JP6578092B2 - ハードマスク - Google Patents

ハードマスク Download PDF

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Publication number
JP6578092B2
JP6578092B2 JP2014179115A JP2014179115A JP6578092B2 JP 6578092 B2 JP6578092 B2 JP 6578092B2 JP 2014179115 A JP2014179115 A JP 2014179115A JP 2014179115 A JP2014179115 A JP 2014179115A JP 6578092 B2 JP6578092 B2 JP 6578092B2
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JP
Japan
Prior art keywords
integer
layer
metal
organometallic compound
chromophore
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014179115A
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English (en)
Japanese (ja)
Other versions
JP2015063523A (ja
JP2015063523A5 (enExample
Inventor
シンタロウ・ヤマダ
ダヤン・ワン
サブリナ・ウォン
コン・リュウ
チェン−バイ・スー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronic Materials International LLC
Original Assignee
Rohm and Haas Electronic Materials LLC
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Publication date
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Publication of JP2015063523A publication Critical patent/JP2015063523A/ja
Publication of JP2015063523A5 publication Critical patent/JP2015063523A5/ja
Application granted granted Critical
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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/091—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G79/00—Macromolecular compounds obtained by reactions forming a linkage containing atoms other than silicon, sulfur, nitrogen, oxygen, and carbon with or without the latter elements in the main chain of the macromolecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0091—Complexes with metal-heteroatom-bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09B—ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES, e.g. PIGMENTS; MORDANTS; LAKES
    • C09B57/00—Other synthetic dyes of known constitution
    • C09B57/10—Metal complexes of organic compounds not being dyes in uncomplexed form
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09B—ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES, e.g. PIGMENTS; MORDANTS; LAKES
    • C09B69/00—Dyes not provided for by a single group of this subclass
    • C09B69/10—Polymeric dyes; Reaction products of dyes with monomers or with macromolecular compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/36—Imagewise removal not covered by groups G03F7/30 - G03F7/34, e.g. using gas streams, using plasma
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
    • H01L21/0332—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their composition, e.g. multilayer masks, materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structural Engineering (AREA)
  • Architecture (AREA)
  • Inorganic Chemistry (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2014179115A 2013-09-03 2014-09-03 ハードマスク Active JP6578092B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/017,281 US9296879B2 (en) 2013-09-03 2013-09-03 Hardmask
US14/017,281 2013-09-03

Publications (3)

Publication Number Publication Date
JP2015063523A JP2015063523A (ja) 2015-04-09
JP2015063523A5 JP2015063523A5 (enExample) 2018-12-06
JP6578092B2 true JP6578092B2 (ja) 2019-09-18

Family

ID=52583708

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014179115A Active JP6578092B2 (ja) 2013-09-03 2014-09-03 ハードマスク

Country Status (5)

Country Link
US (2) US9296879B2 (enExample)
JP (1) JP6578092B2 (enExample)
KR (1) KR102307612B1 (enExample)
CN (1) CN104635424B (enExample)
TW (1) TWI565762B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4425260A1 (en) 2023-02-28 2024-09-04 Shin-Etsu Chemical Co., Ltd. Compound for forming metal-containing film, composition for forming metal-containing film, and patterning process

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108028178A (zh) * 2015-09-29 2018-05-11 罗门哈斯电子材料有限责任公司 制备石墨碳薄片的方法
CN108055840A (zh) * 2015-09-29 2018-05-18 罗门哈斯电子材料有限责任公司 制备复合多层结构的方法
KR102082145B1 (ko) * 2015-09-29 2020-02-27 롬 앤드 하스 일렉트로닉 머트어리얼즈 엘엘씨 다층 구조체의 제조 방법
KR102513862B1 (ko) * 2018-06-01 2023-03-23 최상준 반사방지용 하드마스크 조성물
KR102287507B1 (ko) * 2018-08-16 2021-08-09 삼성에스디아이 주식회사 하드마스크 조성물 및 패턴 형성 방법
CN112584938B (zh) * 2018-08-30 2022-12-06 东京毅力科创株式会社 基板处理方法和基板处理装置
KR102400603B1 (ko) 2019-03-29 2022-05-19 삼성에스디아이 주식회사 레지스트 하층막용 조성물 및 이를 이용한 패턴 형성 방법
US20240111210A1 (en) * 2022-08-29 2024-04-04 Taiwan Semiconductor Manufacturing Company, Ltd. Photoresist and formation method thereof

