DE112016002445B4 - Sensorvorrichtung - Google Patents

Sensorvorrichtung Download PDF

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Publication number
DE112016002445B4
DE112016002445B4 DE112016002445.2T DE112016002445T DE112016002445B4 DE 112016002445 B4 DE112016002445 B4 DE 112016002445B4 DE 112016002445 T DE112016002445 T DE 112016002445T DE 112016002445 B4 DE112016002445 B4 DE 112016002445B4
Authority
DE
Germany
Prior art keywords
sensor device
flexible
rigid
flexible substrate
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE112016002445.2T
Other languages
German (de)
English (en)
Other versions
DE112016002445T5 (de
Inventor
Kiyoshi Otsuka
Junichi Ishikawa
Hirotaka Kurozaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority claimed from PCT/JP2016/002511 external-priority patent/WO2016194334A1/ja
Publication of DE112016002445T5 publication Critical patent/DE112016002445T5/de
Application granted granted Critical
Publication of DE112016002445B4 publication Critical patent/DE112016002445B4/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
    • G01K1/143—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations for measuring surface temperatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/16—Special arrangements for conducting heat from the object to the sensitive element
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K2205/00—Application of thermometers in motors, e.g. of a vehicle
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
    • G01V8/00—Prospecting or detecting by optical means
    • G01V8/10—Detecting, e.g. by using light barriers
    • G01V8/12—Detecting, e.g. by using light barriers using one transmitter and one receiver
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Structure Of Printed Boards (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
DE112016002445.2T 2015-06-01 2016-05-24 Sensorvorrichtung Active DE112016002445B4 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2015-111728 2015-06-01
JP2015111728 2015-06-01
JP2016-093519 2016-05-07
JP2016093519A JP6536474B2 (ja) 2015-06-01 2016-05-07 センサ装置
PCT/JP2016/002511 WO2016194334A1 (ja) 2015-06-01 2016-05-24 センサ装置

Publications (2)

Publication Number Publication Date
DE112016002445T5 DE112016002445T5 (de) 2018-02-22
DE112016002445B4 true DE112016002445B4 (de) 2023-10-05

Family

ID=57748651

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112016002445.2T Active DE112016002445B4 (de) 2015-06-01 2016-05-24 Sensorvorrichtung

Country Status (3)

Country Link
US (1) US10527498B2 (enExample)
JP (1) JP6536474B2 (enExample)
DE (1) DE112016002445B4 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10433387B2 (en) * 2016-12-28 2019-10-01 Asahi Kasei Microdevices Corporation Light emitting device and light emitting and receiving device
JP2019074327A (ja) 2017-10-12 2019-05-16 株式会社オートネットワーク技術研究所 センサユニットおよび蓄電モジュール
EP3628540B1 (en) * 2018-09-25 2022-03-16 MEAS France Windshield sensing device
EP3800452B1 (en) * 2019-10-04 2021-12-15 MEAS France Temperature sensor device for a windshield of a vehicle
JP7467216B2 (ja) 2020-04-23 2024-04-15 株式会社シマノ 人力駆動車用のコンポーネント
JP7293453B2 (ja) * 2020-08-06 2023-06-19 株式会社オートネットワーク技術研究所 センサユニットおよび蓄電モジュール
JP7068397B2 (ja) * 2020-08-06 2022-05-16 株式会社オートネットワーク技術研究所 センサユニットおよび蓄電モジュール
JP7555989B2 (ja) 2022-03-22 2024-09-25 株式会社東芝 センサモジュール、センサモジュール設置器具及びセンサモジュールの取付方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0868699A (ja) 1994-08-30 1996-03-12 Mitsubishi Materials Corp サーミスタセンサ
DE102006060546A1 (de) 2006-12-21 2008-06-26 Hella Kgaa Hueck & Co. Optoelektronische Regensensoreinheit für Kraftfahrzeuge
DE102011122456A1 (de) 2011-12-24 2013-06-27 Valeo Schalter Und Sensoren Gmbh Optischer Sensor mit einem integrierten Feuchtsensor

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6255157U (enExample) 1985-09-27 1987-04-06
US5370459A (en) * 1993-06-08 1994-12-06 Claud S. Gordon Company Surface temperature probe with uniform thermocouple junction
JP4712929B2 (ja) * 1999-09-21 2011-06-29 パナソニック株式会社 組電池の異常温度検出装置
JP2003337112A (ja) 2002-05-21 2003-11-28 Asahi Glass Co Ltd 結露センサ付き窓ガラス
JP2006258520A (ja) * 2005-03-16 2006-09-28 Ishizuka Electronics Corp 電子体温計用プローブ
DE102005016896B3 (de) * 2005-04-12 2006-10-26 Sitronic Gesellschaft für elektrotechnische Ausrüstung mbH. & Co. KG Sensoranordnung zur Temperaturmessung
EP1700724B1 (en) 2006-07-19 2009-09-02 Sensirion Holding AG Humidity detector for detecting fogging on a window
DE102006060548B4 (de) 2006-12-21 2022-12-08 HELLA GmbH & Co. KGaA Optoelektronische Regensensoreinheit für Kraftfahrzeuge
US8496377B2 (en) * 2007-12-31 2013-07-30 Covidien Lp Thermometer having molded probe component
JP5248360B2 (ja) * 2009-02-10 2013-07-31 矢崎総業株式会社 温度検出用回路体構造
JP2014038056A (ja) * 2012-08-20 2014-02-27 Hitachi Automotive Systems Ltd 湿度検出装置
JP3184781U (ja) 2013-04-15 2013-07-18 祥 田邉 表面温度センサー
JP6083351B2 (ja) * 2013-08-06 2017-02-22 株式会社デンソー 統合センサ装置及びその製造方法、接触部材
US10113915B1 (en) * 2015-05-19 2018-10-30 Maxim Integrated Products, Inc. Non-contact temperature measurement sensor

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0868699A (ja) 1994-08-30 1996-03-12 Mitsubishi Materials Corp サーミスタセンサ
DE102006060546A1 (de) 2006-12-21 2008-06-26 Hella Kgaa Hueck & Co. Optoelektronische Regensensoreinheit für Kraftfahrzeuge
DE102011122456A1 (de) 2011-12-24 2013-06-27 Valeo Schalter Und Sensoren Gmbh Optischer Sensor mit einem integrierten Feuchtsensor

Also Published As

Publication number Publication date
US20180156670A1 (en) 2018-06-07
DE112016002445T5 (de) 2018-02-22
JP2016224037A (ja) 2016-12-28
US10527498B2 (en) 2020-01-07
JP6536474B2 (ja) 2019-07-03

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R020 Patent grant now final