JP6555134B2 - 電子制御ユニット、および、これを用いた電動パワーステアリング装置 - Google Patents

電子制御ユニット、および、これを用いた電動パワーステアリング装置 Download PDF

Info

Publication number
JP6555134B2
JP6555134B2 JP2016002869A JP2016002869A JP6555134B2 JP 6555134 B2 JP6555134 B2 JP 6555134B2 JP 2016002869 A JP2016002869 A JP 2016002869A JP 2016002869 A JP2016002869 A JP 2016002869A JP 6555134 B2 JP6555134 B2 JP 6555134B2
Authority
JP
Japan
Prior art keywords
heat
component
heat generating
generating component
control unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016002869A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017123440A (ja
JP2017123440A5 (enExample
Inventor
進司 柴田
進司 柴田
内田　貴之
貴之 内田
剛 田島
剛 田島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to JP2016002869A priority Critical patent/JP6555134B2/ja
Priority to PCT/JP2016/087498 priority patent/WO2017119264A1/ja
Priority to CN201680078549.XA priority patent/CN108463883B/zh
Priority to US16/067,971 priority patent/US10674639B2/en
Publication of JP2017123440A publication Critical patent/JP2017123440A/ja
Publication of JP2017123440A5 publication Critical patent/JP2017123440A5/ja
Application granted granted Critical
Publication of JP6555134B2 publication Critical patent/JP6555134B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B62—LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
    • B62D—MOTOR VEHICLES; TRAILERS
    • B62D5/00—Power-assisted or power-driven steering
    • B62D5/04—Power-assisted or power-driven steering electrical, e.g. using an electric servo-motor connected to, or forming part of, the steering gear
    • B62D5/0403—Power-assisted or power-driven steering electrical, e.g. using an electric servo-motor connected to, or forming part of, the steering gear characterised by constructional features, e.g. common housing for motor and gear box
    • B62D5/0406—Power-assisted or power-driven steering electrical, e.g. using an electric servo-motor connected to, or forming part of, the steering gear characterised by constructional features, e.g. common housing for motor and gear box including housing for electronic control unit
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B62—LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
    • B62D—MOTOR VEHICLES; TRAILERS
    • B62D5/00—Power-assisted or power-driven steering
    • B62D5/04—Power-assisted or power-driven steering electrical, e.g. using an electric servo-motor connected to, or forming part of, the steering gear
    • B62D5/0457—Power-assisted or power-driven steering electrical, e.g. using an electric servo-motor connected to, or forming part of, the steering gear characterised by control features of the drive means as such
    • B62D5/046—Controlling the motor
    • B62D5/0463—Controlling the motor calculating assisting torque from the motor based on driver input
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass H10D
    • H01L25/115—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass H10D the devices being arranged next to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Transportation (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Power Steering Mechanism (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2016002869A 2016-01-08 2016-01-08 電子制御ユニット、および、これを用いた電動パワーステアリング装置 Active JP6555134B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2016002869A JP6555134B2 (ja) 2016-01-08 2016-01-08 電子制御ユニット、および、これを用いた電動パワーステアリング装置
PCT/JP2016/087498 WO2017119264A1 (ja) 2016-01-08 2016-12-16 電子制御ユニット、および、これを用いた電動パワーステアリング装置
CN201680078549.XA CN108463883B (zh) 2016-01-08 2016-12-16 电子控制单元及使用该电子控制单元的电动助力转向装置
US16/067,971 US10674639B2 (en) 2016-01-08 2016-12-16 Electronic control unit and electric power steering device using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016002869A JP6555134B2 (ja) 2016-01-08 2016-01-08 電子制御ユニット、および、これを用いた電動パワーステアリング装置

Publications (3)

Publication Number Publication Date
JP2017123440A JP2017123440A (ja) 2017-07-13
JP2017123440A5 JP2017123440A5 (enExample) 2018-04-19
JP6555134B2 true JP6555134B2 (ja) 2019-08-07

Family

ID=59274138

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016002869A Active JP6555134B2 (ja) 2016-01-08 2016-01-08 電子制御ユニット、および、これを用いた電動パワーステアリング装置

Country Status (4)

Country Link
US (1) US10674639B2 (enExample)
JP (1) JP6555134B2 (enExample)
CN (1) CN108463883B (enExample)
WO (1) WO2017119264A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6737221B2 (ja) * 2017-04-11 2020-08-05 株式会社デンソー 電動パワーステアリング制御装置および電子ユニット。
JP6838501B2 (ja) * 2017-06-14 2021-03-03 株式会社デンソー 電子制御装置、および、これを用いた電動パワーステアリング装置
JP7007131B2 (ja) * 2017-08-09 2022-01-24 澤藤電機株式会社 回路基板装置における放熱構造
JP7172471B2 (ja) * 2018-11-09 2022-11-16 住友電装株式会社 基板構造体
JP7160012B2 (ja) * 2019-10-03 2022-10-25 株式会社デンソー 電子制御装置
TWI714479B (zh) * 2020-03-19 2020-12-21 車王電子股份有限公司 無刷馬達總成

