication Publication Date Title
US7944326B2 (en) EMC filter
US20050036262A1 (en) DC Voltage surge suppressor with distributed capacitance EMI filtering and impedance matching
CN112019039A (zh) 一种高等级浪涌防护高emi性能的电源接口电路
JPS61169012A (ja) ZnO過電圧誘導体の使用装置
CN108288957A (zh) 滤波器装置
CN1131589C (zh) 声频视频电负载用的交流电源滤波器
CN112186454A (zh) 具有母线组件的滤波器
CN102668292B (zh) 用于提供浪涌保护的系统和方法
CN214281344U (zh) 可堆叠emi滤波器
CN201656757U (zh) 多路输入/输出交直流电源与信号线滤波的滤波器
JP2024045152A (ja) 電気部品及び電子部品の製造方法
CN115149515A (zh) 一种低压电源供电滤波电路及电机控制器
US4918591A (en) High frequency interference suppression filter for circuits to be connected to a conductor
JPH10107571A (ja) ノイズフィルタ装置
EP3696972A1 (en) Filter module for reducing differential and common mode noise and method to manufacture such a filter module
CN104953802A (zh) 电磁兼容滤波器
CN211457097U (zh) 一种集成dc耦合电容的芯片
EP0150101A2 (en) Improvements in interference suppression for semi-conducting switching devices
JP6430482B2 (ja) 改善されたクロストーク性能を有するコネクタ及びシステム
CN111313856A (zh) 一种集成dc耦合电容的芯片
CN220896529U (zh) 防护滤波电路、防护滤波装置及车辆
US11923664B2 (en) Power line filtering at equipment rack and module levels
CA2557920A1 (en) Connectors having transient voltage suppression components and transient voltage suppression components in a connector
CN218416333U (zh) 一种可简单搭配的模块滤波器
CN220857938U (zh) 电源适配器的连接电路及电源适配器

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant
TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20220707

Address after: Building C, t20-3, No. 565, Chuangye Road, Jinqiao Export Processing Zone, Pudong New Area, Shanghai

Patentee after: SCHAFFNER ELECTROMAGNETIC COMPATIBILITY (SHANGHAI) CO.,LTD.

Address before: Swiss Lute Bach

Patentee before: Schaffner EMV AG