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JP2002053669A (ja) * 2000-06-01 2002-02-19 Osaka Organic Chem Ind Ltd 多次元有機・無機複合体化合物およびその製造方法
US7427529B2 (en) * 2000-06-06 2008-09-23 Simon Fraser University Deposition of permanent polymer structures for OLED fabrication
US7067346B2 (en) 2000-06-06 2006-06-27 Simon Foster University Titanium carboxylate films for use in semiconductor processing
JP2004512672A (ja) * 2000-06-06 2004-04-22 イーケーシー　テクノロジー，インコーポレイティド 電子材料製造法
US6740469B2 (en) 2002-06-25 2004-05-25 Brewer Science Inc. Developer-soluble metal alkoxide coatings for microelectronic applications
US6872506B2 (en) * 2002-06-25 2005-03-29 Brewer Science Inc. Wet-developable anti-reflective compositions
US20040048194A1 (en) 2002-09-11 2004-03-11 International Business Machines Corporation Mehod for forming a tunable deep-ultraviolet dielectric antireflection layer for image transfer processing
US7172849B2 (en) * 2003-08-22 2007-02-06 International Business Machines Corporation Antireflective hardmask and uses thereof
JP2005247595A (ja) * 2004-03-01 2005-09-15 Osaka Organic Chem Ind Ltd 複合焼成体およびその製造方法
JP2005289885A (ja) * 2004-03-31 2005-10-20 Osaka Organic Chem Ind Ltd 多次元有機・無機複合体化合物、複合焼成体およびこれらの製造方法
KR100713231B1 (ko) * 2005-12-26 2007-05-02 제일모직주식회사 레지스트 하층막용 하드마스크 조성물 및 이를 이용한반도체 집적회로 디바이스의 제조방법
FR2916199B1 (fr) 2007-05-14 2012-10-19 Inst Francais Du Petrole Procede d'oligomerisation des olefines utilisant une composition catalytique comprenant un complexe organometallique contenant un ligand phenoxy fonctionnalise par un hetero-atome
JP5066471B2 (ja) 2008-03-26 2012-11-07 富士フイルム株式会社 平版印刷版原版の製版方法
JP5660268B2 (ja) 2008-09-30 2015-01-28 富士フイルム株式会社 平版印刷版原版、平版印刷版の製版方法及び重合性モノマー
JP5757749B2 (ja) 2010-05-19 2015-07-29 富士フイルム株式会社 重合性組成物
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KR101964072B1 (ko) 2011-07-20 2019-04-01 닛산 가가쿠 가부시키가이샤 티탄 및 실리콘 함유 리소그래피용 박막 형성 조성물
US9070548B2 (en) 2012-03-06 2015-06-30 Rohm And Haas Electronic Materials Llc Metal hardmask compositions
US8795774B2 (en) 2012-09-23 2014-08-05 Rohm And Haas Electronic Materials Llc Hardmask
US9136123B2 (en) 2013-01-19 2015-09-15 Rohm And Haas Electronic Materials Llc Hardmask surface treatment
US9171720B2 (en) 2013-01-19 2015-10-27 Rohm And Haas Electronic Materials Llc Hardmask surface treatment
US8927439B1 (en) 2013-07-22 2015-01-06 Rohm And Haas Electronic Materials Llc Organoaluminum materials for forming aluminum oxide layer from coating composition that contains organic solvent
US20150024522A1 (en) 2013-07-22 2015-01-22 Rohm And Haas Electronic Materials Llc Organometal materials and process

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4425260A1 (en) 2023-02-28 2024-09-04 Shin-Etsu Chemical Co., Ltd. Compound for forming metal-containing film, composition for forming metal-containing film, and patterning process

Also Published As

Publication number Publication date
KR102307612B1 (ko) 2021-10-01
JP2015063523A (ja) 2015-04-09
CN104635424B (zh) 2019-10-18
KR20150027012A (ko) 2015-03-11
US20160048077A1 (en) 2016-02-18
TWI565762B (zh) 2017-01-11
TW201520279A (zh) 2015-06-01
US9563126B2 (en) 2017-02-07
US20150064612A1 (en) 2015-03-05
US9296879B2 (en) 2016-03-29
CN104635424A (zh) 2015-05-20

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