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10322068A (ja) * 1997-05-16 1998-12-04 Nippon Electric Ind Co Ltd 発熱素子の実装方法
JP2001068879A (ja) * 1999-08-26 2001-03-16 Denso Corp 制御機器
JP2004022983A (ja) * 2002-06-19 2004-01-22 Mitsubishi Electric Corp 半導体装置
JP2006041199A (ja) * 2004-07-27 2006-02-09 Matsushita Electric Works Ltd 電子装置
JP2010245174A (ja) 2009-04-02 2010-10-28 Denso Corp 電子制御ユニット及びその製造方法
JP5110049B2 (ja) 2009-07-16 2012-12-26 株式会社デンソー 電子制御装置
JP5408502B2 (ja) * 2010-09-06 2014-02-05 株式会社デンソー 電子制御ユニット
JP2013004953A (ja) 2011-06-22 2013-01-07 Denso Corp 電子制御装置
CN102709262B (zh) * 2012-06-06 2015-09-30 华为技术有限公司 多芯片共用的散热器和设置有该散热器的电路板
JP6002473B2 (ja) * 2012-06-29 2016-10-05 日立アプライアンス株式会社 電子機器、および、パワーコンディショナ
JP5803856B2 (ja) * 2012-09-06 2015-11-04 株式会社デンソー 電子制御ユニット
JP6177510B2 (ja) * 2012-09-13 2017-08-09 株式会社デンソー 電子制御装置
JP5725055B2 (ja) * 2013-02-12 2015-05-27 株式会社デンソー 電子制御ユニット
US9142477B2 (en) * 2013-03-08 2015-09-22 Kabushiki Kaisha Toshiba Semiconductor module
US10269688B2 (en) * 2013-03-14 2019-04-23 General Electric Company Power overlay structure and method of making same
JP6278695B2 (ja) * 2013-12-26 2018-02-14 株式会社デンソー 電子制御ユニット、および、これを用いた電動パワーステアリング装置
JP5939246B2 (ja) * 2013-12-26 2016-06-22 株式会社デンソー 電子制御装置
JP6418041B2 (ja) * 2015-04-06 2018-11-07 株式会社デンソー 電子制御装置
JP6398849B2 (ja) * 2015-04-06 2018-10-03 株式会社デンソー 電子制御装置

Also Published As

Publication number Publication date
WO2017119264A1 (ja) 2017-07-13
CN108463883B (zh) 2021-12-03
JP2017123440A (ja) 2017-07-13
US20190014692A1 (en) 2019-01-10
US10674639B2 (en) 2020-06-02
CN108463883A (zh) 2018-08-28

Similar Documents

Publication Publication Date Title
JP6278695B2 (ja) 電子制御ユニット、および、これを用いた電動パワーステアリング装置
JP6555134B2 (ja) 電子制御ユニット、および、これを用いた電動パワーステアリング装置
JP5408502B2 (ja) 電子制御ユニット
JP6115465B2 (ja) 電子制御ユニット、および、これを用いた電動パワーステアリング装置
JP5967071B2 (ja) 電子制御装置、および、これを用いた電動パワーステアリング装置
JP6468036B2 (ja) 電子制御装置
WO2019116880A1 (ja) 回路構成体及び電気接続箱
JP2017123440A5 (enExample)
JP6424839B2 (ja) 電子制御ユニット、および、これを用いた電動パワーステアリング装置
JP2016197688A (ja) 電子制御装置
JP6131879B2 (ja) 電子制御ユニット、および、これを用いた電動パワーステアリング装置。
JP2017123439A5 (enExample)
KR20180060572A (ko) 방열 구조를 갖는 소자 패키지 및 그 제조방법
JP2009012631A (ja) 電動パワーステアリング装置
JP6961902B2 (ja) 部品実装体及び電子機器
JP6737221B2 (ja) 電動パワーステアリング制御装置および電子ユニット。
WO2020080248A1 (ja) 回路構造体及び電気接続箱
CN102420199B (zh) 半导体模块

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180308

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20180308

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20180814

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20181015

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20190108

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20190306

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20190611

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20190624

R151 Written notification of patent or utility model registration

Ref document number: 6555134

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250