JP6536474B2 - センサ装置 - Google Patents

センサ装置 Download PDF

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Publication number
JP6536474B2
JP6536474B2 JP2016093519A JP2016093519A JP6536474B2 JP 6536474 B2 JP6536474 B2 JP 6536474B2 JP 2016093519 A JP2016093519 A JP 2016093519A JP 2016093519 A JP2016093519 A JP 2016093519A JP 6536474 B2 JP6536474 B2 JP 6536474B2
Authority
JP
Japan
Prior art keywords
attached
flexible
flexible substrate
rigid member
sensor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2016093519A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016224037A5 (enExample
JP2016224037A (ja
Inventor
大塚　澄
澄 大塚
石川　純一
純一 石川
浩孝 黒▲崎▼
浩孝 黒▲崎▼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to DE112016002445.2T priority Critical patent/DE112016002445B4/de
Priority to PCT/JP2016/002511 priority patent/WO2016194334A1/ja
Priority to US15/559,109 priority patent/US10527498B2/en
Publication of JP2016224037A publication Critical patent/JP2016224037A/ja
Publication of JP2016224037A5 publication Critical patent/JP2016224037A5/ja
Application granted granted Critical
Publication of JP6536474B2 publication Critical patent/JP6536474B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
    • G01K1/143—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations for measuring surface temperatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/16—Special arrangements for conducting heat from the object to the sensitive element
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K2205/00—Application of thermometers in motors, e.g. of a vehicle
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
    • G01V8/00—Prospecting or detecting by optical means
    • G01V8/10—Detecting, e.g. by using light barriers
    • G01V8/12—Detecting, e.g. by using light barriers using one transmitter and one receiver
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Structure Of Printed Boards (AREA)
JP2016093519A 2015-06-01 2016-05-07 センサ装置 Expired - Fee Related JP6536474B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE112016002445.2T DE112016002445B4 (de) 2015-06-01 2016-05-24 Sensorvorrichtung
PCT/JP2016/002511 WO2016194334A1 (ja) 2015-06-01 2016-05-24 センサ装置
US15/559,109 US10527498B2 (en) 2015-06-01 2016-05-24 Sensor device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015111728 2015-06-01
JP2015111728 2015-06-01

Publications (3)

Publication Number Publication Date
JP2016224037A JP2016224037A (ja) 2016-12-28
JP2016224037A5 JP2016224037A5 (enExample) 2017-07-06
JP6536474B2 true JP6536474B2 (ja) 2019-07-03

Family

ID=57748651

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016093519A Expired - Fee Related JP6536474B2 (ja) 2015-06-01 2016-05-07 センサ装置

Country Status (3)

Country Link
US (1) US10527498B2 (enExample)
JP (1) JP6536474B2 (enExample)
DE (1) DE112016002445B4 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10212776B2 (en) * 2016-12-28 2019-02-19 Asahi Kasei Microdevices Corporation Light receiving device and light emitting and receiving device
JP2019074327A (ja) 2017-10-12 2019-05-16 株式会社オートネットワーク技術研究所 センサユニットおよび蓄電モジュール
EP3628540B1 (en) * 2018-09-25 2022-03-16 MEAS France Windshield sensing device
EP3800452B1 (en) * 2019-10-04 2021-12-15 MEAS France Temperature sensor device for a windshield of a vehicle
JP7467216B2 (ja) 2020-04-23 2024-04-15 株式会社シマノ 人力駆動車用のコンポーネント
JP7068397B2 (ja) * 2020-08-06 2022-05-16 株式会社オートネットワーク技術研究所 センサユニットおよび蓄電モジュール
JP7293453B2 (ja) * 2020-08-06 2023-06-19 株式会社オートネットワーク技術研究所 センサユニットおよび蓄電モジュール
JP7555989B2 (ja) * 2022-03-22 2024-09-25 株式会社東芝 センサモジュール、センサモジュール設置器具及びセンサモジュールの取付方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6255157U (enExample) 1985-09-27 1987-04-06
US5370459A (en) * 1993-06-08 1994-12-06 Claud S. Gordon Company Surface temperature probe with uniform thermocouple junction
JP3223716B2 (ja) * 1994-08-30 2001-10-29 三菱マテリアル株式会社 サーミスタセンサ
JP4712929B2 (ja) * 1999-09-21 2011-06-29 パナソニック株式会社 組電池の異常温度検出装置
JP2003337112A (ja) 2002-05-21 2003-11-28 Asahi Glass Co Ltd 結露センサ付き窓ガラス
JP2006258520A (ja) * 2005-03-16 2006-09-28 Ishizuka Electronics Corp 電子体温計用プローブ
DE102005016896B3 (de) * 2005-04-12 2006-10-26 Sitronic Gesellschaft für elektrotechnische Ausrüstung mbH. & Co. KG Sensoranordnung zur Temperaturmessung
DE602006008844D1 (de) 2006-07-19 2009-10-15 Sensirion Holding Ag Feuchtigkeitsfühler zur Ermittlung von Beschlag auf einem Fenster
DE102006060546B4 (de) 2006-12-21 2020-10-08 HELLA GmbH & Co. KGaA Optoelektronische Regensensoreinheit für Kraftfahrzeuge
DE102006060548B4 (de) 2006-12-21 2022-12-08 HELLA GmbH & Co. KGaA Optoelektronische Regensensoreinheit für Kraftfahrzeuge
US8496377B2 (en) * 2007-12-31 2013-07-30 Covidien Lp Thermometer having molded probe component
JP5248360B2 (ja) * 2009-02-10 2013-07-31 矢崎総業株式会社 温度検出用回路体構造
DE102011122456A1 (de) 2011-12-24 2013-06-27 Valeo Schalter Und Sensoren Gmbh Optischer Sensor mit einem integrierten Feuchtsensor
JP2014038056A (ja) * 2012-08-20 2014-02-27 Hitachi Automotive Systems Ltd 湿度検出装置
JP3184781U (ja) 2013-04-15 2013-07-18 祥 田邉 表面温度センサー
JP6083351B2 (ja) * 2013-08-06 2017-02-22 株式会社デンソー 統合センサ装置及びその製造方法、接触部材
US10113915B1 (en) * 2015-05-19 2018-10-30 Maxim Integrated Products, Inc. Non-contact temperature measurement sensor

Also Published As

Publication number Publication date
DE112016002445T5 (de) 2018-02-22
JP2016224037A (ja) 2016-12-28
US20180156670A1 (en) 2018-06-07
DE112016002445B4 (de) 2023-10-05
US10527498B2 (en) 2020-01-07

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